Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Stretchable Deformation-Resistance Characteristics of the Stiffness-Gradient Stretchable Electronic Packages Based on PDMS

PDMS 기반 강성도 경사형 신축 전자패키지의 신축변형-저항 특성

  • Park, Dae Ung (Department of Materials Science and Engineering, Hongik University) ;
  • Oh, Tae Sung (Department of Materials Science and Engineering, Hongik University)
  • 박대웅 (홍익대학교 공과대학 신소재공학과) ;
  • 오태성 (홍익대학교 공과대학 신소재공학과)
  • Received : 2019.11.11
  • Accepted : 2019.12.13
  • Published : 2019.12.30
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Abstract

Stiffness-gradient stretchable electronic packages of the soft PDMS/hard PDMS/PTFE structure were processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff polytetrafluoroethylene (PTFE) as the island substrate, and their stretchable deformation-resistance characteristics were characterized. The flip-chip joints, formed by bonding the chip bumps of 50 ㎛-diameter onto the PDMS/PTFE substrate pads, exhibited an average contact resistance of 96 mΩ. When the stretchable package of the soft PDMS/hard PDMS/PTFE structure was deformed to 30% elongation, the strain on the PTFE was restrained to 1%, resulting in a negligible resistance increase of 1% in the daisy-chain circuit formed on the PTFE island substrate. The circuit resistance increased for 1.7% after 2,500 cycles of 0~30% stretchable deformation.

Polydimethylsiloxane (PDMS)를 베이스 기판으로 사용하고 이보다 강성도가 높은 polytetrafluoroethylene(PTFE)를 island 기판으로 사용한 soft PDMS/hard PDMS/PTFE 구조의 강성도 경사형 신축 패키지를 형성하고, 이의 신축변형에 따른 저항특성을 분석하였다. PDMS/PTFE 기판패드에 50 ㎛ 직경의 칩 범프들을 anisotropic conductive paste를 사용하여 실장한 플립칩 접속부는 96 mΩ의 평균 접속저항을 나타내었다. Soft PDMS/hard PDMS/PTFE 구조의 신축 패키지를 30% 변형률로 인장시 PTFE의 변형률이 1%로 억제되었으며, PTFE 기판에 형성한 회로저항의 중가는 1%로 무시할 정도였다. 0~30% 범위의 신축변형 싸이클을 2,500회 반복시 회로저항이 1.7% 증가하였다.

Keywords

References

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