• Journal of the Korean Ceramic Society
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• v.35 no.9
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• pp.969-973
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• 1998

Pb(Zr, Ti)O3 (PZT) (Zr:Ti= 52: 48) thin films were prepared on MgO(100) substrates by dipping-py-rolysis process using metal naphthenates as starting materials. Thin films were fabricated by spin coating technique and the precursor films were prefired at 20$0^{\circ}C$ in air for 0.5, 1, 2, 3, and 24 h followed by final heat treatment at 75$0^{\circ}C$ for 30min. Film prefired for 24 h lost orientational properties and pole figure analysis showed the lost of the epitaxial relationship between the films and substrate while highly a/c-axis oriented thin films were obtained for the samples prefired for 1, 2, and 3h.

• Applied Science and Convergence Technology
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• v.24 no.6
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• pp.219-223
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• 2015

Enhancement of the surface hydrophobicity of polydimethylsiloxane (PDMS) thin films deposited on substrates covered with titanium dioxide ($TiO_2$) nanospheres was studied. First, a low-temperature solution-phase method using polyvinylpyrrolidone (PVP) as a surface capping agent and a water/dimethylformamide (DMF) mixture as the reaction medium was used to synthesize monodisperse $TiO_2$ nanospheres. It was possible to easily control hydrolysis rate of the Ti-precursors and the size of the synthesized nanospheres by varying the amount of PVP and the volume ratio of the solvent mixture. Spray coating of the synthesized $TiO_2$ nanospheres under the PDMS film increased the water contact angle of the film surface to $150.3^{\circ}$. This simple treatment can modify the surface morphology at a nanometer scale without any long or complicated nanoprocess; hence, the surface enters the superhydrophobic Cassie-Baxter regime.

• The Korean Journal of Ceramics
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• v.4 no.3
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• pp.199-203
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• 1998

$Pb(Zr, Ti)O_3$ (Pb:Zr:Ti=1:0.52:0.48) thin films were prepared on single crystal MgO(100) substrates by dipping-pyrolysis process using a solution of constituent metal naphthenates as starting materials. The solution was spin-coated onto substrate and the precursor films were pyrolyzed at $200^{\circ}C$ in air or at $200^{\circ}C$ in argon for 1, 2, 5 and 24h, followed by final heat treatment at $750^{\circ}C$. For all the films, highly (h00)/(00l)-oriented Pb$Pb(Zr, Ti)O_3$ thin films with smooth surfaces and crack-free were obtained, whereas thin film pyrolyzed in air for 24 h exhibited polycrystalline character. According to the pole-figure analysis, epitaxy of the product films was found to depend on pyrolysis atmosphere.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.5
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• pp.221-226
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• 2010

Quartz crystal microbalance (QCM) gas sensor to detect methyl mercaptan ($CH_3SH$) gas was fabricated by depositing $TiO_2$ nanoparticles and polyelectrolyte on the electrode of QCM. The $TiO_2$/poly(sodium 4-styrenesulfonate) (PSS) thin film fabricated by a layer-by-layer self-assembly (LBL-SA) method showed a high surface area and increased the sensitivity of gas sensor. When the QCM sensors coated with triethanolamine (TEA) or ($TiO_2$/PSS) were exposed to methyl mercaptan gas (1.0 ppm), the frequency shifts of QCM with TEA casting film and $TiO_2$/PSS thin film were ca. 9 Hz and ca. 24 Hz, respectively. As the bilayer number of ($TiO_2$/PSS) increased, the frequency shift of QCM sensor with ($TiO_2$/PSS) thin film was gradually increased. In addition, the frequency shift of QCM sensor was gradually increased as the concentration of methyl mercaptan gas increased from 0.5 ppm to 2.0 ppm. In this study, the surface morphology and sensor property of QCM sensor coated with ($TiO_2$/PSS) thin film were measured.

• Journal of the Korean institute of surface engineering
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• v.24 no.4
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• pp.196-205
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• 1991

Multi-level thin films are very important in ULSI applications because of their high electromigration resistance. This study presents the effects of titanium, titanium nitride and titanium tungsten underlayers of the stability of multi-aluminum thin films during isothermal annealing. High purity Al(99.999%) films have been electron-beam evaporated on Ti, TiN, TiW films formed on SiO2/Si (P-type(100))-wafer substrates by RF-sputtering in Ar gas ambient. The hillock growth was increased with annealing temperatures. Growth of hillocks was observed during isothermal annealing of the thin films by scanning electron microscopy. The hillock growth was believed to appear due to the recrystallization process driven by stress relaxation during isothermal annealing. Thermomigration damage was also presented in thin films by grain boundary grooving processes. It is shown that underlayers of Al/TiN/SiO2, Al/TiW/SiO2 thin films are preferrable to Al/SiO2 thin film metallization.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.51-54
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• 2003

Tb-doped lead zirconate titanate($Pb_{1.1}(Zr_{0.6}Ti_{0.4})O_3$; PZT) thin films on $Pt(111)/Ti/SiO_2/Si(100)$ substrates prepared by a sol-gel method. Films have a Zr/Ti ratio of 60:40 and perovskite phase structure. The effect on the structural and electrical properties of films measured according to Tb content. Dielectric and ferroelectric properties of PZT thin films were altered significantly by Tb-doping. The PZT thin film with higher dielectric constant and improved leakage current characteristic was obtained by adding 0.3 mol% Tb. At 100 kHz, the dielectric constant and the dielectric loss of the 0.3 mol% Tb-doped PZT thin film were 1611 and 0.24, respectively The remanent polarization(2Pr) of the 0.3 mol% Tb-doped PZT thin film was $61.4\;{\mu}C/cm^2$ and the coercive field was 61.9 kV/cm. Tb-doped PZT thin films showed improved fatigue characteristics comparing to the undoped PZT thin film.

• Applied Science and Convergence Technology
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• v.24 no.6
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• pp.289-292
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• 2015

The etching processes of glass in aqueous hydrofluoric acid (HF) solutions were used to improve the current density of solar cell. In this study, the textured glass substrate has been etched by solution and the $TiO_2$ thin films have been prepared on this textured glass. After the $TiO_2$ film deposition the surface has been etched by HF under different concentration and the etched $TiO_2$ thin films had a longer electron lifetime and higher haze ratio as well as light scattering, resulting in 1.7 times increment of dye-sensitized solar-cell(DSSC) efficiency. Increases in the surface root-mean-square roughness of glass substrates from 80 nm to 1774 nm enhanced haze ratio in above 300 nm wavelength. In particular, haze ratio of etched $TiO_2$ films on textured glass showed gradually increasing tendency at 550 nm wavelength by increasing of HF concentration up to 10M, suggesting a formation of crater with various sizes on its surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.339-342
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• 1998

Ferroelectric L $a_2$ $Ti_2$ $O_{7}$(LTO) thin films were prepared by chemical solution deposition processes. Acetylacetone was used as chelating agent and nitric acid was added in the stock solution to control hydrolysis and condensation reaction rate. The LTO thin films were spin-coated on Pt/Ti/ $SiO_2$/(100)Si and Pt/Zr $O_2$/ $SiO_2$/(100)Si substrates. After multiple coating, dried thin films were heat-treated for decomposition of residual organics and crystallization. The role of acetylacetone in Ti iso-propoxide stabilization by possibly substituting $O^{i}$Pr ligand was studied by H-NMR. B site-rich impurity phase, i.e. L $a_4$ $Ti_{9}$ $O_{24}$, was found after annealing, where its appearance was dependent on process temperature indicating the possible reaction with substrate. Dielectric and other relevant electrical properties were measured and the results were compared between modified sol-gel and MOD processes.s.s.

• Journal of the Korean Society for Heat Treatment
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• v.24 no.1
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• pp.31-36
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• 2011

$TiO_2$ films were deposited on a glass substrate with RF magnetron sputtering and then surface of $TiO_2$ films were electron beam irradiated in a vacuum condition to investigate the effect of electron bombardment on the thin film crystallization, surface roughness and gas sensitivity for hydrogen. $TiO_2$ films that electron beam irradiated at 450eV were amorphous phase, while the films irradiated at 900 eV show the anatase (101) diffraction peak in XRD pattern. AFM measurements show that the roughness is depend on the electron irradiation energy. As increase the hydrogen gas concentration and operation temperature, the gas sensitivity of $TiO_2$ and $TiO_2$/ZnO films is increased proportionally and $TiO_2$ films that electron beam irradiated at 900 eV show the higher sensitivity than the films were irradiated at 450eV. From the XRD pattern and AFM observation, it is supposed that the crystallization and rough surface promote the hydrogen gas sensitivity of $TiO_2$ films.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.11
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• pp.18-24
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• 2000

(Ba,Sr)$TiO_3$ thin films have attracted great interest as new dielectric materials of capacitors for ultra-large-scale integrated dynamic random access memories (ULSI-DRAMs) such as 1 Gbit or 4 Gbit. In this study, inductively coupled $BCl_3/Cl_2/Ar$ plasmas was used to etch (Ba,Sr)$TiO_3$ thin films. RF power/dc bias voltage=600 W/-250 V and chamber pressure was 10 mTorr. The $Cl_2/(Cl_2+Ar)$ was fixed at 0.2 the (Ba,Sr)$TiO_3$ thin films were etched adding $BCl_3$. The highest (Ba,Sr)$TiO_3$ etch rate is $480{\AA}/min$ at 10 % $BCl_3$ to $Cl_2/Ar$. The change of Cl, B radical density measured by optical emission spectroscopy(OES) as a function of $BCl_3$ percentage in $Cl_2/Ar$. The highest Cl radical density was shown at the addition of 10% $BCl_3$ to $Cl_2/Ar$. To study on the surface reaction of (Ba, Sr)$TiO_3$ thin films was investigated by XPS analysis. Ion bombardment etching is necessary to break Ba-O bond and to remove $BaCl_2$. There is a little chemical reaction between Sr and Cl, but Sr is removed by physical sputtering. There is a chemical reaction between Ti and Cl, and $TiCl_4$ is removed with ease. The cross-sectional of (Ba,Sr)$TiO_3$ thin film was investigated by scanning electron microscopy (SEM), the etch slope is about 65~70$^{\circ}$.