ETRI Journal

Electronics and Telecommunications Research Institute (한국전자통신연구원)
권호 표지
DOI QR코드

DOI QR Code

Multi-stack Technique for a Compact and Wideband EBG Structure in High-Speed Multilayer Printed Circuit Boards

  • Kim, Myunghoi (Department of Electric, Electronic and Control Engineering, Hankyong National University)
  • Received : 2015.11.19
  • Accepted : 2016.05.16
  • Published : 2016.10.01
Download PDF
⟨ Previous Next ⟩

Abstract

We propose a novel multi-stack (MS) technique for a compact and wideband electromagnetic bandgap (EBG) structure in high-speed multilayer printed circuit boards. The proposed MS technique efficiently converts planar EBG arrays into a vertical structure, thus substantially miniaturizing the EBG area and reducing the distance between the noise source and the victim. A dispersion method is presented to examine the effects of the MS technique on the stopband characteristics. Enhanced features of the proposed MS-EBG structure were experimentally verified using test vehicles. It was experimentally demonstrated that the proposed MS-EBG structure efficiently suppresses the power/ground noise over a wideband frequency range with a shorter port-to-port spacing than the unit-cell length, thus overcoming a limitation of previous EBG structures.

Keywords

References

  1. M. Swaminathan et al., "Power Distribution Networks for System-on-Package: Status and Challenges," IEEE Trans. Adv. Packag., vol. 27, no. 2, May 2004, pp. 286-300. https://doi.org/10.1109/TADVP.2004.831897
  2. J. Kim et al., "Analysis of Noise Coupling from a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards," IEEE Trans. Electromagn. Compat., vol. 48, no. 2, May 2006, pp. 319-330. https://doi.org/10.1109/TEMC.2006.873865
  3. T.-L. Wu et al., "Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology," IEICE Trans. Commun., vol. E93.B, no. 7, July 2010, pp. 1678-1689. https://doi.org/10.1587/transcom.E93.B.1678
  4. T.-L. Wu, H.-H. Chuang, and T.-K. Wang, "Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, May 2010, pp. 346-356. https://doi.org/10.1109/TEMC.2009.2039575
  5. E.-P. Li et al., "Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, May 2010, pp. 248-265. https://doi.org/10.1109/TEMC.2010.2048755
  6. R. Abhari and G.V. Eleftheriades, "Metallo-Dielectric Electromagnetic Bandgap Structures for Suppression and Isolation of the Parallel-Plate Noise in High-Speed Circuits," IEEE Trans. Microw. Theory Techn., vol. 51, no. 6, June 2003, pp. 1629-1639. https://doi.org/10.1109/TMTT.2003.812555
  7. S. Shahparnia and O.M. Ramahi, "Miniaturized Electromagnetic Bandgap Structures for Broadband Switching Noise Suppression in PCBs," Electron. Lett., vol. 41, no. 9, Apr. 2005, pp. 519-520. https://doi.org/10.1049/el:20050445
  8. M. Kwon, M. Kim, and D.G. Kam, "Optimization of a Defected Ground Structure to Improve Electromagnetic Bandgap Performance," J. Electromagn. Eng. Sci., vol. 14, no. 4, Dec. 2014, pp. 346-348. https://doi.org/10.5515/JKIEES.2014.14.4.346
  9. J. Choi et al., "Noise Isolation Inmixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN)," IEEE Trans. Adv. Packag., vol. 33, no. 1, Feb. 2010, pp. 2-12. https://doi.org/10.1109/TADVP.2009.2033705
  10. Y. Toyota et al., "Stopband Analysis Using Dispersion Diagram for Two-Dimensional Electromagnetic Bandgap Structures in Printed Circuit Boards," IEEE Microw. Wireless Compon. Lett., vol. 16, no. 12, Dec. 2006, pp. 645-647. https://doi.org/10.1109/LMWC.2006.885587
  11. T.-L. Wu, Y.-H. Lin, and S.-T. Chen, "A Novel Power Planes with Low Radiation and Broadband Suppression of Ground Bounce Noise Using Photonic Bandgap Structures," IEEE Microw. Wireless Comp. Lett., vol. 14, no. 7, July 2004, pp. 337-339. https://doi.org/10.1109/LMWC.2004.829275
  12. M. Kim et al., "Application of VSI-EBG Structure to High-Speed Differential Signals for Wideband Suppression of Common-Mode Noise," ETRI J., vol. 35, no. 5, Oct. 2013, pp. 827-837. https://doi.org/10.4218/etrij.13.0112.0875
  13. M. Kim et al., "Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs," IEEE Trans. Electromagn. Compat., vol. 55, no. 2, Apr. 2013, pp. 307-314. https://doi.org/10.1109/TEMC.2012.2216883
  14. H.-R. Zhu and J.-F. Mao, "Localized Planar EBG Structure of CSRR for Ultrawideband SSN Mitigation and Signal Integrity Improvement in Mixed-Signal Systems," IEEE Trans. Compon., Packag., Manuf. Technol., vol. 3, no. 12, 2013, pp. 2092-2100. https://doi.org/10.1109/TCPMT.2013.2272788
  15. J.H. Kwon et al., "Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing Simultaneous Switching Noise and Minimizing Effects on High Speed Signals," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, May 2010, pp. 365-372. https://doi.org/10.1109/TEMC.2010.2045894
  16. J.H. Kwon and J.G. Yook, "Partial Placement of EBG on Both Power and Ground Planes for Broadband Suppression of Simultaneous Switching Noise," IEICE Trans. Commun., vol. E92.B, no. 7, July 2009, pp. 2550-2553. https://doi.org/10.1587/transcom.E92.B.2550
  17. J.H. Kwon et al., "Partial Placement of Electromagnetic Bandgap Unit Cells to Effectively Mitigate Simultaneous Switching Noise," Electron. Lett., vol. 44, no. 22, Oct. 2008, pp. 1302-1303. https://doi.org/10.1049/el:20082079
  18. C.-L. Wang et al., "A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Bandgap-Enhanced Split Powers," IEEE Trans. Microw. Theory Techn., vol. 54, no. 12, 2006, pp. 4209-4217. https://doi.org/10.1109/TMTT.2006.886387
  19. R.E. Collin, Field Theory of Guided Waves, New York, USA: IEEE Press, 1991.

Cited by

  1. Signal integrity analysis of system interconnection module of high-density server supporting serial RapidIO vol.41, pp.5, 2016, https://doi.org/10.4218/etrij.2018-0021