• 한국정밀공학회지
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• 제24권4호
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• pp.147-152
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• 2007

UV laser ablation of polyimide is a combination of photochemical and photothermal mechanism. Photochemical mechanism is that molecular bonds are broken by photon energy and photothermal is evaporation and melt expulsion. When the laser processing, the etching depth needs to be calculated for prediction of processing result. In this paper, in order to predict the laser etching depth of polyimide by UV laser with the wavelength of 355nm, the theoretical model which includes both the photothermal and the photochemical effect was introduced. The model parameters were obtained by comparing with experimental results. The 3rd harmonic $Nd:YVO_4$ laser system was used in the experiment. From these experimental and theoretical results, the laser ablation of a polyimide was verified to achieve the highest quality microstructure.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.493-494
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.655-656
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• 2007

• 한국정밀공학회지
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• 제24권2호
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• pp.134-139
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• 2007

Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.299-300
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.609-610
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• 2011

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.573-574
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• 2008

• 한국산학기술학회논문지
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• 제16권5호
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• pp.2979-2984
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• 2015

본 연구에서는 발포제를 이용하여 형성된 기공을 확대하는 방식의 공정으로써, 선택적 하이브리드 구조의 폴리머 필름의 제작을 위한 새로운 발포기술을 제시하였다. 기존의 발포제만을 이용한 폐쇄형 기공보다 큰 기공을 형성하기 위해서 PP에 발포제와 구리분말(Copper powder)을 혼합하여 만든 필름 내부에 355nm파장의 UV 펄스레이저를 이용하여 LAMO(Laser Aided Micro pore Opening) 공정 방식을 통한 기공의 크기를 확장하는 실험을 진행하였다. 그 결과 발포공정만 수행된 기공의 크기보다 추가적인 LAMO 공정을 통해 형성된 기공의 크기가 훨씬 더 크게 관찰되었다. 본 실험의 결과를 통해 LAMO 공정에 의한 기공의 특성과의 상관관계를 파악할 수 있었으며, 기존의 UV laser를 이용하여 원하는 부위에 선택적으로 폐쇄형 기공을 형성하는 것 이상으로 기공의 크기를 제어하는 방안을 제시하고자 한다.

• 한국레이저가공학회지
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• 제10권2호
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• pp.17-24
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• 2007

We have studied a laser direct writing lithography(LDWL). This is more important to apply to micro patterning using UV laser. We demonstrate the possibility of LDWL and construct the fabrication system. We use Galvano scanner to process quickly micro patterns from computer data. And laser beam is focused with $F-{\theta}$ lens. AZ5214 and SU-8 photoresist are chosen as experimental materials and a kind of well-known positive and negative photoresist respectively. Laser ablation mechanism depends on the optical properties of polymer. In this paper, therefore we investigate the phenomenon of laser ablation according to the laser fluence variation and measure the shape profile of micro patterned holes. From these experimental results, we show that LDWL is very useful to process various micro patterns directly.

• 한국레이저가공학회지
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• 제6권1호
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.