마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제27권2호
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  • Pages.53-58
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  • 2020
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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토픽모델을 이용한 전력반도체 패키징 기술 동향 연구

A Study on Technology Trend of Power Semiconductor Packaging using Topic model

  • 박근서 (한양대학교 기술경영전문대학원) ;
  • 최경현 (한양대학교 기술경영전문대학원)
  • Park, Keunseo (Graduate School of Technology of Innovation Management, Hanyang University) ;
  • Choi, Gyunghyun (Graduate School of Technology of Innovation Management, Hanyang University)
  • 투고 : 2020.06.17
  • 심사 : 2020.06.30
  • 발행 : 2020.06.30
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초록

전기자동차용 전력반도체 패키징 기술에 대한 분석을 수행하였다. 비정형 데이터인 특허들을 수집하여 유효특허를 도출하여 LDA 기법을 적용한 토픽모델링을 수행하였다. 20개의 토픽으로 분류하였고 각 토픽별 추출된 단어를 통해 기술에 대한 정의를 내렸다. 각 토픽의 대한 동향분석을 위해 연도별 빈도수에 대한 회귀분석을 통해 토픽별 Hot토픽과 Cold 토픽을 도출하여 전력반도체 패키징 기술의 동향을 분석하였다. Hot 토픽의 기술로는 내전압에 따른 패키지 구조 기술과 입출력 관련 제어 기술, 방열기술을 도출하였고 Cold 토픽 기술로는 인덕턴스 저감기술이 도출되었다.

Analysis of electric semiconductor packaging technology for electric vehicles was performed. Topic modeling using LDA technique was performed by collecting valid patents by deriving valid patents. It was classified into 20 topics, and the definition of technology was defined through extracted words for each topic. In order to analyze the trend of each topic, the trend of power semiconductor packaging technology was analyzed by deriving hot and cold topics by topic through regression analysis on frequency by year. The package structure technology according to the withstand voltage, the input/output-related control technology and the heat dissipation technology were derived as the hot topic technology, and the inductance reduction technology was derived as the cold topic technology.

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참고문헌

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피인용 문헌

  1. 열처리 공정을 이용한 Si-doped β-Ga2O3 박막의 전기적 특성의 이해 vol.27, pp.4, 2020, https://doi.org/10.6117/kmeps.2020.27.4.019