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Durability Analysis through the Radiation of Heat of a Laptop

노트북에서의 방열을 통한 내구성 해석에 관한 연구

  • Han, Moon-Sik (Keimyung University Mechanical andA utomotive Engineering Dept.) ;
  • Cho, Jae-Ung (Kongju National University Mechanical andAu tomotive Engineering Div.)
  • 한문식 (계명대학교 기계자동차공학과) ;
  • 조재웅 (공주대학교 기계자동차공학부)
  • Received : 2015.09.23
  • Accepted : 2015.11.05
  • Published : 2016.02.29

Abstract

This study investigates the durability of the radiator and cooler of a laptop through a thermal analysis. In the result of this study, the maximum deformation happened at the part holding up the support stand at the radiator and cooler. The maximum thermal stress of the cooler was 60.939 Mpa, as low as that of the radiator. In addition, the safety factor of the cooler was 1.64 times as high as that of the radiator. The radiator of the laptop was less durable than the cooler. The result of this study could help with designing a laptop model with a durable radiator and cooler.

Keywords

References

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