DOI QR코드

DOI QR Code

최소 공정온도하에서 Mg-Ni의 열확산 접합에 관한 연구

A Study on the Diffusion Bonding of Mg-Ni under Low Eutectic Temperature

  • 진영준 (한국교통대학교 항공.기계설계학과)
  • 투고 : 2016.10.06
  • 심사 : 2016.12.28
  • 발행 : 2017.02.28

초록

Diffusion bonding is a technique that has the ability to join materials with minimum change in joint micro-structure and deformation of the component. The quality of the joints produced was examined by metallurgical characterization and the joint micro-structure developed across the diffusion bonding was related to changes in mechanical properties as a function of the bonding time. An increase in bonding time also resulted in an increase in the micro-hardness of the joint interface from 55 VHN to 180 VHN, The increase in hardness was attributed to the formation of intermetallic compounds which increased in concentration as bonding time increased.

키워드

참고문헌

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