Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Signal-Based Fault Detection and Diagnosis on Electronic Packaging and Applications of Artificial Intelligence Techniques

시그널 기반 전자패키지 결함검출진단 기술과 인공지능의 응용

  • Tae Yeob Kang (School of Industrial and Mechanical Engineering, The University of Suwon) ;
  • Taek-Soo Kim (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
  • 강태엽 (수원대학교 산업 및 기계공학부) ;
  • 김택수 (한국과학기술원 기계공학과)
  • Received : 2023.03.15
  • Accepted : 2023.03.29
  • Published : 2023.03.30
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Abstract

With the aggressive down-scaling of advanced integrated circuits (ICs), electronic packages have become the bottleneck of both reliability and performance of whole electronic systems. In order to resolve the reliability issues, Institute of Electrical and Electronics Engineers (IEEE) laid down a roadmap on fault detection and diagnosis (FDD), thrusting the digital twin: a combination of reliability physics and artificial intelligence (AI). In this paper, we especially review research works regarding the signal-based FDD approaches on the electronic packages. We also discuss the research trend of FDD utilizing AI techniques.

고성능 전자제품의 수요가 증가함에 따라 이를 구현하기 위한 고성능 반도체의 수요도 증가하고 있다. 그러나 성능이 높아지고 운용환경이 다양해질수록 전자패키지의 신뢰성이 회로 전체의 성능과 신뢰성에 병목이 되고 있는 상황이다. 이에 전자패키지에 대한 결함검출 및 진단 기술이 주목받고 있는데, IEEE 이종집적화 로드맵에서는 신뢰성 물리 및 인공지능 기술을 융합한 디지털트윈 전략을 제시하고 있다. 따라서 본 논문에서는 시그널 기반의 전자패키지 결함검출 및 진단 기술을 리뷰하고, 인공지능을 접목한 연구사례를 분석하고자 한다. 더불어 이러한 인공지능 응용 연구의 동향과 전망을 함께 제시한다.

Keywords

Acknowledgement

본 연구성과는 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임 (No. 2022R1A2C3009087).

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