• JSTS:Journal of Semiconductor Technology and Science
• /
• v.12 no.3
• /
• pp.313-319
• /
• 2012

The power supply rejection (PSR) of low drop-out (LDO) voltage regulator is improved by employing an error amplifier (EA) which is configured so the power supply noise be cancelled at the output. The LDO regulator is implemented in a 0.13-${\mu}m$ standard CMOS technology. The external supply voltage level is 1.2-V and the output is 1.0-V while the load current can range from 0-mA to 50-mA. The power supply rejection is 46-dB, 49-dB, and 38-dB at DC, 2-MHz, and 10-MHz, respectively. The quiescent current consumption is 65-${\mu}A$.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.7 no.4
• /
• pp.267-273
• /
• 2007

A fractional-N frequency synthesizer supports quadruple bands and multiple standards for mobile broadcasting systems. A novel linearized coarse tuned VCO adopting a pseudo-exponential capacitor bank structure is proposed to cover the wide bandwidth of 65%. The proposed technique successfully reduces the variations of KVCO and per-code frequency step by 3.2 and 2.7 times, respectively. For the divider and prescaler circuits, TSPC (true single-phase clock) logic is extensively utilized for high speed operation, low power consumption, and small silicon area. Implemented in $0.18-{\mu}m$ CMOS, the PLL covers $154{\sim}303$ MHz (VHF-III), $462{\sim}911$ MHz (UHF), and $1441{\sim}1887$ MHz (L1, L2) with two VCO's while dissipating 23 mA from 1.8 V supply. The integrated phase noise is 0.598 and 0.812 degree for the integer-N and fractional-N modes, respectively, at 750 MHz output frequency. The in-band noise at 10 kHz offset is -96 dBc/Hz for the integer-N mode and degraded only by 3 dB for the fractional-N mode.

• ETRI Journal
• /
• v.33 no.5
• /
• pp.818-821
• /
• 2011

A D-band subharmonically-pumped resistive mixer has been designed, processed, and experimentally tested. The circuit is based on a $180^{\circ}$ power divider structure consisting of a Lange coupler followed by a ${\lambda}$/4 transmission line (at local oscillator (LO) frequency). This monolithic microwave integrated circuit (MMIC) has been realized in coplanar waveguide technology by using an InAlAs/InGaAs-based metamorphic high electron mobility transistor process with 100-nm gate length. The MMIC achieves a measured conversion loss between 12.5 dB and 16 dB in the radio frequency bandwidth from 120 GHz to 150 GHz with 4-dBm LO drive and an intermediate frequency of 100 MHz. The input 1-dB compression point and IIP3 were simulated to be 2 dBm and 13 dBm, respectively.

• Proceedings of the IEEK Conference
• /
• 2006.06a
• /
• pp.617-618
• /
• 2006

A CMOS quadrature Up-converter for a direct-conversion receiver of 5.15-5.825GHz wireless LAN is described. The Up-converter consists of two sub-harmonic mixers, for I and Q channels, and an LO generation network. In order to decrease the number of inductor, I and Q path are merged. The simulation results including all the parasitics show -17.3dB conversion gain at center and -8 dBv oIP3 while consuming 22.968mW under 1.8V supply. The quadrature Up-converter is under fabrication with the other transmitter blocks in a $0.18{\mu}m$ CMOS technology.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.13 no.5
• /
• pp.423-429
• /
• 2013

A 6-Gb/s differential voltage mode driver is presented whose output impedance and pre-emphasis level can be controlled independently. The voltage mode driver consists of five binary-weighted slices each of which has four sub-drivers. The output impedance is controlled by the number of enabled slices while the pre-emphasis level is determined by how many sub-drivers in the enabled slices are driven by post-cursor input. A prototype transmitter with a voltage-mode driver implemented in a 65-nm CMOS logic process consumes 34.8-mW from a 1.2-V power supply and its pre-emphasized output signal shows 165-mVpp,diff and 0.56-UI eye opening at the end of a cable with 10-dB loss at 3-GHz.

• ETRI Journal
• /
• v.36 no.6
• /
• pp.931-941
• /
• 2014

Many methodologies for clock mesh networks have been introduced for two-dimensional integrated circuit clock distribution networks, such as methods to reduce the total wirelength for power consumption and to reduce the clock skew variation through consideration of buffer placement and sizing. In this paper, we present a methodology for clock mesh to reduce both the clock skew and the total wirelength in three-dimensional integrated circuits. To reduce the total wirelength, we construct a smaller mesh size on a die where the clock source is not directly connected. We also insert through-silicon vias (TSVs) to distribute the clock signal using an effective clock TSV insertion algorithm, which can reduce the total wirelength on each die. The results of our proposed methods show that the total wirelength was reduced by 12.2%, the clock skew by 16.11%, and the clock skew variation by 11.74%, on average. These advantages are possible through increasing the buffer area by 2.49% on the benchmark circuits.

• The Magazine of the IEIE
• /
• v.36 no.9
• /
• pp.29-39
• /
• 2009

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.2 no.4
• /
• pp.273-279
• /
• 2002

This paper presents a fabrication technology for the integration of single crystal Si microstructures with on-chip circuitry. It is a dissolved wafer technique that combines an electro-chemical etch-stop for the protection of circuitry with an impurity-based etch-stop for the microstructures, both of which are defined in an n-epi layer on a p-type Si wafer. A CMOS op. amp. has been integrated with $p^{++}$ Si accelerometers using this process. It has a gain of 68 dB and an output swing within 0.2 V of its power supplies, unaffected by the wafer dissolution. The accelerometers have $3{\;}\mu\textrm{m}$ thick suspension beams and $15{\;}\mu\textrm{m}$ thick proof masses. The structural and electrical integrity of the fabricated devices demonstrates the success of the fabrication process. A variety of lead transfer methods are shown, and process details are discussed.

• Proceedings of the IEEK Conference
• /
• 2006.06a
• /
• pp.627-628
• /
• 2006

A low-voltage switched-capacitor $2^{nd}$-order $\Sigma\Delta$ modulator using full feed-forward is introduced. It has two advantages: the unity signal transfer function and reduced signal swings inside the $\Sigma\Delta$ loop. These features greatly relax the DC gain and output swing requirements for Op-Amp in the low-voltage $\Sigma\Delta$ modulator. Implemented by a 0.18-${\mu}m$ CMOS technology, the $\Sigma\Delta$ modulator satisfies performance requirements for WCDMA and CDMA2000 standards.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.4 no.3
• /
• pp.196-203
• /
• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.