Journal of Welding and Joining

  • 제33권3호
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  • Pages.32-39
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  • 2015
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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에폭시 솔더 페이스트 소재와 적용

Epoxy solder paste and its applications

  • 문종태 ((주)호전에이블) ;
  • 엄용성 (한국전자통신연구원 정보통신부품연구소) ;
  • 이종현 (서울과학기술대학교 신소재공학과)
  • Moon, Jong-Tae (Hojeonable, Inc.) ;
  • Eom, Yong-Sung (Energy Transfer Device Lab., Electronics and Telecommunications Research Institute (ETRI)) ;
  • Lee, Jong-Hyun (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
  • 투고 : 2015.06.22
  • 심사 : 2015.06.25
  • 발행 : 2015.06.30
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초록

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

키워드

참고문헌

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