Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effect of Electroplating Parameters on Conductivity and Hardness of Ni-P Alloy

Ni-P 합금의 전기전도도와 경도에 대한 도금 조건의 영향

  • Kim, Nam-Gil (Mitsuboshi Diamond Industrial Korea Co, Ltd.) ;
  • Sun, Yong-Bin (SDM Program, Graduate School of Engineering, Kyonggi University)
  • Received : 2017.09.13
  • Accepted : 2017.09.28
  • Published : 2017.09.30
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Abstract

Pulse electroplating of Ni-P alloy was studied to fulfill the material requirement to the advanced vertical probe tip in wafer probe card. The major concerns are for the electrical conductivity and yield strength. Plating parameters such as current density, duty cycle and solution components were examined to obtain the nanocrystal structure and proper percentage of phosphorus, leading to how to control the nanocrystal grain growth and precipitation of $Ni_3P$ after heat treatment. Among the parameters, the amount of phosphorus acid was the main factor affecting on the grain size and sheet resistance, and the amount of 0.1 gram was appropriate. Since hardness in Ni-P alloy is increased by as-plated nanocrystal structure plus precipitation of $Ni_3P$, the concentration of P less than 15 at% was better choice for the grain coarsening without minus in hardness value. The following heat treatment made grain growth and dispersion of precipitates adjustable to meet the target limit of resistance of $100m{\Omega}$ and hardness number of over 1000Hv. The Ni-P alloy will be a candidate for the substitute of the conventional probe tip material.

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References

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