Design & Manufacturing

  • 제17권4호
  • /
  • Pages.52-56
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  • 2023
  • /
  • 2800-0323(pISSN)
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  • 2733-452X(eISSN)
한국금형공학회 (Korean Society of Die & Mold Engineering)
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시뮬레이션을 통한 열성형에서의 필름 평균두께 계산

Calculation of Average Thickness of film in Thermoforming by Simulation

  • 이순영 (서울과학기술대학교 기계시스템디자인공학과) ;
  • 김선경 (서울과학기술대학교 기계시스템디자인공학과)
  • Soon-Young Lee (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) ;
  • Sun-Kyoung Kim (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
  • 투고 : 2023.12.20
  • 심사 : 2023.12.31
  • 발행 : 2023.12.31
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초록

In this study, numerical simulation of the thermoforming process of PVC film material was performed using PAMForm. For this purpose, tensile tests were performed at various temperatures and the coefficients of the G'Sell model were obtained and used. As a result of the analysis, it was confirmed that the thickness decreased by up to 55% in the section where the film was in contact with the vertical direction and was greatly stretched. If the thickness is excessively thin, the part may become structurally weak, so in the thermoforming process, numerical simulation of the thickness in advance is expected to be helpful in successfully performing the process.

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과제정보

이 연구는 과학기술정보통신부의 재원으로 한국연구재단의 지원을 받아 수행된 연구임 (NRF-2018R1A5A1024127, NRF-2020R1I1A2065650).

참고문헌

  1. Park, D.Y., Park, D.H. and Lee, H.S., "A study on the residual stress and spring back of thermoformed films", Design & Manufacturing, Vol. 16, No. 1, pp. 27-34, 2022.
  2. Lee, C.H., Byun, Y.S. and Kim, S.K., "Thermoforming device development and process analysis", KSMTE Fall Meeting Proceedings, pp. 117-117, 2018.
  3. Park, D.Y., Park, D.H., Lee, H.S., "A study on the residual stress and spring back of thermoformed films", Design & Manufacturing, Vol.16 No.01, pp. 27- 35, 2022.
  4. G'Sell, C. and Jonas, J.J., "Yield and transient effects during the plastic deformation of solid polymers", J Mater Sci. Vol. 16 pp.1956 - 1974. https://doi.org/10.1007/BF00540644
  5. Seong, G.S. and Lee, H.S., "A study on the thickness distribution and pattern deformation of films in vacuum-assisted thermoforming", Design and Manufacturing, Vol. 12, No.2, pp. 1151-1159, 2003.
  6. Park, E.M., Lee, S.Y., Choi, K.H. and Kim, S.K.," Numerical Simulation of Preform Molding Using Carbon Fabric", Composites Research, vol.33 No.2 pp.61-67, 2020 https://doi.org/10.7234/COMPOSRES.2020.33.2.061