Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Recent Technology Trends and Future Prospects for Image Sensor

이미지 센서의 최근 기술 동향과 향후 전망

  • Park, Sangsik (Department of Electronic Engineering Sejong University) ;
  • Shin, Bhumjae (Department of Electronic Engineering Sejong University) ;
  • Uh, Hyungsoo (Department of Electronic Engineering Sejong University)
  • 박상식 (세종대학교 전자정보통신공학과) ;
  • 신범재 (세종대학교 전자정보통신공학과) ;
  • 우형수 (세종대학교 전자정보통신공학과)
  • Received : 2020.04.29
  • Accepted : 2020.06.25
  • Published : 2020.06.30
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Abstract

The technology and market size of image sensors continue to develop thanks to the release of image sensors that exceed 100 million pixels in 2019 and expansion of black box camera markets for vehicles in addition to existing mobile applications. We review the technology flow of image sensors that have been constantly evolving for 40 years since Hitachi launched a 200,000-pixel image sensor in 1979. Although CCD has made inroads into image sensor market for a while based on good picture quality, CMOS image sensor (CIS) with active pixels has made inroads into the market as semiconductor technology continues to develop, since the electrons generated by the incident light are converted to the electric signals in the pixel, and the power consumption is low. CIS image sensors with superior characteristics such as high resolution, high sensitivity, low power consumption, low noise and vivid color continue to be released as the new technologies are incorporated. At present, new types of structures such as Backside Illumination and Isolation Cell have been adopted, with better sensitivity and high S/N ratio. In the future, new photoconductive materials are expected to be adopted as a light absorption part in place of the pn junction.

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