Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Design of Alignment Mark Stamper Module for LED Post-Processing

  • Hwang, Donghyun (Department of Precision Engineering, The University of Tokyo) ;
  • Sohn, Young W. (Department of Mechanical Engineering, Ajou University) ;
  • Seol, Tae-ho (Department of Mechanical Engineering, Ajou University) ;
  • Jeon, YongHo (Department of Mechanical Engineering, Ajou University) ;
  • Lee, Moon G. (Department of Mechanical Engineering, Ajou University)
  • Received : 2015.02.10
  • Accepted : 2015.03.30
  • Published : 2015.04.15
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Abstract

Light emitting devices (LEDs) are widely used in the liquid crystal display (LCD) industry, especially for LCD back light units. Therefore, much research has been performed to minimize manufacturing costs. However, the current process does not process LED chips from broken substrates even though the substrate is expensive sapphire wafer. This is because the broken substrates lose their alignment marks. After pre-processing, LED dies are glued onto blue tape to continue post-processing. If auxiliary alignment marks are stamped on the blue tape, post-processing can be performed using some of the LED dies from broken substrates. In this paper, a novel stamper module that can stamp the alignment mark on the blue tape is proposed, designed, and fabricated. In testing, the stamper was reliable even after a few hundred stamps. The module can position the stamp and apply the pattern effectively. By using this module, the LED industry can reduce manufacturing costs.

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References

  1. Lim, S. K., 2006, LCD Backlights and Light Sources, Proc. of Asian Symposium on Information Display (ASID), 160-163.
  2. Wang, T., Liu, Y. H., Lee, Y. B., Ao, J. P., Bai, J., Sakai, S., 2002, 1 mW AlInGaN-based Ultraviolet Light-emitting Diode with an Emission Wavelength of 348 nm Grown on Sapphire Substrate, Appl. Phys. Lett., 81:14 2508-2510. https://doi.org/10.1063/1.1510967
  3. Lin, H.-T., Shiau, G.-Y., Wang, P.-T., 1999, Alignment Pattern and Algorithm for Photolithographic Alignment Marks on Semiconductor Substrates, US Patent: 5982044.
  4. Sohn, Y. W., Jeon, Y., Cho, H. K., Lee, M. G., 2013, Design of Stamping Module to Pattern Alignment Marks for LED Post-process, Proc. of 28th Annual Meeting of American Society for Precision Engineering (ASPE), 345-346.
  5. Seol, T.-H., Jeon, Y., Lee, M. G., 2014, Design and Verification of Marking Module for LED Post-process, Proc. of the International Conference of Manufacturing Technology Engineers (ICMTE), 27.
  6. Sohn, Y. W., Jeon, Y, Seol T.-H, Lee, H.-J., Lee, M G., 2014, Design and Evaluation of Stamping Module to Pattern Alignment Marks for LED Post-Processing, Proc. of 2nd International Conference on Applied Mechanics, Materials, and Manufacturing (AMMM), 6.