Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Applications of Self-assembled Monolayer Technologies in MEMS Fabrication

MEMS 공정에서의 자기 조립 단분자층 기술 응용

  • Woo-Jin Lee (Department of Materials Science and Engineering, Seoul National University) ;
  • Seung-Min Lee (Department of Materials Science and Engineering, Seoul National University) ;
  • Seung-Kyun Kang (Department of Materials Science and Engineering, Seoul National University)
  • 이우진 (서울대학교 재료공학부) ;
  • 이승민 (서울대학교 재료공학부) ;
  • 강승균 (서울대학교 재료공학부)
  • Received : 2023.06.08
  • Accepted : 2023.06.15
  • Published : 2023.06.30
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Abstract

The process of microelectromechanical system (MEMS) fabrication involves surface treatment to impart functionality to the device. Such surface treatment method is the self-assembled monolayer (SAM) technique, which modifies and functionalizes the surface of MEMS components with organic molecule monolayer, possessing a precisely controllable strength that depends on immersion time and solution concentration. These monolayers spontaneously adsorb on polymeric substrates or metal/ceramic components offering high precision at the nanoscale and modifying surface properties. SAM technology has been utilized in various fields, such as tribological property control, mass-production lithography, and ultrasensitive organic/biomolecular sensor applications. This paper provides an overview of the development and application of SAM technology in various fields.

마이크로 전자기계 시스템 공정에서 표면 처리는 공정 방법의 일환이자 디바이스에 자체적인 기능을 부여하는 역할을 한다. 특히 자기 조립 단분자층은 마이크로 전자기계 시스템 공정에서 표면 개질 및 기능화를 수행하는 표면처리 방법으로 침지 시간과 용액 농도에 따라 강도를 정밀하게 조절할 수 있는 유기 단분자막이다. 고분자 기판이나 금속/세라믹 부품에 자발적으로 흡착되어 형성되는 자기 조립 단분자층은 표면 특성의 개질 뿐만 아니라 나노스케일 단위의 높은 정밀도로 하여금 양산용 리소그래피 기술 및 초민감 유기/생체분자 센서에도 응용되고 있다. 본 논문에서는 마찰 특성의 조절부터 생체 분자의 탐침 기능까지 자기 조립 단분자층 기술이 발전되어 응용되고 있는 다양한 분야들에 대해 소개한다.

Keywords

Acknowledgement

본 연구는 과학기술정보통신부 및 한국연구재단의 집단연구지원사업 연구비지원('2021R1A4A1052035', 이종소재부품의 멀티스케일 계면 신뢰성 분석 및 향상 연구, '2022M3I7A4072293', PIM 이종집적 패키지의 열기계 동적 특성 평가 인프라 구축)에 의해 수행되었습니다).

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