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Effect of Feed Substrate Thickness on the Bandwidth and Radiation Characteristics of an Aperture-Coupled Microstrip Antenna with a High Permittivity Feed Substrate

  • Kim, Jae-Hyun (School of Electronic Engineering, Soongsil University) ;
  • Kim, Boo-Gyoun (School of Electronic Engineering, Soongsil University)
  • Received : 2017.12.13
  • Accepted : 2018.02.21
  • Published : 2018.04.30

Abstract

The impedance bandwidth and radiation characteristics of an aperture-coupled microstrip line-fed patch antenna (ACMPA) with a high permittivity (${\varepsilon}_r=10$) feed substrate suitable for integration with a monolithic microwave integrated circuit (MMIC) are investigated for various feed substrate thicknesses through an experiment and computer simulation. The impedance bandwidth of an ACMPA with a high permittivity feed substrate increases as the feed substrate thickness decreases. Furthermore, the front-to-back ratio of an ACMPA with a high permittivity feed substrate increases and the cross-polarization level decreases as the feed substrate thickness decreases. As the impedance bandwidth of an ACMPA with a high permittivity feed substrate increases and its radiation characteristics improve as the feed substrate thickness decreases, the ACMPA configuration becomes suitable for integration with an MMIC.

Acknowledgement

Supported by : National Research Foundation of Korea (NRF)

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