• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2410-2413
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.2897-2899
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAR, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering Problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1565-1568
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• 2003

The backward extrusion process is one of the commonly used metal forming processes. In this paper. a battery case which has the rectangular section, is analyzed using a 3D metal forming package(MSC.Superforge). This pacakge uses the finite volume analysis method. It is shown that the MSC.Superforge package using finite volume method provides result very close to those obtained from a finite element analysis package(MSC.Superform). However, the simulation time using the finite volume method was almost 10 % of the simulation time consumed by the other package using finite element method. Moreover, the finite volume method used in MSC.Superforge can eliminate the remeshing problems that make the simulating a metal forming process with severe deformation, such as the extrusion process, so difficult.

• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2109-2110
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• 2006

유한요소법은 전자기, 기계, 또는 다른 공학 분야에서 다루는 풀기 어려운 복잡한 문제들을 해석하는데 널리 사용되고 있는 수치해석기법이다. CEMTool은 MATLAB과 유사한 과학기술 범용 패키지로서, 간편한 명령어 방식의 문법과 블록 다이어그램 설계, 이공학 전반의 함수 등의 다양한 기능들을 제공한다. 본 논문에서는 범용 공학 소프트웨어인 CEMTool 환경에서 실행되는 GUI 3D FEM 패키지에 대해 기술한다. FEM 해석의 일반적 단계인 전처리, 솔버, 후처리 단계별로 나누어 각 단계의 구조와 특징 등을 기존의 CEMTool 2D FEM 패키지, MATLAB PDE Toolbox, FEMLAB2.2와 비교하여 자세히 살펴보기로 한다.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.32 no.1
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• pp.85-93
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• 2009

In this paper, the geometric design for the body of a 3"-PFA-lined plug valve is concerned, and body model which has less deformed PFA-resin after infection molding process is proposed. A CAE software is used to simulate the deformation due to heat in cooling. To reduce the deformation, some small shapes are added to PFA-resin surfaces related on wall of the valve housing. And thermal stress simulation with FEM methodology is followed after that. Also, the 3D-CAD package is used during the design processes. In this study, I tried to present the possibility to use the FEM analysis in the solid modeling process. So, the design engineer will be able to use analysis package effectively on his job within the limited range.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.186-189
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• 2001

In keeping with the needs of the times for energy and labor saving and simplifying production processes, interests has been growing in warm forging. Moreover, it is interested in increasing the material usage and production amounts. To improve the productivity and material usage, it is studied the process design of warm forging for socket. Until now, socket is manufactured by hot forging in hammer. The percentage of material usage is under $60\%$ in hammer forging. On the other han4 the percentage can be increased over $90\%$ in warm forging. To change the process from hot forging to warm forging, process designs must be performed. In this time, by using the FEM package, DEFORM-3D, we could get the shape of 1st process and minimum sealing pressure. They are very essential design data to decrease the trial and error. Practically, the overlap defect could be detected and eliminated with design modification of rib height and fillet radius. Moreover, forging load and minimum sealing pressure was defined by the 3D FEM analysis.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.63-66
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• 2003

Forged gears have the obvious advantages with the greater utilisation of raw material and high productivity over the machined gears. The forged bevel gear has been used in differential gear for automotive with a high reliance. On the other hand, the studies have been continued to improve the accuracy and expand the applying areas. In this paper, a whole manufacturing process for forged gear from die design and cold forging to heat-treatment was introduced. The stress and elastic deformation for forging die have been analysed by the 3D-FEM-package. The real elastic deformation of die was measured by the strain-gages. The elastic deformation of die was reached to 1mm, in terms of the present study. The analysed quantitative dimension of die was taken into consideration into the CAD/CAM data for forging die.

• Journal of the Semiconductor & Display Technology
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• v.10 no.3
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• pp.61-65
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• 2011

The capabilities of finite elements codes allow now accurate simulations of blanking processes when appropriate materials modelling are used. Over the last decade, numerous numerical studies have focused on the influence of process parameters such as punch-die clearance, tools geometry and friction on blanking force and blank profile. In this study, three dimensional finite element analysis is carried out to design a lead frame blanking die using LS-Dyna3D package. After design of the blanking die, an experiment is also carried out to investigate the characteristics of blanking for nickel alloy Alloy42, a kind of IC lead frame material. In this paper, it has been researched the investigation to examine the influence of process parameters such as clearance and air cylinder pressure on the accuracy of sheared plane. Through the experiment results, it is shown that the quality of sheared plane is less affected by clearance and air cylinder pressure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.7A
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• pp.563-568
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• 2003

In this paper, a miniaturized parallel coupled bandpass filter using multi-layered LTCC(Low Temperature Co-fired Ceramics) substrate for SOP(System-On-Package) is proposed for applications to wireless communication systems. The fabricated BPF is composed of five 106${\mu}{\textrm}{m}$ thick LTCC layers and its size is 5.24mm x 4.3mm x 0.53 mm. The measured characteristics of the BPF show the center frequency of 5.8GHz, bandwidth of 200MHz, insertion loss of 2.326dB and return loss of 13.679dB. In addition, the attenuation is 28.052dB at 4.7GHz.