마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제26권2호
  • /
  • Pages.51-54
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  • 2019
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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펄스도금법을 이용한 고내마모성 로듐 도금층 형성에 관한 연구

Electroplating of High Wear Resistant Rhodium using Pulse Current Plating Method

  • 이서향 (홍익대학교 신소재공학과) ;
  • 이재호 (홍익대학교 신소재공학과)
  • Lee, Seo-Hyang (Dept. of Materials Science and Engineering, Hongik University) ;
  • Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University)
  • 투고 : 2019.06.17
  • 심사 : 2019.06.27
  • 발행 : 2019.06.30
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초록

실리콘 기판상에 여러 조건의 전류밀도에서 로듐 도금을 실시하였다. 직류전원의 경우 전류밀도가 증가하면 로듐 표면에 균열이 발생하였다. 잔류응력을 낮추기 위하여 펄스전류를 인가하였다. 펄스전류의 off 시간이 도금층의 잔류응력을 낮추는데 영향을 주었다. 펄스전류의 인가 주기를 5:5로 하였을 경우 균열 없는 로듐 도금층을 얻었다.

The electrodeposition of rhodium (Rh) on silicon substrate at different current conditions were investigated. The cracks were found at high current density during the direct current (DC) plating. The pulse current (PC) plating were applied to avoid the formation of cracks on the deposits. Off time in the pulse plating relieved the residual stress of the Rh deposits and consequently the current conditions for the crack-free Rh deposits were obtained. Optimum pulse current (PC) condition is 5:5 (on:off) for the crack-free Rh electroplating.

키워드

MOKRBW_2019_v26n2_51_f0001.png 이미지

Fig. 1. Surface morphology of Rd electrodeposits at DC 10 mA/cm2 for (a) 10 min (b) 20 min.

MOKRBW_2019_v26n2_51_f0002.png 이미지

Fig. 2. Surface morphology of Rd electrodeposits at different DC current densities: (a) 1 mA/cm2 (b) 2 mA/cm2 (c) 5 mA/cm2 (d) 10 mA/cm2.

MOKRBW_2019_v26n2_51_f0003.png 이미지

Fig. 3. Galvanostatic test at different current densities.

MOKRBW_2019_v26n2_51_f0004.png 이미지

Fig. 4. Potentiodynamic plot at rhodium solution.

MOKRBW_2019_v26n2_51_f0005.png 이미지

Fig. 5. Surface morphology at different pulse durations and times. Current density was 2 mA/cm2 (a) PC 7:3 and 14 min, (b) PC 7:3 and 140 min, (c) PC 5:5 and 14 min, (d) PC 5:5 and 140 min.

MOKRBW_2019_v26n2_51_f0006.png 이미지

Fig. 6. Residual stress of electrodeposits at different pulse conditions.

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피인용 문헌

  1. 나노 잔류응력 측정을 위한 비등방 압입자의 깊이별 응력환산계수 분석 vol.26, pp.4, 2019, https://doi.org/10.6117/kmeps.2019.26.4.095