Journal of Aerospace System Engineering (항공우주시스템공학회지)

The Society for Aerospace System Engineering (항공우주시스템공학회)
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Bending Characteristics of Ag Micro Circuits using Electrohydrodynamics Printing Technology

전기수력학적 프린팅 기술을 이용한 Ag 미세회로의 굽힘 특성

  • Lee, Yong-Chan (Department of Aerospace Engineering, Chosun University) ;
  • Ahn, Ju-Hun (Department of Aerospace Engineering, Chosun University) ;
  • Lee, Chang-Yull (Department of Aerospace Engineering, Chosun University)
  • 이용찬 (조선대학교 항공우주공학과) ;
  • 안주훈 (조선대학교 항공우주공학과) ;
  • 이창열 (조선대학교 항공우주공학과)
  • Received : 2019.04.08
  • Accepted : 2019.07.31
  • Published : 2019.08.31
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Abstract

The objective of this study was to study the bending characteristics of Ag nano ink using EHD (Electrohydrodynamics) inkjet printing technology for flexibility and miniaturization of devices. The optimal conditions for the technology were derived, and bending characteristics of the Ag nano circuit obtained. For the EHD printing, it is essential to find the optimal point for each parameter such as material characteristics, density, flow rate, voltage, discharge height etc. Therefore, it was derived as the point from the working height and the applied voltage. Also, bending characteristics are confirmed by measuring resistance with each radius of curvature using a fabricated bending module. It was confirmed that rate of resistance change increases rapidly as the radius of curvature increases.

본 논문에서는 장치의 유연성과 소형화를 위해 EHD 잉크젯 프린팅 기술을 이용하여 은 나노 잉크의 굽힘 특성을 확인하였다. EHD 기술을 위한 최적조건을 도출하였고 은 나노 회로의 굽힘 특성을 파악하였다. EHD 프린팅을 위해서는 재료 특성, 밀도, 유량, 전압, 토출 높이 등 각 파라미터 별 최적점을 찾아내는 것이 필수적이므로 작동 높이와 인가 전압에 따른 각각의 최적점을 도출하였다. 또한, 제작한 굽힘 장치를 통해 각 곡률 반경 별 저항을 측정하여 굽힘 특성을 알아보았고, 곡률이 증가함에 따라, 저항변화율이 급격히 증가하는 것을 확인하였다.

Keywords

References

  1. R. W. Keyes, "Miniaturization of electronics and its limits," IBM Journal of Research and Development, vol. 32, no. 1, pp. 84-88, Jan. 1998. https://doi.org/10.1147/rd.321.0024
  2. S. H. Chang, S. O. Koo and J. W. Park, "Development of the compact integrated flight control computer," The Society for Aerospace System Engineering, vol. 2, no. 1, pp. 17-21, Mar. 2008.
  3. M. S. Kang, J. H. Hwang and J. S. Bae, "Control of focal plane compensation device for image stabilization of small satellite camera," Journal of The Society for Aerospace System Engineering, vol. 10, no. 1, pp. 86-94, Mar. 2016. https://doi.org/10.20910/JASE.2016.10.1.86
  4. J. H. Lee, J. H. Hwang, J. Y. Yang, Y. H. Joo, J. S. Bae and J. Y. Kwon, "Design of the compound smart material pump for brake system of small․ medium size UAV," Journal of The Society for Aerospace System Engineering, vol. 9, no. 3, pp. 1-7, Sep. 2015.
  5. I. T. Lee, D. W. Kim, H. Y. Lee and Y. H. Kim, "Development status of Micro Electro-Mechanical Systems (MEMS) technologies for miniaturizing satellites," Journal of the Korean Society for Aeronautical & Space Sciences, vol. 33, no. 5, pp. 106-114, May 2005. https://doi.org/10.5139/JKSAS.2005.33.5.106
  6. U. R. Baek, S. S. Kim, S. H. Kim, C. B. Park and K. Y. Choi, "Development and Validations of Air Data System using MEMS Sensor for High-Performance UAV," Journal of the Korean Society for Aeronautical & Space Sciences, vol. 36, no. 10, pp. 1017-1025, Oct. 2008. https://doi.org/10.5139/JKSAS.2008.36.10.1017
  7. J. W. Jung, J. W. Choi, D. K. Lee, J. H. Hwang and B. K. Kim, "A motor-driven focusing mechanism for small satellite," Journal of The Society for Aerospace System Engineering, vol. 12, no. 4, pp. 75-80, Sep. 2018.
  8. C. H. Je, C. A. Choi, S. Q. Lee and W. S. Yang, "MEMS Pressure Sensor Technology and Industry Trends," Electronics and Telecommunications Trends, vol. 30, no. 6, pp. 21-30, Dec. 2015.
  9. K. C. An, J. Choi, Y. J. Kim, S. Lee and S. U. Son, "High Aspect Ratio EHD Printing with High Viscosity Ink Ejection," Journal of Tech Connect Briefs, vol. 2, no. 4, pp. 267-270, June 2012.
  10. B. W. An, K. J. Kim, M. J. Kim, S. Y. Kim, S. H. Hur and J. U. Park, "Direct Printing of Reduced Graphene Oxide on Planar or Highly Curved Surfaces with High Resolutions Using Electrohydrodynamics," Small, vol. 11, no. 19, pp. 2263-2268, May 2015. https://doi.org/10.1002/smll.201403131
  11. S. Gamerith, A. Klug, H. Scheiber, F. U. Scher, E. Moderegger and E. J. W. List, "Direct ink-jet printing of Ag-Cu nanoparticle and Ag-precursor based electrodes for OFET applications," Adv. Funct. Mater., vol. 17, no. 16, pp. 3111-3118, Sep. 2007. https://doi.org/10.1002/adfm.200600762
  12. M. S. Onses, E. Sutanto, P. M. Ferreira, A. G. Alleyne and J. A. Rogers, "Mechanisms, capabilities, and applications of high-resolution electro hydro dynamic jet printing," Small vol. 11, no. 34, pp. 4237-4266, Sep. 2015. https://doi.org/10.1002/smll.201500593
  13. J. H. Ahn, Y. C. Lee, D. S. Choi and C. Y. Lee, "Effect of Conductive Particles on Electrical Conductivity using EHD Ink Jet Printing Technology," Journal of Aerospace System Engineering, vol. 12, no. 6, pp. 1-8, Nov. 2018. https://doi.org/10.20910/JASE.2018.12.6.1
  14. K. Y. Kim and C. Y. Lee, "Mechanism of Micro Crack Sensor Using Electrohydrodynamic Printing," Journal of Advanced Engineering and Technology, vol. 12, no. 2, pp. 55-60, June 2019. https://doi.org/10.35272/jaet.2019.12.2.55
  15. J. Y. Choi, Y. J. Kim, S. U. Son, K. C. An, H. S. Ko and S. H. Lee., "Evaluation of contact resistance between carbon fiber/epoxy composite laminate and printed silver electrode for damage monitoring". Journal of Korean Society for Nondestructive Testing, vol. 34, no. 5, pp. 377-383, Oct. 2014. https://doi.org/10.7779/JKSNT.2014.34.5.377
  16. S. I. Park, J. H. Ahn, X. Feng, S. Wang, Y. Huang and J. A. Rogers, "Theoretical and Experimental studies of bending of inorganic electronic materials on plastic substrates," Adv. Funct. Mater., vol. 18, no. 24, pp. 2673-2684, Nov. 2015.