Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study on Thermal Conductive Acrylic Pressure Sensitive Adhesive with Alumina and Graphite

알루미나와 흑연을 포함하는 열전도성 아크릴 점착제의 연구

  • Oh, Ji Hwan (School of Energy, Materials, Chemical Engineering, Korea University of Technology and Education, Korea University of Technology Education) ;
  • Jang, Sun Ho (School of Energy, Materials, Chemical Engineering, Korea University of Technology and Education, Korea University of Technology Education) ;
  • Yoo, Seong Sik (School of Energy, Materials, Chemical Engineering, Korea University of Technology and Education, Korea University of Technology Education) ;
  • Cho, Ryong (School of Energy, Materials, Chemical Engineering, Korea University of Technology and Education, Korea University of Technology Education)
  • 오지환 (한국기술교육대학교 에너지, 신소재, 화학공학부) ;
  • 장선호 (한국기술교육대학교 에너지, 신소재, 화학공학부) ;
  • 유성식 (한국기술교육대학교 에너지, 신소재, 화학공학부) ;
  • 조을룡 (한국기술교육대학교 에너지, 신소재, 화학공학부)
  • Received : 2017.09.14
  • Accepted : 2017.09.22
  • Published : 2017.09.30
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Abstract

2-Ethylhexyl acrylate, butyl acrylate, methyl methacrylate, and 2-hydroxyethyl methacrylate were polymerized to synthesize acrylic pressure sensitive adhesive (PSA). Alumina and graphite as a filler were added to acrylic PSA to give thermal conductivity. In case of addition of both graphite and alumina, the thermal conductivity of PSA was increased compared with alumina alone due to enhancement of contact between two fillers followed by increasing thermal path in PSA matrix.

Keywords

References

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