Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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Fabrication of Multilayered Structures in Electrochemical Etching using a Copper Protective Layer

구리 보호층을 이용한 전해에칭에서의 다층구조 제작

  • Shin, Hong-Shik (School of Mechanical, Automotive and Aeronautical Engineering, Korea National University of Transportation)
  • 신홍식 (한국교통대학교 기계자동차항공공학부)
  • Received : 2018.12.27
  • Accepted : 2019.01.05
  • Published : 2019.02.28
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Abstract

Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.

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References

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