References
- L. Bosse, A. Schildecker, A. Gillner, and R. Poprawe, "High quality laser beam soldering", Microsyst. Technol., 7, 215 (2002). https://doi.org/10.1007/s005420100111
- A. Gillner, J. Holtkamp, C. Hartmann, A. Olowinsky, J. Gedicke, K. Klages, L. Bosse, and A. Bayer, "Laser applications in microtechnology", J. Mater. Processing Technology, 167, 494 (2005). https://doi.org/10.1016/j.jmatprotec.2005.05.049
- A. Bayer, A. Gillner, P. Groche, and R. Erhardt, "Laser-assisted forming of metallic micro-parts", Proc. 4th International Symposium on Laser Precision Microfabrication (SPIE), 5063, 157 (2003).
- H. Flandorfer, U. Saeed, C. Luef, A. Sabbar, and H. Ipser, "Interfaces in lead-free solder alloys: enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds", Thermochim. Acta., 459, 34 (2007). https://doi.org/10.1016/j.tca.2007.04.004
- M. Benton, M. R. Hossan, P. R. Konari, and S. Gamagedara, "Effect of process parameters and material properties on laser micromachining of microchannels", Micromachines-Basel, 10, 123 (2019). https://doi.org/10.3390/mi10020123
- B. Sundman, U.R. Kattner, C. Sigli, M. Stratmann, R. Le Tellier, M. Palumbo, and S. G. Fries, "The OpenCalphad thermodynamic software interface", Comput. Mater. Sci., 125, 188 (2016). https://doi.org/10.1016/j.commatsci.2016.08.045
- F. Caiazzo and V. Alfieri, "Simulation of Laser-assisted Directed Energy Deposition of Aluminum Powder: Prediction of Geometry and Temperature Evolution", Materials, 11, 2100 (2018). https://doi.org/10.3390/ma11112100
- D. Chattaraj, R. A. Jat, S. C. Parida, R. Agarwal, and S. Dash, "High temperature enthalpy increments and thermodynamic functions of ZrCo: An experimental and theoretical study", Thermochim. Acta., 614, 16 (2015). https://doi.org/10.1016/j.tca.2015.05.024
- J. W. Xian, S. A. Belyakov, M. Ollivier, K. Nogita, H. Yasuda, and C. M. Gourlay, "Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections", Acta Mater., 126, 540 (2017). https://doi.org/10.1016/j.actamat.2016.12.043
- A. Kunwar, H. Ma, H. Ma, B. Guo, Z. Meng, N. Zhao, and M. Huang, "On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration", J. Mater. Sci. Mater. El., 27, 7699 (2016). https://doi.org/10.1007/s10854-016-4756-2
- M. Y. Xiong and L. Zhang, "Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging", J. Mater. Sci., 54, 1741 (2019). https://doi.org/10.1007/s10853-018-2907-y
- Y. H. Tian and C. Q. Wang, "Microjoining and Nanojoining", pp.299-326, Woodhead Publishing, Cambridge, UK (2008).
- H. Nishikawa and N. Iwata, "Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad", J. Mater. Process. Technol., 215, 6 (2015). https://doi.org/10.1016/j.jmatprotec.2014.08.007
- H. Nishikawa and N. Iwata, "Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process", Mater. Trans., 56, 1025 (2015). https://doi.org/10.2320/matertrans.MI201421
- N. T. Jaya, S. R. A. Idris, and M. Ishak, "The Advances in Joining Technology", pp.97-107, Springer, Berlin, Germany (2019).
- T. J. Nabila, S. R. A. Idris, and M. Ishak, "Effect of fiberlasers parameters on interfacial reaction and wetting angle of two different types of SAC305 solder fabrication on Cu pad", IOP Conference Series: Materials Science and Engineering, Pahang, Malaysia, 012117 (2019).
- C. A. Walsh, "Laser welding - Literature Review", pp.1-21, Materials Science and Metallurgy Department, University of Cambridge, England, July (2002).
- P. W. Fuerschbach, "Measurement and prediction of energy transfer efficiency in laser beam welding", Weld. J., 75(1), 24 (1996).
- J. Bian, L. Zhou, X. Wan, C. Zhu, B. Yang, and Y. A. Huang, "Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics", Adv. Electron. Mater., 5, 1800900 (2019). https://doi.org/10.1002/aelm.201800900
- K. J. Kim, "Principle and application of laser", pp.25-53, Daeyoung, Seoul, Korea (1997).
- J. P. Jung, "A Study on the Solderability of QFP Outer Lead Using Nd:YAG Laser", Metals and Materials, 5(3), 317 (1999). https://doi.org/10.1007/BF03026085
- A. Olowinsky, K. Klages, and J. Gedicke, "SHADOW(R) a new welding technique: basics and applications", Proc. 15th International Symposium on Laser Precision Microfabrication (SPIE), 5662, 291 (2004).
- MICRO-WELDING, Laser Dynamics, from https://www.laserdynamics-usa.com/micro-welding
- M. Calif, "Laser Micro Welding of Conductive Materials", Industrial Laser Solutions (2011) from https://www.industriallasers.com/welding/article/16487468/laser-micro-welding-ofconductive-materials
- K. A. Jackson, "Current concepts in crystal growth from the melt", Prog. Solid State Chem., 4, 53 (1967). https://doi.org/10.1016/0079-6786(67)90005-2
-
G. Li, J. Huang, and Y. Wu, "An investigation on microstructure and properties of dissimilar welded Inconel 625 and SUS 304 using high-power CO
$_2$ laser", Int. J. Adv. Manuf. Tech., 76(5-8), 1203 (2015). https://doi.org/10.1007/s00170-014-6349-7 - J. J. Pablo, N. E. Jackson, M. A. Webb, L. Q. Chen, J. E. Moore, D. Morgan, R. Jacobs, T. Pollock, D. G. Schlom, E. S. Toberer, J. Analytis, I. Dabo, D. M. DeLongchamp, G. A. Fiete, G. M. Grason, G. Hautier, Y. Mo, K. Rajan, E. J. Reed, E. Rodriguez, V. Stevanovic, J. Suntivich, K. Thornton, and J. C. Zhao, "New frontiers for the materials genome initiative", NPJ Comput. Mater., 5, 41 (2019). https://doi.org/10.1038/s41524-019-0173-4
- J. Wang, A. Y. Nobakht, J. D. Blanks, D. Shin, S. Lee, A. Shyam, H. Rezayat, and S. Shin, "Machine learning for thermal transport analysis of aluminum alloys with precipitate morphology", Adv. Theory. Simul., 2, 1800196 (2019). https://doi.org/10.1002/adts.201800196
- A. Kunwar, S. Shang, P. Råback, Y. Wang, J. Givernaud, J. Chen, H. Ma, X. Song, and N. Zhao, "Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints", Microelectron. Reliab., 80, 55 (2018). https://doi.org/10.1016/j.microrel.2017.11.016
- "Lasers", Photonics. Inc. from https://www.coherent.com/assets/pdf/Lasers___Photonics_Handbook.pdf
- Vector, "Fundamentals of laser welding" Ee Publishers, (Nov. 19, 2014) from https://www.ee.co.za/article/fundamentals-laserwelding.html
- S. Lee, J. Peng, D. Shin, and Y. S. Choi, "Data analytics approach for melt-pool geometries in metal additive manufacturing", Sci. Technol. Adv. Mater., 20, 972 (2019). https://doi.org/10.1080/14686996.2019.1671140
- S. Wen, K. Chen, W. Li, Y. Zhou, Q. Wei, and Y. Shi, "Selective laser melting of reduced graphene oxide/S136 metal matrix composites with tailored microstructures and mechanical properties", Mater. Des., 175, 107811 (2019). https://doi.org/10.1016/j.matdes.2019.107811
- H. Lee, C. H. J. Lim, M. J. Low, N. Tham, V. M. Murukeshan, and Y. J. Kim, "Lasers in additive manufacturing: A review", Int. J. Precis. Eng. Manuf.-Green Technol., 4, 307 (2017). https://doi.org/10.1007/s40684-017-0037-7
- T. Hurtony, B. Balogh, and P. Gordon, "Formation and Distribution of Sn-Cu IMC in Lead-Free Soldering Process Induced by Laser Heating", Micro Nanosystems, 2, 178 (2010). https://doi.org/10.2174/1876402911002030178
- W. K. Choi, S. Y. Jang, J. H. Kim, K. W. Paik, and H. M. Lee, "Grain morphology of intermetallic compounds at solder joints", J. Mater. Res., 17, 597 (2002). https://doi.org/10.1557/JMR.2002.0084
- E. Fereiduni, A. Ghasemi, and M. Elbestawi, "Selective laser melting of hybrid ex-situ/in-situ reinforced titanium matrix composites: Laser/powder interaction, reinforcement formation mechanism, and non-equilibrium microstructural evolutions", Mater. Des., 184, 108185 (2019). https://doi.org/10.1016/j.matdes.2019.108185
- T. Yoshida, S. Takeyama, Y. Yamada, and K. Mutoh, "Nanometer-sized silicon crystallites prepared by excimer laser ablation in constant pressure inert gas", Appl. Phys. Lett., 68(13), 1772 (1996). https://doi.org/10.1063/1.116662
- S, M. Hong, C. S. Kang, and J. P. Jung, "Plasma Reflow Bumping of Sn-3.5 Ag Solder for Flux-Free Flip Chip Package Application", IEEE Transactions on Advanced Packaging, 27(1), 90 (2004). https://doi.org/10.1109/TADVP.2003.821079
- J. O. Kim, "Research on Laser Soldering Process and Solder Bump Characteristics", in Ph.D. Thesis, pp.11-97, University of Seoul, Seoul, Korea (2009).
- S. C. Kwang, J. H. Joo, K. S. Jang, G. M. Choi, H. G. Yun, S. H. Moon, and Y. S. Eom, "Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications", Journal of Welding and Joining, 38(2), 138 (2020).
- H. Lee, Y. S. Eom, H. C. Bae, K. S. Choi, and J. H. Lee, "Characterization and Estimation of Solder-on- Pad Process for Fine-Pitch Applications", Proc. IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT), 4(10), 1729 (2014).
- K. S. Choi, Y. S. Eom, S. H. Moon, J. Joo, L. I. Jeong, K. Lee, J. H. Kim, H. H. Kim, G. S. Yoon, K. H. Lee, C. H. Lee, G. S. Ahn, and M. S. Shim, "Enhanced Performance of Laser- Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology", Proc. 69th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, 197, IEEE (2019).
- S. Katayama, R. Usui, and A. Matsunawa, "Nanomaterials: Synthesis, Properties and Applications", pp.467-472, Taylor & Francis Group, New York, London (1998).
- M. Pastor, H. Zhao, and T. DebRoy, "Pore formation and composition change during continuous wave Nd: YAG laser welding of aluminum alloys 5182 and 5754", Trends in Welding Research: Proceedings of the 5th International Conference, Pine Mountain, GA, USA, 455 (1998).
- Y. Tzeng, "Parametric analysis of the pulsed Nd:YAG laser seam-welding process", J. Mater., 102, 40 (2000).
- J. O. Kim, J. P. Jung, J. H. Lee, J. Suh, and H. S. Kang,"Effects of Laser Parameters on the Characteristics of a Sn-3.5 wt.%Ag Solder Joint", Met. Mater. Int., 15(1), 119 (2009). https://doi.org/10.1007/s12540-009-0119-3
- C. S. Song, H. S. Ji, J. H. Kim, J. H. Kim, and H. S. Ahn, "A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods", KWJS, 26(3), 244 (2008).
- L. H. J. F. Beckmann, D. Ehrlichmann, "Optical systems for high-power laser applications: principles and design aspects", Opt. Quant. Electron., 27(12), 1407 (1995). https://doi.org/10.1007/BF00326492
- J. C. Ion, "Modeling of laser material processing in The Industrial Laser Handbook", pp.39-47, Springer-Verlog, New York, USA (1992).