Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
권호 표지
DOI QR코드

DOI QR Code

Overview on Smart Sensor Technology for Biometrics in IoT Era

사물인터넷 시대의 생체인식 스마트 센서 기술과 연구 동향

  • Kim, Kwang-Seok (Carbon & Light Materials Application Group, Korea Institute of Industrial Technology) ;
  • Kim, Dae Up (Carbon & Light Materials Application Group, Korea Institute of Industrial Technology)
  • Received : 2016.06.04
  • Accepted : 2016.06.14
  • Published : 2016.06.30
Download PDF
⟨ Previous Next ⟩

Abstract

With the pace of rapid innovation in technology of IoT (Internet of Things) and smart devices, biometric technology becomes one of the most progressive industries. Recent trends in biometrics show most are focused on embedding biometric sensors in mobile devices for user authentication. Multifactor biometrics such as fingerprint, retina, voice, etc. are considering as identification system to provide users with services more secured and convenient. Here we, therefore, demonstrate some major technologies and market trends of mobile biometric technology with its concerns and issues.

Keywords

References

  1. D. Praca and C. Barral, "From smart cards to smart objects: the road to new smart technologies", Comput. Netw., 36, 381 (2001). https://doi.org/10.1016/S1389-1286(01)00161-X
  2. X. Xia and L. O'Gorman, "Innovations in fingerprint capture devices", Pattern Recogn., 36, 361 (2003). https://doi.org/10.1016/S0031-3203(02)00036-5
  3. A. K. Jain, "Biometric recognition", Nature, 449, 38 (2007). https://doi.org/10.1038/449038a
  4. J. Zhou, G. Su, C. Jiang, Y. Deng and C. Li, "A face and fingerprint identity authentication system based on multi-route detection", Neurocomputing, 70, 922 (2007). https://doi.org/10.1016/j.neucom.2006.10.044
  5. E. P. Kukula, S. J. Ellott and V. G. Duffy, "The effects of human interaction on biometric system performance" in Digital Human Modeling, pp.904-914, Springer Berlin Heidelberg, Berlin (2007).
  6. S. Memon, M. Sepasian and W. Balachandran, "Review of finger print sensing technologies", Proc. 12th IEEE International Multitopic Conference (INMIC), Karachi, 226, IEEE International (2008).
  7. Y. Song, C. Lee and J. Kim, "A new scheme for touchless fingerprint recognition system", Proc. Intelligent Signal Processing and Communication Systems (ISPACS), Seoul, 524, IEEE Circuits and System Society (2004).
  8. H. Nankjima, K. Kobayashi, M. Morikawa, A. Katsumata, K. Ito, T. Aoki and T. Higuchi, "Fast and robust fingerprint identification algorithm and its application to residential access controller", in Advances in Biometrics, pp.326-333, Springer Berlin Heidelberg, Berlin (2006).
  9. J.-C. Liu, Y.-S. Hsiung and M. S.-C. Lu, "A CMOS micromachined capacitive sensor array for fingerprint detection", IEEE Sens. J., 12(5), 1004 (2012). https://doi.org/10.1109/JSEN.2011.2167748
  10. Y. Lu, H. Tang, S. Fung, Q. Wang, J. M. Tsai, M. Daneman, B. E. Boser and D. A. Horsley, "Ultrasonic fingerprint sensor using a piezoelectric micromachined ultrasonic transducer array integrated with complementary metal oxide semiconductor electronics", Appl. Phys. Lett., 106, 263503 (2015). https://doi.org/10.1063/1.4922915
  11. T. Nawas, S. Pervaiz, A. Korrani and A. Ud-Din, "Development of academic attendence monitoring system using fingerprint identification", International Journal of Computer Science and Network Security, 9(5), 164 (2009).
  12. M. Faundez-Zanuy and J. Fabregas, "Testing report a fingerprint-based door-opening system", IEEE Aerospace and Electronic Systems Magazine, 20(6), 18 (2005).
  13. J. M. Nam, S. M. Jung and M. K. Lee, "Design and implementation of a capacitive fingerprint sensor circuit in CMOS technology", Sensor. Actuat. A, 135, 283 (2007). https://doi.org/10.1016/j.sna.2006.07.009
  14. M. Lu, A. Bermak and Y. K. Lee, "Fabrication technology of piezoresistive conductive PDMS for micro fingerprint sensors", Proc. 20th International Conference on Micro Electro Mechanical Systems (MEMS), Hyogo, 251, IEEE Robotics and Automation Society (2007).
  15. T. Shimamura, H. Morimura, S. Shigematsu, M. Nakanishi and K. Machida, "Capacitive-sensing circuit technique for image quality improvement on fingerprint sensor LSIs", IEEE J. Solid-St. Circ., 45(5), 1080 (2010). https://doi.org/10.1109/JSSC.2010.2042525
  16. M. Tartagni and R. Guerrieri, "A fingerprint sensor based on the feedback capacitive sensing scheme", IEEE J. Solid-St. Circ., 33(1), 133 (1998). https://doi.org/10.1109/4.654945
  17. J. W. Lee, D. J. Min, J. Kim and W. Kim, "A 600-dpi capacitive fingerprint sensor chip and image-synthesis technique", IEEE, J. Solid-St. Circ., 34(4), 469 (1999). https://doi.org/10.1109/4.753679
  18. S. Shigematsu, H. Morimura, Y. Tanabe and K. Machida, "A single-chip fingerprint sensor and identifier", IEEE, J. Solid-St. Circ., 34(12), 1852 (1999). https://doi.org/10.1109/4.808910
  19. H. Morimura, S. Shigematsu and K. Machida, "A novel sensor cell architecture and sensing circuit scheme for capacitive fingerprint sensors", IEEE J. Solid-St. Circ., 35(5), 724 (2000). https://doi.org/10.1109/4.841500
  20. http://www.newswire.co.kr/newsRead.php?no=768914.
  21. http://www.ddaily.co.kr/m/m_article.html?no=43884.
  22. http://www.etnews.com/200212090200?koost=hotnews&mc=d_002_00001.
  23. W. S. Kim and W. H. Yoo, "A method for acquiring fingerprint by linear sensor" in Knowledge-Based Intelligent Information and Engineering Systems, pp.410-416, Springer Berlin Heidelberg, Berlin (2005).
  24. E. Martinelli, M. Stabile, A. Catini, R. Paolesse, A. D'amico and C. D. Natale, "An array of capacitive sensors based on a commercial fingerprint detectors", Sensor. Actuat. B, 130, 264 (2008). https://doi.org/10.1016/j.snb.2007.07.147
  25. Z. Zhou, M. Wong and L. Rufer, "The design fabrication and characterization of a piezoresistive tactic sensor for fingerprint sensing", Proc. IEEE Sensors, Kona, 2589, IEEE Sensors Council (2010).
  26. http://blog.daum.net/serapeum/7593844.
  27. D. Maltoni, D. Mario, A. K. Jain and S. Prabhakar, Handbook of Fingerprint Recognition, 2nd Ed., pp.57-59 Springer London, London (2009).
  28. http://www.etnews.com/20160501000052.
  29. http://news.zum.com/articles/25043046?c=08.
  30. J. S. Han, T. Kadowaki, K. Sato and M. Shikida, "Fabrication of thermal-isolation structure for microheater elements applicable to fingerprint sensors", Sensor. Actuat. A, 100, 114 (2002). https://doi.org/10.1016/S0924-4247(02)00136-X
  31. R. Hashido, A. Suzuki, A. Iwata, T. Okamoto, Y. Satoh and M. Inoue, "A capacitive fingerprint sensor chip using lowtemperature poly-Si TFTs on a glass substrate and a novel and unique sensing method", IEEE J. Solid-St. Circ., 38(2), 274 (2003). https://doi.org/10.1109/JSSC.2002.807172
  32. N. Sato, H. Morimura, S. Shigematsu, M. Yano, K. Kudou, T. Kamei and K. Machida, "Force-sensing scheme for small mechanical signals in complementary metal oxide semiconductor microelectromechanical system fingerprint sensor", Jpn. J. Appl. Phys., 44(9A), 6481 (2005). https://doi.org/10.1143/JJAP.44.6481
  33. N. Sato, S. Shigematsu, H. Morimura, M. Yano, K. Kudou, T. Kamei and K. Machida, "Novel surface structure and its fabrication process for MEMS fingerprint sensor", IEEE Transactions on Electron Devices, 52(5), 1026 (2005). https://doi.org/10.1109/TED.2005.846342
  34. P. Schaumont, D. Hwang and I. Verbauwhede, "Platformbased design for an embedded-fingerprint-authentication device", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 24(12), 1929 (2005). https://doi.org/10.1109/TCAD.2005.853709
  35. J. S. Han, Z. Y. Tan, K. Sato and M. Shikida, " Thermal characterization of micro heater arrays on a polyimide film substrate for fingerprint sensing applications", J. Micromech. Microeng., 15, 282 (2005). https://doi.org/10.1088/0960-1317/15/2/006
  36. Y. Audet, L. Aubray and D. Blouin, "A CMOS fingerprint sensor based on skin resistivity", Proc. IEEE North-East Workshop on Circuits and Systems (NEWCAS), Gatineau, 269, IEEE Circuits and Systems Society (2006).
  37. S. J. Lee, S. W. Kim, G. W. Kim, K. C. Bae, J. H. Yu, J. Y. Kim, H. Y. Yoo and C. H. Lee, "Electrical evaluation of wafer level fan out (WLFO) package using organic substrates for microwave applications", Proc. Electronic System-Integration Technology Conference (ESTC), Berlin, 1, IEEE Components, Packaging and Manufacturing Technology Society (2010).
  38. B. Charlot, F. Parrain, N. Galy, S. Basrour and B. Courtois, "A sweeping mode integrated fingerprinting sensor with 256 tactile microbeams", J. Microelectromech. S., 13(4), 636 (2004). https://doi.org/10.1109/JMEMS.2004.832195
  39. J. Tabei, H. Sasajima and T. Mori, "Study of epoxy molding compound for fingerprint sensor", Proc. China Semiconductor Technology International Conference (CSTIC), Shanghai, 1, IEEE Components, Packaging and Manufacturing Technology Society (2016).
  40. http://www.newswire.co.kr/newsRead.php?no=821172.