DOI QR코드

DOI QR Code

Design, Fabrication and Evaluation of Diamond Tip Chips for Reverse Tip Sample Scanning Probe Microscope Applications

탐침과 시편의 위치를 역전시킨 주사 탐침 현미경용 다이아몬드 탐침의 제작 및 평가

  • Sugil Gim (Department of Materials Science and Engineering, Chonnam National University) ;
  • Thomas Hantschel (IMEC) ;
  • Jin Hyeok Kim (Department of Materials Science and Engineering, Chonnam National University)
  • 김수길 (전남대학교 신소재공학과) ;
  • ;
  • 김진혁 (전남대학교 신소재공학과)
  • Received : 2024.01.04
  • Accepted : 2024.02.06
  • Published : 2024.02.27

Abstract

Scanning probe microscopy (SPM) has become an indispensable tool in efforts to develop the next generation of nanoelectronic devices, given its achievable nanometer spatial resolution and highly versatile ability to measure a variety of properties. Recently a new scanning probe microscope was developed to overcome the tip degradation problem of the classic SPM. The main advantage of this new method, called Reverse tip sample (RTS) SPM, is that a single tip can be replaced by a chip containing hundreds to thousands of tips. Generally for use in RTS SPM, pyramid-shaped diamond tips are made by molding on a silicon substrate. Combining RTS SPM with Scanning spreading resistance microscopy (SSRM) using the diamond tip offers the potential to perform 3D profiling of semiconductor materials. However, damage frequently occurs to the completed tips because of the complex manufacturing process. In this work, we design, fabricate, and evaluate an RTS tip chip prototype to simplify the complex manufacturing process, prevent tip damage, and shorten manufacturing time.

Keywords

Acknowledgement

This research was supported by the MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0017312) supervised by the Korea Institute for Advancement of Technology (KIAT).

References

  1. N. G. Orji, M. Badaroglu, B. M. Barnes, C. Beitia, B. D. Bunday, U. Celano, R. J. Kline, M. Neisser, Y. Obeng and A. E. Vladar, Nat. Electron., 1, 532 (2018).
  2. W. Vandervorst, C. Fleischmann, J. Bogdanowicz, A. Franquet, U. Celano, K. Paredis and A. Budrevich, Mater. Sci. Semicond. Process., 62, 31 (2017).
  3. T. Hantschel, M. Tsigkourakos, L. Zha, T. Nuytten, K. Paredis, B. Majeed and W. Vandervorst, Microelectron. Eng., 159, 46 (2016).
  4. U. Celano, T. Hantschel, T. Boehme, A. Kanniainen, L. Wouters, H. Bender, N. Bosman, C. Drijbooms, S. Folkersma, K. Paredis, W. Vandervorst and P. Van Der Heide, in Proceedings of the 2019 IEEE International Electron Devices Meeting (San Francisco, CA, February 2020) p. 90.
  5. H. Seidel, L. Csepregi, A. Heuberger and H. Baumgartel, J. Electrochem. Soc., 137, 3612 (1990).
  6. L. Wouters, T. Boehme, L. Mana and T. Hantschel, Micro Nano Eng., 19, 100195 (2023).
  7. T. Hantschel, P. Niedermann, T. Trenkler and W. Vandervorst, Appl. Phys. Lett., 76, 1603 (2000).