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Microstructure Change and Mechanical Properties in Binary Ti-Al Containing Ti3Al

  • Oh, Chang-Sup (Korea Institute of Science and Technology Information, Reseat Program) ;
  • Woo, Sang-Woo (Department of Nanobiotronics, Hoseo University) ;
  • Han, Chang-Suk (Department of ICT Automotive Engineering, Hoseo University)
  • Received : 2016.07.05
  • Accepted : 2016.11.08
  • Published : 2016.12.27

Abstract

Grain morphology, phase stability and mechanical properties in binary Ti-Al alloys containing 43-52 mo1% Al have been investigated. Isothermal forging was used to control the grain sizes of these alloys in the range of 5 to $350{\mu}m$. Grain morphology and volume fraction of ${\alpha}_2$ phase were observed by optical metallography and scanning electron microscopy. Compressive properties were evaluated at room temperature, 1070 K, and 1270 K in an argon atmosphere. Work hardening is significant at room temperature, but it hardly took place at 1070 K and 1270 K because of dynamical recrystallization. The grain morphologies were determined as functions of aluminum content and processing conditions. The transus curve of ${\alpha}$ and ${\alpha}+{\gamma}$ shifted more to the aluminum-rich side than was the case in McCullough's phase diagram. Flow stress at room temperature depends strongly on the volume fraction of the ${\alpha}_2$ phase and the grain size, whereas flow stress at 1070 K is insensitive to the alloy composition or the grain size, and flow stress at 1270 K depends mainly on the grain size. The ${\alpha}_2$ phase in the alloys does not increase the proof stress at high temperatures. These observations indicate that improvement of both the proof stress at high temperature and the room temperature ductility should be achieved to obtain slightly Ti-rich TiAl base alloys.

Keywords

References

  1. T. Ren, D. Shan, Y. Chen and Y. Lu, Mater. Des., 31, 3457 (2010). https://doi.org/10.1016/j.matdes.2010.01.037
  2. A. Sankaran, E. Bouzy and J. J. Fundenberger, Intermetallics, 17, 1007 (2009). https://doi.org/10.1016/j.intermet.2009.05.001
  3. N. P. Lavery, D. J. Jarvis and D. Voss, Intermetallics, 19, 787 (2011). https://doi.org/10.1016/j.intermet.2010.11.019
  4. C. S. Han, Korean J. Mater. Res., 25, 398 (2015). https://doi.org/10.3740/MRSK.2015.25.8.398
  5. C. S. Han and S. Y. Lim, Korean J. Mater. Res., 26, 13 (2016). https://doi.org/10.3740/MRSK.2016.26.1.13
  6. C. S. Han and S. J. Jeon, J. Korean Soc. Heat Treat., 29, 51 (2016). https://doi.org/10.12656/jksht.2016.29.2.51
  7. V. N. Nadakuduru, D. L. Zhang, P. Cao, Y. L. Chiu and B. Gabbitas, Mater. Sci. Eng. A, 528, 4592 (2011). https://doi.org/10.1016/j.msea.2011.02.045
  8. B. Liu, Y. Liu, Y. P. Li, W. Zhang and A. Chiba, Intermetallics, 19, 1184 (2011). https://doi.org/10.1016/j.intermet.2011.03.021
  9. F. Appel, M. Oehring and J. D. H. Paul, Mater. Sci. Eng. A, 493, 232 (2008). https://doi.org/10.1016/j.msea.2007.08.095
  10. X. Xu, J. Lin, Y. Wang, X. Song, Z. Lin and G. Chen, Mater. Sci. Tech., 15, 709 (2007).
  11. Y. Mizuhara, K. Hashimoto and N. Masahashi, Intermetallics, 11, 807 (2003). https://doi.org/10.1016/S0966-9795(03)00080-3
  12. C. S. Han, Asian J. Chem., 28, 381 (2016). https://doi.org/10.14233/ajchem.2016.19362
  13. C. McCullough, J. J. Valencia, C. G. Levi and R. Mehrabian, Acta Metall., 37, 1321 (1989). https://doi.org/10.1016/0001-6160(89)90162-4
  14. H. Inui, K. Kishida, M. Misaki, M. Kobayashi and M. Yamaguchi, Phil. Mag. A, 72, 1609 (1995). https://doi.org/10.1080/01418619508243933
  15. V. K. Vasudevan, S. A. Court, P. Kurath and H. L. Fraser, Scripta Metall., 23, 467 (1989). https://doi.org/10.1016/0036-9748(89)90434-1
  16. M. Takeyama and C. T. Liu, J. Mater. Res., 3, 665 (1988). https://doi.org/10.1557/JMR.1988.0665

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