• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.147-152
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• 2007

UV laser ablation of polyimide is a combination of photochemical and photothermal mechanism. Photochemical mechanism is that molecular bonds are broken by photon energy and photothermal is evaporation and melt expulsion. When the laser processing, the etching depth needs to be calculated for prediction of processing result. In this paper, in order to predict the laser etching depth of polyimide by UV laser with the wavelength of 355nm, the theoretical model which includes both the photothermal and the photochemical effect was introduced. The model parameters were obtained by comparing with experimental results. The 3rd harmonic $Nd:YVO_4$ laser system was used in the experiment. From these experimental and theoretical results, the laser ablation of a polyimide was verified to achieve the highest quality microstructure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.493-494
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.655-656
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• 2007

• Journal of the Korean Society for Precision Engineering
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• v.24 no.2 s.191
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• pp.134-139
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• 2007

Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.299-300
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.609-610
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.573-574
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• 2008

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.5
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• pp.2979-2984
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• 2015

This paper has presented a new foaming technology of selective hybrid-structured polymer film with expanded pores. The porous structure of closed pore was firstly fabricated by applying the 355nm UV-pulsed laser to 0.1mm thick film that was uniformly mixed with PP pellets, copper powder, and CBA (Chemical Blowing Agent). In order to expand pore size of closed-cell shape, LAMO(Laser Aided Micro pore Opening) processing was conducted to heat the copper powder, and then the bigger pore size of closed-cell more than existing pore size was successfully formed because of rapid conduction of heated metal powder. From the experimental results, various process parameters such as laser fluence, intensity, scan rate, spot size and density of powder and CBA were considerably considered to reveal the correlation among the pore characteristics. In the future, a function experiment will be carried out to use the hybrid film of industrial applications.

• Laser Solutions
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• v.10 no.2
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• pp.17-24
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• 2007

We have studied a laser direct writing lithography(LDWL). This is more important to apply to micro patterning using UV laser. We demonstrate the possibility of LDWL and construct the fabrication system. We use Galvano scanner to process quickly micro patterns from computer data. And laser beam is focused with $F-{\theta}$ lens. AZ5214 and SU-8 photoresist are chosen as experimental materials and a kind of well-known positive and negative photoresist respectively. Laser ablation mechanism depends on the optical properties of polymer. In this paper, therefore we investigate the phenomenon of laser ablation according to the laser fluence variation and measure the shape profile of micro patterned holes. From these experimental results, we show that LDWL is very useful to process various micro patterns directly.

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.