Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Study on Structural Changes and Electromagnetic Interference Shielding Properties of Ti-based MXene Materials by Heat Treatment

열처리에 의한 Ti 기반 MXene 소재의 구조 변화와 전자파 간섭 차폐 특성에 관한 연구

  • Han Xue (Department of Materials Science and Engineering, Dankook University) ;
  • Ji Soo Kyoung (Department of Physics, Dankook University) ;
  • Yun Sung Woo (Department of Materials Science and Engineering, Dankook University)
  • 슈에한 (단국대학교 신소재공학과) ;
  • 경지수 (단국대학교 물리학과) ;
  • 우윤성 (단국대학교 신소재공학과)
  • Received : 2023.09.18
  • Accepted : 2023.09.30
  • Published : 2023.09.30
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Abstract

MXene, a two-dimensional transition metal carbide or nitride, has recently attracted much attention as a lightweight and flexible electromagnetic shielding material due to its high electrical conductivity, good mechanical strength and thermal stability. In particular, the Ti-based MXene, Ti3C2Tx and Ti2CTx are reported to have the best electrical conductivity and electromagnetic shielding properties in the vast MXene family. Therefore, in this study, Ti3C2Tx and Ti2CTx films were prepared by vacuum filtration using Ti3C2Tx and Ti2CTx dispersions synthesized by interlayer metal etching and centrifugation of Ti3AlC2 and Ti2AlC. The electrical conductivity and electromagnetic shielding efficiency of the films were measured after heat treatment at high temperature. Then, X-ray diffraction and photoelectron spectroscopy were performed to analyze the structural changes of Ti3C2Tx and Ti2CTx films after heat treatment and their effects on electromagnetic shielding. Based on the results of this study, we propose an optimal structure for an ultra-thin, lightweight, and high performance MXene-based electromagnetic shielding film for future applications in small and wearable electronics.

높은 전기전도도와 우수한 기계적 강도, 열안정성을 가진 2차원 전이금속탄화물 또는 질화물인 MXene은 최근 가볍고 유연한 전자파 차폐 소재로 많은 주목을 받고 있다. 특히, Ti 기반의 Ti3C2Tx와 Ti2CTx는 방대한 MXene 계열 시스템에서 전기 전도성과 전자파 차폐 특성이 가장 우수한 것으로 보고되고 있다. 따라서, 본 연구에서는 Ti3AlC2와 Ti2AlC의 층간 금속 에칭과 원심 분리법을 통하여 합성된 Ti3C2Tx와 Ti2CTx 분산용액을 진공 여과법을 이용하여 수 마이크로 두께의 필름을 제작하였으며, 고온 열처리 후에 필름의 전기전도도 및 전자파 차폐 효율을 측정하였다. 그리고, X선 회절법과 광전자 분광법을 이용하여 열처리 후의 Ti3C2Tx와 Ti2CTx 필름의 구조적 변화와 전자파 차폐에 미치는 영향을 분석하였다. 본 연구의 결과를 바탕으로 향후 소형 및 웨어러블 전자기기에 적용하기 위한 매우 얇고 가벼운 우수한 성능의 MXene 기반 전자파 차폐 필름을 위한 최적 구조를 제안하고자 한다.

Keywords

Acknowledgement

본 논문은 한국연구재단 2022년 대한민국 교육부, 과학기술정보통신부와 한국연구재단의 지원을 받아 수행된 연구임. (NRF-2022R1A2C2006379, RS-2023-00236572)

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