Applied Chemistry for Engineering (공업화학)

The Korean Society of Industrial and Engineering Chemistry (한국공업화학회)
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Synthesis of Cu-Ag Metal-Organic Decomposition Ink and Application in Electromagnetic Interference Shielding

Cu-Ag 금속-유기 분해 잉크의 합성 및 전자파 차폐 적용

  • Sang-Bo Sim (Changsung Nanotech Co., Ltd.) ;
  • Jong-Dae Han (School of Smart Green Engineering, Changwon National University)
  • Received : 2024.12.22
  • Accepted : 2024.12.30
  • Published : 2025.02.10
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Abstract

The recent rapid development of multi-functional electronic devices and 5G technology, along with convenient living, inevitably generates a large amount of electromagnetic pollution. Therefore, the development of more efficient electromagnetic interference (EMI) shielding materials is necessary. In this study, Cu-Ag MOD inks with various Ag contents were synthesized by mixing synthesized Cu MOD ink and Ag MOD ink. These Cu-Ag inks were coated on a polyimide film and sintered using intensive pulsed light (IPL) to obtain the coated thin films. The properties of the coated thin films were investigated by SEM, XRD, UV-Vis absorption, resistivity, impedance, and the EMI shielding effectiveness (SE) was measured. The thin film coated with Cu-Ag ink containing 2.5 wt% Ag and sintered with IPL energy of 60 J/cm2 achieved EMI SE higher than 50.

최근 다기능 전자기기와 5G 기술의 급속히 발전은 편리한 생활과 함께 불가피하게 많은 양의 전자파 오염을 발생시키고 있다. 따라서 더욱 효율적인 전자파(electromagnetic interference, EMI) 차폐 재료의 개발이 필요하다. 본 연구에서는 합성된 Cu MOD 잉크와 Ag MOD 잉크를 혼합하여 다양한 Ag 함량의 Cu-Ag MOD 잉크를 합성하였다. 이들 Cu-Ag 잉크를 polyimide film에 코팅하고 강한 펄스광(intensive pulsed light, IPL)으로 소결하여 코팅 필름 박막을 얻었다. 코팅 필름 박막의 특성을 SEM, XRD, UV-Vis 흡수, 비저항 및 인피던스 등으로 조사하고 EMI 차폐 효과(SE)를 측정하였다. 2.5 wt% Ag의 Cu-Ag 잉크로 코팅하고 60 J/cm2의 IPL energy로 소결한 코팅 박막 필름으로 EMI SE 50 이상을 얻을 수 있었다.

Keywords

Acknowledgement

이 논문은 2023~2024년도 창원대학교 자율연구과제 연구비 지원으로 수행된 연구결과임.

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