• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2410-2413
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.2897-2899
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAR, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering Problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.33-38
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• 2002

High performance packages must have a minimum insertion loss and return loss. In this paper, we design a millimeter-wave ceramic package using LTCC (Low Temperature Cofired Ceramic) technology to satisfy excellent transmission characteristics and characterize in a frequency range from DC to 30 GHz using the FEM (Finite Element Method) calculation. From these calculation results, the designed feed-through structure achieved 0.32 dB, 16.8 dB of the insertion loss and the return loss at 30 GHz respectively. This designed ceramic package will be useful for MMIC (Monolithic Microwave Integrated Circuit) modules.

• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2109-2110
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• 2006

유한요소법은 전자기, 기계, 또는 다른 공학 분야에서 다루는 풀기 어려운 복잡한 문제들을 해석하는데 널리 사용되고 있는 수치해석기법이다. CEMTool은 MATLAB과 유사한 과학기술 범용 패키지로서, 간편한 명령어 방식의 문법과 블록 다이어그램 설계, 이공학 전반의 함수 등의 다양한 기능들을 제공한다. 본 논문에서는 범용 공학 소프트웨어인 CEMTool 환경에서 실행되는 GUI 3D FEM 패키지에 대해 기술한다. FEM 해석의 일반적 단계인 전처리, 솔버, 후처리 단계별로 나누어 각 단계의 구조와 특징 등을 기존의 CEMTool 2D FEM 패키지, MATLAB PDE Toolbox, FEMLAB2.2와 비교하여 자세히 살펴보기로 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.543-546
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• 2001

So far, the design methods of quartz crystal resonator have been developed. Recently, as the electronic package and semiconductor modules become smaller, the need to minimize the sizes of crystal components grows larger. but Minimizing crystal plate sizes has limitations because its temperature-frequency characteristics is worse and unwanted resonances occur. so appropriate design of electrode size and crystal plates is necessary. In this palter, Two-dimensional governing equations for electroded piezoelectric crystal plates with general symmetry have been solved from deduced equations from three-dimensional equations of linear piezoelectricity in most cases. In practice, electroded piezoelectric crystal plates have three-dimensional geometry, so simplified 2-dimensional equations and 2-D modeling are insufficient for explaining its resonance modes and characteristics. So, three-dimensional FEM(finite element method) analysis is done and its effectiveness is verified from analyzing practical crystal resonator model.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.7A
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• pp.563-568
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• 2003

In this paper, a miniaturized parallel coupled bandpass filter using multi-layered LTCC(Low Temperature Co-fired Ceramics) substrate for SOP(System-On-Package) is proposed for applications to wireless communication systems. The fabricated BPF is composed of five 106${\mu}{\textrm}{m}$ thick LTCC layers and its size is 5.24mm x 4.3mm x 0.53 mm. The measured characteristics of the BPF show the center frequency of 5.8GHz, bandwidth of 200MHz, insertion loss of 2.326dB and return loss of 13.679dB. In addition, the attenuation is 28.052dB at 4.7GHz.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.467-470
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• 2005

There are about 10 motors for tile actuator of the automation system in an auto-mobile recently. The performance of the motor-case is much related to the noise and the vibration of an auto-mobile Multi-Forming process is so much the better than existing deep-drawing or Multi-step forming by press by less cost, installation and staff. But there isn't the specific and general process design, so we aren't good at competition. So in the first step, I want to study about the core design for the multi-forming process. We can access by the elasto-plastic theory and the finite element method, and we use a commercial package of the Deform-2D and, Deform-3D which is based on three-dimensional elasto-plastic finite element, evaluated propriety oi the package. The evaluation of the package propriety was simulated by simple bending example. It was found the elasto-plastic theory was mostly in agreement with the simulation. We proposed that three type of section for the core and analyzed by finite element method (Deform-2D). We can get the best result with the ellipse type core. Then we apply the result of the preceding analysis to the finite element method (Deform-3D). In 3D-finite element analysis, we can get the result of 8/100mm-roundness. This result can help the improvement of the multi-forming process.

• Proceedings of the KIEE Conference
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• 1996.07a
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• pp.127-129
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• 1996

A 3-dimensional analysis is desired for a magnet of magnetically levitated vehicle because the geometrical shape of the magnet is complicated and nonsymmetric. A FEM package of FLUX3D is used to analyze the characteristic of the magnet. Various quantities could be observed like levitation force, flux density distribution along the air gap, edge and fringing effect, leakage flux pattern, etc. The simulation results from FLUX3D are compared with those of 2-D analysis and test results. There are a little difference between results due to the boundary conditions and magnetized B-H curve of the core.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.