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Non-isothermal Cure Kinetics of Epoxy Resin

비등온 조건의 에폭시 경화 거동

  • Hongkyeong Kim (Department of Polymer Science and Engineering, Korea National University of Transportation)
  • 김홍경 (한국교통대학교 나노화학소재공학과)
  • Received : 2025.10.17
  • Accepted : 2025.11.20
  • Published : 2025.11.30

Abstract

Various epoxy composite materials, such as semiconductor packaging and fiberglass reinforced epoxy composites, are utilized in everyday life and industrial fields. The manufacturing process of these epoxy composite materials is generally carried out under isothermal and non-isothermal conditions in the reaction injection molding (RIM) process. To establish the process conditions, kinetic analysis of curing is necessary, and typical kinetic analysis is performed under isothermal conditions. However, maintaining isothermal conditions at the initial stages of the reaction is difficult, which can lead to errors from the beginning of the reaction. Therefore, by modifying the kinetic equations for application under non-isothermal conditions and conducting nonlinear optimization analysis, it was confirmed that the curing reactions at various heating rates can be effectively represented.

Keywords

Acknowledgement

본 연구는 2025년 한국교통대학교의 지원을 받아 수행하였음.

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