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폴리싱 고속화를 위한 연마헤드의 회전 안정성과 윤활 상태 평가

Rotational Stability and Lubrication State Evaluation of the Polishing Head for High Speed Polishing

  • Lee, Hocheol (Department of Mechanical Engineering, Hanbat National University) ;
  • Choi, Minseok (Department of Mechanical Engineering, Hanbat National University)
  • 투고 : 2016.07.20
  • 심사 : 2016.08.03
  • 발행 : 2016.08.15

초록

High speed polishing can kinematically increase the polishing removal rate by using the conventional Preston equation, especially for hard substrates such as sapphire or diamond. However, high speed effects should be clarified beforehand considering the lubrication state and process parameter variations. In this paper, we developed a polishing experimental method and apparatus to determine the lubrication state by measuring the real time friction coefficient using two load cells. Through experiments, we obtained a boundary lubrication state above 0.35 of the friction coefficient by using low table speed and high polishing load, indicating a synchronized stable behavior in polishing head rotation. However, larger Stribeck indexes by a high speed above 200 rpm can generate a hydrodynamic lubrication state below 0.25 of the low friction coefficient. This causes the polishing head rotation to stop. A forced and synchronized head rotation is required for high speed polishing.

키워드

참고문헌

  1. Peter Wolters Co., viewed 6 May.2016, LED Process Solutions, .
  2. Lee, H., Yang, M., 2001, Dwell Time Algorithm for Computer-Controlled Polishing of Small Axis-symmetrical Aspherical Lens Mold, Optical Engineering, 40:9 1936-1943. https://doi.org/10.1117/1.1396323
  3. Lee, H., Lee, C., Je, T., 2012, Micro Polishing Force Control of the Polishing Machine with the Airbag Tool, Journal of the Korean Society of Manufacturing Technology Engineers, 21:5 714-719. https://doi.org/10.7735/ksmte.2012.21.5.714
  4. Suratwala, T. I., Feit, M. D., Steele, W. A., 2010, Toward Deterministic Material Removal and Surface Figure During Fused Silica Pad Polishing, J. Am. Ceram. Soc., 93:5 1326-1340.
  5. Recht, R. F., 1960, The Feasibility of Ultra-high Speed Machining, A Thesis for a Master, University of Denver, USA.
  6. Kahles, J. F., 1978, High-speed Machining Possibilities and Needs, CIRP Annals, 27:2 551-560.
  7. Jiao, Y., 2012, Wear and Contact Phenomena in Existing and Future Large-scale Chemical Mechanical Planarization Process, A Thesis for a Doctorate, The University of Arizona, USA.
  8. Lee, H., Joo, S., Jeong, H., 2009, Mechanical Effect of Colloidal Silica in Copper Chemical Mechanical Planarization, J. Materials Processing Technology, 209:20 6134-6139. https://doi.org/10.1016/j.jmatprotec.2009.05.027
  9. Zhang, Z., Yan, W., Zhang, L., Liu, W., Song, Z., 2011, Effect of Mechanical Process Parameters on Friction Behavior and Material Removal During Sapphire Chemical Mechanical Polishing, Microelectronic Engineering, 88:9 3020-3023. https://doi.org/10.1016/j.mee.2011.04.068
  10. Kim, H. J, Kim H. Y., Jeong, H., Lee, E. S., Shin Y. J., 2002, Friction and Thermal Phenomena in Chemical Mechanical Polishing, J. Materials Processing Technology, 130 334-338.
  11. Chen, J. M., Fang, Y., 2002, Hydrodynamic Characteristics of the Thin Fluid Film in Chemical-Mechanical Polishing, IEEE Transaction on Semiconductor Manufacturing, 15:1 39-44. https://doi.org/10.1109/66.983442
  12. Tsai1, H., Huang, P., Tsai, H., Chiu, S., 2011, Chemical Mechanical Polishing in Elastic Contact and Partial Hydrodynamic Lubrication: Modeling and Experiments, Materials and Manufacturing Processes, 26:2 319-324. https://doi.org/10.1080/10426914.2010.544956
  13. Cho, C., Park, S., Ahn Y., 2001, Three-dimensional Wafer Scale Hydrodynamic Modeling for Chemical Mechanical Polishing, Thin Solid Films, 389:1-2 254-260. https://doi.org/10.1016/S0040-6090(01)00883-5
  14. Lee, H., Lee, N., Song, C., Lee, H., Shin, Y., Park, C., 2005, A Novel Polishing Head with a Gimbals-like Structure for the High-speed Polishing Process, Proceedings of the SPIE TD03, 90-92.