Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Reliability Assessment of Low-Power Processor Packages for Supercomputers

슈퍼컴퓨터에 사용되는 저전력 프로세서 패키지의 신뢰성 평가

  • Park, Ju-Young (Dept. of System Design and Control Engineering, Ulsan National Institute of Science and Technology) ;
  • Kwon, Daeil (Dept. of System Design and Control Engineering, Ulsan National Institute of Science and Technology) ;
  • Nam, Dukyun (Korea Institute of Science and Technology Information)
  • 박주영 (울산과학기술원 제어설계공학과) ;
  • 권대일 (울산과학기술원 제어설계공학과) ;
  • 남덕윤 (한국과학기술정보연구원 슈퍼컴퓨터개발센터 슈퍼컴퓨터SW연구실)
  • Received : 2016.03.31
  • Accepted : 2016.04.26
  • Published : 2016.06.30
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Abstract

While datacenter operation cost increases with electricity price rise, many researchers study low-power processor based supercomputers to reduce power consumption of datacenters. Reliability of low-power processors for supercomputers can be of concern since the reliability of many low-power processors are assessed based on mobile use conditions. This paper assessed the reliability of low-power processor packages based on supercomputer use conditions. Temperature cycling was determined as a critical failure cause of low-power processor packages through literature surveys and failure mode, effect and criticality analysis. The package temperature was measured at multiple processor load conditions to examine the relationship between processor load and package temperature. A physics-of-failure reliability model associated with temperature cycling predicted the expected lifetime of low-power processors to be less than 3 years. Recommendations to improve the lifetime of low-power processors were presented based on the experimental results.

전력가격의 상승으로 데이터센터의 운영비 부담이 늘어나는 가운데, 슈퍼컴퓨터에 저전력 프로세서를 사용하여 데이터센터의 전력소모를 감소시키는 연구가 활발하다. 일반적으로 모바일 기기 등의 운용환경을 기준으로 신뢰성 평가가 이루어지는 저전력 프로세서를 슈퍼컴퓨터에 사용하는 경우 상대적으로 가혹한 운용환경으로 인해 물리적, 기계적 신뢰성 문제가 발생할 수 있다. 이 논문은 슈퍼컴퓨터 운용 환경을 바탕으로 저전력 프로세서 패키지의 수명을 평가하였다. 먼저 문헌조사, 고장모드 및 치명도 분석을 통해 저전력 프로세서 패키지의 주요 고장원인으로 온도 사이클을 선정하였다. 부하-온도 관계를 확인하기 위해 단계적인 부하를 가하며 프로세서의 온도를 측정하였다. 가장 보수적인 운용조건을 가정하고 온도 사이클에 관련된 고장물리 모델을 이용한 결과 저전력 프로세서 패키지의 기대수명은 약 3년 이하로 예측되었다. 실험 결과를 바탕으로 저전력 프로세서 패키지의 기대수명을 향상하는 방법을 제시하였다.

Keywords

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