Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints

고온고습환경이 Sn계 무연솔더의 부식 및 기계적 특성에 미치는 영향

  • Kim, Jeonga (Department of Materials Science and Engineering, Pusan National University) ;
  • Park, Yujin (Department of Materials Science and Engineering, Pusan National University) ;
  • Oh, Chul Min (Components and Materials Physics Research Center, Korea Electronic Technology Institute) ;
  • Hong, Won Sik (Components and Materials Physics Research Center, Korea Electronic Technology Institute) ;
  • Ko, Yong-Ho (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Ahn, Sungdo (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Kang, Namhyun (Department of Materials Science and Engineering, Pusan National University)
  • 김정아 (부산대학교 재료공학과) ;
  • 박유진 (부산대학교 재료공학과) ;
  • 오철민 (전자부품연구원 시스템로버스트 연구센터) ;
  • 홍원식 (전자부품연구원 시스템로버스트 연구센터) ;
  • 고용호 (한국생산기술연구원 마이크로조이닝센터) ;
  • 안성도 (한국생산기술연구원 마이크로조이닝센터) ;
  • 강남현 (부산대학교 재료공학과)
  • Received : 2017.06.07
  • Accepted : 2017.06.28
  • Published : 2017.06.30
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Abstract

The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by three-point bending test. Both Sn-0.7Cu and SAC305 solders produced the internal $SnO_2$ oxides. Corrosion occurred between the solder and water film near flexible circuit board/copper component. For the SAC305 solder with Ag content, furthermore, octahedral corrosion products were formed near Ag3Sn. For the SAC305 and Sn-0.7Cu solders, the amount of internal oxide increased with the HAST time and the amount of internal oxides was mostly constant regardless of Ag content. The size of the internal oxide was larger for the Sn-0.7Cu solder. Despite of different size of the internal oxide, the fracture time during three-point bending test was not significantly changed. It was because the bending crack was always initiated from the three-point corner of the chip. However, the crack propagation depended on the oxides between the flexible circuit board and the Cu chip. The fracture time of the three-point bending test was dependent more on the crack initiation than on the crack propagation.

Keywords

References

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