Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Effects of Mg-Al Alloy and Pure Ti on High Temperature Wetting and Coherency on Al Interface Using the Sessile Drop Method

정적법을 이용한 Mg-Al계 합금과 순수 Ti의 고온 젖음현상 및 Al계면에서의 정합성에 미치는 영향

  • Han, Chang-Suk (Dept. of ICT Automotive Engineering, Hoseo University) ;
  • Kim, Woo-Suk (Dept. of ICT Automotive Engineering, Hoseo University)
  • 한창석 (호서대학교 자동차ICT공학과) ;
  • 김우석 (호서대학교 자동차ICT공학과)
  • Received : 2020.11.27
  • Accepted : 2020.12.24
  • Published : 2021.01.27
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Abstract

In this study, high temperature wetting analysis and AZ80/Ti interfacial structure observation are performed for the mixture of AZ80 and Ti, and the effect of Al on wetting in Mg alloy is examined. Both molten AZ80 and pure Mg have excellent wettability because the wet angle between molten droplets and the Ti substrate is about 10° from initial contact. Wetting angle decreases with time, and wetting phenomenon continues between droplets and substrate; the change in wetting angle does not show a significant difference when comparing AZ80-Ti and Mg-Ti. As a result of XRD of the lower surface of the AZ80-Ti sample, in addition to the Ti peak of the substrate, the peak of TiAl3, which is a Ti-Al intermetallic compound, is confirmed, and TiAl3 is generated in the Al enrichment region of the Ti substrate surface. EDS analysis is performed on the droplet tip portion of the sample section in which pure Mg droplets are dropped on the Ti substrate. Concentration of oxygen by the natural oxide film is not confirmed on the Ti surface, but oxygen is distributed at the tip of the droplet on the Mg side. Molten AZ80 and Ti-based compound phases are produced by thickening of Al in the vicinity of Ti after wetting is completed, and Al in the Mg alloy does not affect the wetting. The driving force of wetting progression is a thermite reaction that occurs between Mg and TiO2, and then Al in AZ80 thickens on the Ti substrate interface to form an intermetallic compound.

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References

  1. On the Web. Retrieved January 21, 2021 from https://standard.go.kr/KSCI.
  2. B. Jiang, W. Liu, S. Chen, Q. Yang and F. Pan, Mater. Sci. Eng., A, 530, 51 (2011). https://doi.org/10.1016/j.msea.2011.09.036
  3. X. Zhang, H. Wang, L. Liao, X. Teng and N. Ma, Mater. Lett., 59, 2105 (2005). https://doi.org/10.1016/j.matlet.2005.02.020
  4. C. S. Goh, J. Wei, L. C. Lee and M. Gupta, Mater. Sci. Eng., A, 423, 153 (2006). https://doi.org/10.1016/j.msea.2005.10.071
  5. S. Wenner, J. Friis, C. D. Marioara and R. Holmestad, J. Alloys Compd., 684, 195 (2016). https://doi.org/10.1016/j.jallcom.2016.05.132
  6. B. Rinderer, M. Couper, X. Y. Xiong, S. X. Gao and J. F. Nie, Mater. Sci. Forum, 654/656, 590 (2010). https://doi.org/10.4028/www.scientific.net/MSF.654-656.590
  7. A. Deschamps, C. Sigli, T. Mourey, F. de Geuser, W. Lefebvre and B. Davo, Acta Mater., 60, 1917 (2012). https://doi.org/10.1016/j.actamat.2012.01.010
  8. Z. M. Zhao, L. Zhang, S. J. Wang and M. Q. Wang, Adv. Mater. Res., 833, 136 (2013). https://doi.org/10.4028/www.scientific.net/AMR.833.136
  9. G. Zhang, J. Cai, B. Chen and T. Xu, Mater. Des., 110, 53 (2016).
  10. Y. C. Lei, H. L. Xue, W. X. Hu and J. C. Yan, Trans. Nonferrous Met. Soc. China, 22, 305 (2012). https://doi.org/10.1016/S1003-6326(11)61175-8
  11. Z. F. Yuan, K. Mukai, K. Takagi, M. Ohtaka, W. L. Huang and Q. S. Liu, J. Colloid Interface Sci., 254, 338 (2002). https://doi.org/10.1006/jcis.2002.8589
  12. D. Zhang, P. Shen, L. Shi and Q. Jiang, Mater. Chem. Phys., 130, 665 (2011). https://doi.org/10.1016/j.matchemphys.2011.07.040
  13. T. Ohnishi, H. Harada, S. Kume, H. Nakagawa, K. Miyatake and K. Miyanami, J. Jpn. Inst. Light Metals, 51, 188 (2001). https://doi.org/10.2464/jilm.51.188
  14. H. J. T. Ellingham, J. Soc. Chem. Ind., 63, 125 (1994). https://doi.org/10.1002/jctb.5000630501