Journal of the Korean Society for Nondestructive Testing (비파괴검사학회지)

The Korean Society for Nondestructive Testing (한국비파괴검사학회)
권호 표지
DOI QR코드

DOI QR Code

Active Infrared Thermography for Visualizing Subsurface Micro Voids in an Epoxy Molding Compound

  • Yang, Jinyeol (Test and Package Center, Samsung Electronics) ;
  • Hwang, Soonkyu (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology) ;
  • Choi, Jaemook (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology) ;
  • Sohn, Hoon (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology)
  • Received : 2017.03.27
  • Accepted : 2017.04.22
  • Published : 2017.04.30
Download PDF
⟨ Previous Next ⟩

Abstract

This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw thermal images. Binary imaging follows to achieve better visualization of subsurface micro voids. A median filter is then applied for removing sparse noise components. The performance of the proposed technique is tested using 36 EMC samples, which have subsurface (below $150{\mu}m{\sim}300{\mu}m$ from the inspection surface) micro voids ($150{\mu}m{\sim}300{\mu}m$ in diameter). The experimental results show that the subsurface micro voids can be successfully detected without causing any damage to the EMC samples, making it suitable for automated online inspection.

Keywords

References

  1. H. Xiao, "Introduction to Semiconductor Manufacturing Technology," Washington: SPIE press in United States, (2012)
  2. M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu and S. K. Kamaruddin, "A study on the effect of epoxy molding compound (EMC) rheology during encapsulation of stacked-CHIP scale packages (S-CSP)," Journal of Reinforced Plastics and Composites, Vol. 28, pp. 2527-2538 (2009) https://doi.org/10.1177/0731684408092409
  3. A. Haleh, "Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging," IEEE Transactions on Components and Packaging Technologies, Vol. 26, pp. 206-214 (2003) https://doi.org/10.1109/TCAPT.2002.806172
  4. C. Y. Khor, M. A. Abdullah, Z. M. Ariff and W. C. Leong, "Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package," International Communications in Heat and Mass Transfer, Vol. 39, pp. 670-680 (2012) https://doi.org/10.1016/j.icheatmasstransfer.2012.03.023
  5. T. Tian, K. Chen, A. MacDowell, D. Parkinson, T. Lai and K. N. Tu, "Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints," Scripta Materialia, Vol. 65, pp. 646-649 (2011) https://doi.org/10.1016/j.scriptamat.2011.07.002
  6. M. Clark, S. Sharples and M. Somekh, "Non-contact acoustic microscopy," Measurement Science and Technology, Vol. 11, pp. 1792-1801 (2000) https://doi.org/10.1088/0957-0233/11/12/320
  7. C. Meola and M. Carlomagno, "Recent advances in the use of infrared thermography," Measurement Science and Technology, Vol. 15, R27-R58 (2004) https://doi.org/10.1088/0957-0233/15/9/R01
  8. G. Busse, D. We and W. Karpen, "Thermal wave imaging with phase sensitive modulated thermography," Journal of Applied Physics, Vol. 71, No. 8, pp. 3962-3965 (1992) https://doi.org/10.1063/1.351366
  9. W. Bai and B. S. Wong, "Evaluation of defects in composite plates under convective environments using lock-in thermography," Measurement Science and Technology, Vol. 12, pp. 142-150 (2001) https://doi.org/10.1088/0957-0233/12/2/303
  10. M. Choi, K. Kang, J. Park, W. Kim and K. Kim, "Quantitative determination of a subsurface defect of reference specimen by lock-in infrared thermography," NDT&E International, Vol. 41, pp. 119-124 (2008) https://doi.org/10.1016/j.ndteint.2007.08.006
  11. S. Dudzik, "Approximation of thermal background applied to defect detection using the methods of active thermography," Metrology and Measurement Systems, Vol. 17, pp. 621-636 (2010)
  12. M. Balu, T. Baldacchini, J. Carter, T. B. Krasieva, R. Zadoyan and B. J. Tromberg, "Effect of excitation wavelength on penetration depth in nonlinear optical microscopy of turbid media," Journal of Biomedical Optics, Vol. 14, 010508 (2009) https://doi.org/10.1117/1.3081544
  13. G. Traxler, M. Scheerer and C. Steiger, "Square pulse thermography system design considerations for detection of voids inside of the material with different properties and finite differences," Proceedings of SPIE, Vol. 5679, pp. 118-128 (2005)
  14. HL. John IV, HL. John V, "A heat transfer textbook," 4th ed. Cambridge: Phlogiston Press in United States, (2008)
  15. J. Liu, W. Yang and J. Dai, "Research on thermal wave processing of lock-in thermography based on analyzing image sequences for NDT," Infrared Physics & Technology, Vol. 53, pp. 348-357 (2010) https://doi.org/10.1016/j.infrared.2010.06.002
  16. A. Rinaldi and D. Krajcinovic, "Statistical damage mechanics and extreme value theory," International Journal of Damage Mechanics, Vol. 16, pp. 57-76 (2015)
  17. R. H. Chan, C. W. Ho, Nikolova M, "Salt-and-pepper noise removal by median-type noise detectors and detail-preserving regularization," IEEE Transaction on Image Processing, pp. 14 1479-1485 (2005) https://doi.org/10.1109/TIP.2005.852196