Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging

유연/신축성 전자패키징 용 폴리머 재료의 기계적 물성 측정 기술 리뷰

  • Kim, Cheolgyu (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST)) ;
  • Lee, Tae-Ik (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST)) ;
  • Kim, Taek-Soo (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
  • 김철규 (한국과학기술원 기계공학과) ;
  • 이태익 (한국과학기술원 기계공학과) ;
  • 김택수 (한국과학기술원 기계공학과)
  • Received : 2016.05.25
  • Accepted : 2016.06.07
  • Published : 2016.06.30
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Abstract

This paper presents an overview of selected advanced measurement technologies for the mechanical properties of polymers used for flexible and stretchable electronic packaging. Over the years, a variety of flexible and stretchable electronics have been developed due to their potential applications for next generation IT industry. To achieve more flexible and wearable devices for practical applications, the usage of polymeric components has been increased significantly. Therefore, accurate measurement of mechanical properties of the polymers is necessary in order to design mechanically reliable devices. However, the measurement has been challenging due to the soft nature and thin applications of polymers. Here, we describe novel measurement technologies of mechanical properties of polymers for flexible and stretchable electronics.

Keywords

References

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