Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study of Thermo-Mechanical Behavior and Its Simulation of Silicon Nitride Substrate on EV (Electronic Vehicle)'s Power Module

전기자동차 파워모듈용 질화규소 기판의 열기계적 특성 및 열응력 해석에 대한 연구

  • Seo, Won (Electronic Packaging Research Center, Kangnam University) ;
  • Jung, Cheong-Ha (Electronic Packaging Research Center, Kangnam University) ;
  • Ko, Jae-Woong (Korea Institute of Materials Science) ;
  • Kim, Gu-Sung (Electronic Packaging Research Center, Kangnam University)
  • 서원 (강남대학교 전자패키지연구소) ;
  • 정청하 (강남대학교 전자패키지연구소) ;
  • 고재웅 (재료연구소) ;
  • 김구성 (강남대학교 전자패키지연구소)
  • Received : 2019.12.24
  • Accepted : 2019.12.27
  • Published : 2019.12.31
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Abstract

The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.

Keywords

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