Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지
DOI QR코드

DOI QR Code

Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding

플립칩 본딩용 비전도성 접착제의 속경화거동 평가기법

  • Min, Kyung-Eun (Mechanical and Materials Engineering Department, Portland State University) ;
  • Lee, Jun-Sik (Welding & Joining R&D Group/Micro-joining Center, KITECH) ;
  • Lee, So-Jeong (Welding & Joining R&D Group/Micro-joining Center, KITECH) ;
  • Yi, Sung (Mechanical and Materials Engineering Department, Portland State University) ;
  • Kim, Jun-Ki (Welding & Joining R&D Group/Micro-joining Center, KITECH)
  • 민경은 (포틀랜드주립대학교/기계공학과) ;
  • 이준식 (한국생산기술연구원 용접접합그룹/마이크로조이닝센터) ;
  • 이소정 (한국생산기술연구원 용접접합그룹/마이크로조이닝센터) ;
  • 이성 (포틀랜드주립대학교/기계공학과) ;
  • 김준기 (한국생산기술연구원 용접접합그룹/마이크로조이닝센터)
  • Received : 2015.08.26
  • Accepted : 2015.10.14
  • Published : 2015.10.01
Download PDF
⟨ Previous Next ⟩

Abstract

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

Keywords

References

  1. H. Quinones and A. Babiarz, Reliability statistics for flip chip and CSP interconnection, IMAPS Nordic, Helsinki, Finland, 1-8 (1999)
  2. P. S. Ho, G. Wang, M. Ding, J. H. Zhao and X. Dai, Reliability issues for flip-chip packages, Microelectronics Reliability, 44 (5) (2004), 19-737
  3. K. W. Paik and M. J. Yim, Anisotropic conductive film for flip chip package, Journal of the KSME, 45 (6) (2005), 57-63
  4. J. Y. Lee, M. J. Shim and S. W. Kim, Cure Kinetics of DGEBA/MDA/SN/HQ Thermosetting Matrix, 5, (1995) 667-672
  5. H. K. Kim and K. K. Char, Dielectric Changes During the Curing of Epoxy Resin Based on the Diglycidyl Ether of Bisphenol A (DGEBA) with Diamine, Journal of Bulletin of the Korean Chemical Society, 20 (11) (1999), 1329-1334
  6. H. Preu and M. Mengel, Experimental and theoretical study of a fast curing adhesive, International Journal of Adhesion and adhesive, 26 (2007), 330-337
  7. Y. He, Chemical and diffusion-controlled curing kinetics of an underfill material, Microelectronics Reliability, 45 (2005), 689-695 https://doi.org/10.1016/j.microrel.2004.08.013
  8. Y. He, DSC and DEA studies of underfill curing kinetics, Journal of Thermochimica Acta, (2001), 367-368, 101-106 https://doi.org/10.1016/S0040-6031(00)00654-7
  9. K. E. Min, J. S. Lee, S. H. Yoo, M. S. Kim, J. K. Kim, Effects of Catalysts on the adhesive properties for flip chip bonding, Korean Journal of Materials Research, 20 (12) (2010), 681-685 https://doi.org/10.3740/MRSK.2010.20.12.681
  10. S. Montserrat and I. Cima, Isothermal curing of an epoxy resin by alternating differential scanning calorimetry, Journal of Thermochimica Acta, 330 (1999), 189-200 https://doi.org/10.1016/S0040-6031(99)00033-7
  11. C. K. Chung and K. W. Paik, The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for chip-on-flex (COF) applications, Electronic Components and Technology Conference, ECTC 2009. 59th (2009), 161-167

Cited by

  1. Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste vol.12, pp.1, 2016, https://doi.org/10.1007/s13391-015-2235-1