CFD Study for the Design of Coolant Path in Cryogenic Etch Chuck

  • Jo, Soo Hyun (Department of Mechanical Engineering, Myongji University) ;
  • Han, Ji Hee (Department of Industrial Management Engineering, Myongji University) ;
  • Kim, Jong Oh (Department of Mechanical Engineering, Myongji University) ;
  • Han, Hwi (Department of Mechanical Engineering, Myongji University) ;
  • Hong, Sang Jeen (Department of Electronics Engineering, Myongji University, LINC+ Semiconductor Equipment Engineering Program, Myongji University)
  • Received : 2021.04.30
  • Accepted : 2021.06.21
  • Published : 2021.06.30

Abstract

The importance of processes in cryogenic environments is increasing in a way to address problems such as critical dimension (CD) narrow and bottlenecks in micro-processing. Accordingly, in this paper, we proceed with the design and analysis of Electrostatic Chuck(ESC) and Coolant in cryogenic environments, and present optimal model conditions to provide the temperature distribution analysis of ESC in these environments and the appropriate optimal design. The wafer temperature uniformity was selected as the reference model that the operating conditions of the refrigerant of the liquid nitrogen in the doubled aluminum path were excellent. Design of simulation (DOS) was carried out based on the wheel settings within the selected reference model and the classification of three mass flow and diameter case, respectively. The comparison between factors with p-value less than 0.05 indicates that the optimal design point is when five turns of coolant have a flow rate of 0.3 kg/s and a diameter of 12 mm. ANOVA determines the interactions between the above factor, indicating that mass flow is the most significant among the parameters of interests. In variable selection procedure, Case 2 was also determined to be superior through the two-Sample T-Test of the mean and variance values by dividing five coolant wheels into two (Case 1 : 2+3, Case 2: 3+2). Finally, heat transfer analysis processes such as final difference method (FDM) and heat transfer were also performed to demonstrate the feasibility and adequacy of the analysis process.

Keywords

Acknowledgement

This work was supported by Korean Ministry of Education via LINC+ Semiconductor Equipment Engineering Program as a partial fulfillment of the Senior Capstone Design Project.

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