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Development of Selective GaN etching Process for p-GaN/AlGaN/GaN E-mode FET Fabrication

p-GaN/AlGaN/GaN E-mode FET 제작을 위한 선택적 GaN 식각 공정 개발

  • Jang, Won-Ho (School of Electronic and Electrical Engineering, Hongik University) ;
  • Cha, Ho-Young (School of Electronic and Electrical Engineering, Hongik University)
  • Received : 2019.12.17
  • Accepted : 2020.01.15
  • Published : 2020.02.29

Abstract

In this work, we developed a selective etching process for GaN that is a key process in p-GaN/AlGaN/GaN enhancement-mode (E-mode) power switching field-effect transistor (FET) fabrication. In order to achieve a high current density of p-GaN/AlGaN/GaN E-mode FET, the p-GaN layer beside the gate region must be selectively etched whereas the underneath AlGaN layer should be maintained. A selective etching process was implemented by oxidizing the surface of the AlGaN layer and the GaN layer by adding O2 gas to Cl2/N2 gas which is generally used for GaN etching. A selective etching process was optimized using Cl2/N2/O2 gas mixture and a high selectivity of 53:1 (= GaN/AlGaN) was achieved.

Keywords

References

  1. K. J. Chen, O. Haberlen, A. Lidow, C. L. Tsai, T. Ueda, Y. Uemoto, and Y. Wu, "GaN-on-Si Power Technology: Devices and Applications," IEEE Transactions on electron devices, vol. 64, no.3, pp. 779-795, Mar. 2017. https://doi.org/10.1109/TED.2017.2657579
  2. J. Millan, P. Godignon, X. Perpina, A. P. Tomas, and J. Rebollo, "A Survey of Wide Bandgap Power Semiconductor Devices," IEEE Transactions on Power Electronics, vol. 29, no.5, pp. 2155-2162, May. 2014. https://doi.org/10.1109/TPEL.2013.2268900
  3. E. A. Douglas, C. A. Sanchez, R. J. Kaplar, A. A. Allerman, and A. G. Baca, "Inductively coupled BCl3/Cl2/Ar plasma etching of Al-rich AlGaN," Journal of Vacuum Science & Technology A, vol. 35, p. 021305, Dec. 2017. https://doi.org/10.1116/1.4971245
  4. Y. Zhong, Y. Zhou, H. GaO, S. Dai, J. He, M. Feng, Q. Sun, J. Zhang, Y. Zhao, A. DingSun, and H. Yang, "Self-terminated etching of GaN with a high selectivity over AlGaN under inductively coupled Cl2/N2/O2 plasma with a low-energy ion bombardment," Applied surface science, vol. 420, pp. 817-824, May. 2017. https://doi.org/10.1016/j.apsusc.2017.05.185
  5. Y. J. Han, S. Xue, W. P. Guo, C. Z. Sun, Z. B. Hao, and Y. Luo, "Highly Selective Dry Etching of GaN over AlGaN Using Inductively Coupled Cl2/N2/O2 Plasmas," Japanese Journal of Applied Physics, vol. 42, pp. 1139-1141, Oct. 2003. https://doi.org/10.1143/JJAP.42.1139
  6. S. J. Pearton, R. J. Shul, and F. Ren, "A Review of Dry Etching of GaN and Related Materials," MRS Internet Journal Nitride Semiconductor Research, vol. 5, no. 11, Nov. 2000.
  7. K. Zhu, V. Kuryatkov, B. Borisov, G. Kipshidze, S. A. Nikishin, and H. Temkin, "Plasma etching of AlN/AlGaInN superlattices for device fabrication," Applied Physics Letters, vol. 81, no. 25, Dec. 2002.