Preparation of CuO powder for electroplating using lead frame etching wastes

A novel method for manufacture of copper(II) oxide for copper electroplating solution is proposed in this paper. The copper(II) oxide was produced through two chemical reaction steps without sintering process after refinement of waste lead frame etching solution. The experimental major parameters were the amount of additives for first and second step, sodium carbonate and sodium hydroxide, respectively, to evaluate reaction characteristics. Also, the liquidity (angle of repose), solubility to sulfuric acid, chloric ion concentration and thickness of dimple thickness of plating hole were verified for the physical properties of copper(II) oxide as electroplating material. The reaction molar ratio of sodium carbonate was low, and $Cu_2CO_3$ was generated more than $Cu(OH)_2$. The optimum reaction mole ratio of sodium carbonate to copper chloride was revealed as 1.5. The optimum usage of sodium hydroxide for manufacture of copper(II) oxide using basic copper carbonate, produced at first reaction step, was 150 g. In these conditions,the average particle size of copper(II) oxide, the dissolution time for sulfuric acid, and the angle of repose were $21.49{\mu}m$, 62 s, and $35.5^{\circ}$, respectively. The yield of copper(II) oxide was 98.0 wt.%, for this optimum usage. Also, the via-filling hole thickness was $13.5{\mu}m$, which satisfies general via-filling hole thickness range, less than $15{\mu}m$.