• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.7 no.1
• /
• pp.47-52
• /
• 2008

We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.7 no.3
• /
• pp.81-86
• /
• 2008

I present a 3-D profiler specially devised for the profile measurement of specular surfaces that requires precision shape accuracy up to a few nanometer. A profile is reconstructed from the curvature of a test part of the surface at several locations along a line. The local curvature data are acquired with White-light Scanning Interferometry. Test measurement proves that the proposed profiler is well suited for the specular surface inspection like precision mirror.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.3
• /
• pp.39-45
• /
• 2002

A simple and low cost stylus profiler made of ferrite cores is developed. The devised profiler consists of a contact probe, a measuring transducer, a signal processing unit, and a motorized stage. The contact probe attached to 4-bar spring maintains sufficient stiffness to protect disturbances. An overlap-area type inductive position sensing system is selected as a measuring transducer, which has high sensitivity, repeatability and linearity. The transducer is composed of coil bundles and ferrite cores which have good electromagnetic characteristics in spite of low cost. The repeatability of the profiler with the proposed inductive sensing system is better than 50nm. Experimental results are shown that the proposed profiler can measure the line or 3D profile of an object with sub-micron features.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2016.11a
• /
• pp.76-92
• /
• 2016

산업이 고도화될수록 높은 품질과 보다 정밀하게 가공된 제품의 안정된 생산이 요구되고 있으며, 그에 대한 표준화된 측정법 및 관리법이 요구되고 있다. 산업체에서 생산되는 다양한 형태의 제품들 중, 마이크로메타 또는 나노메타 수준의 정밀한 가공 및 측정에 있어서, 정확하고 일관성 있게 빠른 시간 안에 제품분석을 수행 할 수 있는 방법은 오래 전부터 활발히 연구되고 있으며, 그 중 광학 기반의 3D-profiler 는 빠른 속도와 간편한 사용으로 많은 인기를 얻고 있다. 이러한 분석법은 광학 현미경의 평면 분해능을 가지고, 나노크기의 물체 높이를 판별하여, 측정된 정보를 3차원 이미지로 형태를 재 구성할 수 있어, 미세한 표면 조도 변화나 나노 수준의 패턴 단차에 대한 정보를 간단하게 얻을 수 있다. 또한 빛의 간섭현상에 기초하여 시료 표면에 대한 정보를 얻기 때문에 원자단위 이하 수준의 측정 해상도를 가지게 된다. 표면의 칼라패턴에 대해서도 2D 평면 정보를 기초로, 다양한 색상의 패턴들에 대해 각각의 색에 따른 정확한 높이 분석 및 그 패턴 분리, 색깔과 매칭되는 3D 이미지 구현 등과 같은 분석이 가능하여, 이를 활용하여 다양한 분야에서 활발히 사용되고 있다. 실제 현장에서 측정된 다양한 3D 이미지를 소개하며, 이를 통해 광학 3D-Profiler에 대한 전반적인 성능 소개와 그 이해를 돕고자 한다.

• Current Optics and Photonics
• /
• v.2 no.2
• /
• pp.172-178
• /
• 2018

We propose a precise 3D endoscopic technique for medical and industrial applications. As the 3D measuring principle, the continuously scanning structured illumination microscopy (CSSIM), which enables to obtain 3D sectional images by the synchronous axial scanning of the target with the lateral scanning of the sinusoidal pattern, is adopted. In order to reduce the size of the probe end, the illumination and detection paths of light are designed as coaxial and a coherent imaging fiber bundle is used for transferring the illumination pattern to the target and vice versa. We constructed and experimentally verified the proposed system with a gauge block specimen. As the result, it was confirmed that the 3D surface profile was successfully measured with $16.1{\mu}m$ repeatability for a gauge block specimen. In order to improve the contrast of the sinusoidal illumination pattern reflected off on the target, we used polarizing optical components and confirmed that the visibility of the pattern was suitable in CSSIM.

• Tribology and Lubricants
• /
• v.40 no.2
• /
• pp.47-53
• /
• 2024

Surface topography plays a decisive role in determining the performance of several precision components. In particular, the surface roughness of semiconductor devices affects the precision of the circuit. In this regard, the surface topography of a given surface needs to be appropriately assessed. Typically, the average roughness is used as one of the main indicators of surface finish quality because it is influenced by both dynamic and static parameters. Owing to the increasing demand for such accurate and reliable surface measurement systems, studies are continuously being conducted to understand the parameters of surface roughness and measure the average roughness with high reliability. However, the differences in the measurement methods of surface roughness are not clearly understood. Hence, in this study, the surface roughness of the back of a silicon wafer was measured using both contact and noncontact methods. Subsequently, a comparative analysis was conducted according to various surface roughness parameters to identify the differences in surface roughness depending on the measurement method. When using a 3D laser confocal microscope, even smaller surface asperities can be measured compared with the use of a 3D profiler. The results are expected to improve the understanding of the surface roughness characteristics of precision components and be used as a useful guideline for selecting the measurement method for surface topography assessment.

• Proceedings of the KSRS Conference
• /
• 2003.11a
• /
• pp.1177-1179
• /
• 2003

Recently, the ground-based laser profiler is used for acquisition of 3D spatial information of a rchaeological objects. However, it is very difficult to measure complicated objects, because of a relatively low-resolution. On the other hand, texture mapping can be a solution to complement the low resolution, and to generate 3D model with higher fidelity. But, a huge cost is required for the construction of textured 3D model, because huge labor is demanded, and the work depends on editor's experiences and skills . Moreover, the accuracy of data would be lost during the editing works. In this research, using the laser profiler and a non-calibrated digital camera, a method is proposed for the automatic generation of 3D model by integrating these data. At first, region segmentation is applied to laser range data to extract geometric features of an object in the laser range data. Various information such as normal vectors of planes, distances from a sensor and a sun-direction are used in this processing. Next, an image segmentation is also applied to the digital camera images, which include the same object. Then, geometrical relations are determined by corresponding the features extracted in the laser range data and digital camera’ images. By projecting digital camera image onto the surface data reconstructed from laser range image, the 3D texture model was generated automatically.

• Journal of the Korean Society of Fisheries and Ocean Technology
• /
• v.46 no.2
• /
• pp.165-172
• /
• 2010

This study was performed to estimate the swimming velocity of Pacific saury (Cololabis saira) migrated offshore Funka Bay of Hokkaido using an acoustic Doppler current profiler (OceanSurveyor, RDI, 153.6kHz) established in T/S Ushio-maru of Hokkaido University, in September 27, 2003. The ADCP's doppler shift revealed as the raw data that the maximum swimming velocity was measured 163.0cm/s, and its horizontal swimming speed and direction were $72.4{\pm}24.1\;cm/s$, $160.1^{\circ}{\pm}22.3^{\circ}$ while the surrounding current speed and direction were $19.6{\pm}8.4\;cm/s$, $328.1^{\circ}{\pm}45.3^{\circ}$. To calculate the actual swimming speed of Pacific saury in each bins, comparisons for each stratified bins must be made between the mean surrounding current velocity vectors, measured for each stratified bin, and its mean swimming velocity vectors, assumed by reference (threshold > -70dB) and 5dB margin among four beams of ADCP. As a result, the actual averaged swimming velocity was 88.6cm/s and the averaged 3-D swimming velocity was 91.3cm/s using the 3-D velocity vector, respectively.

• Proceedings of the KSRS Conference
• /
• 2003.11a
• /
• pp.769-769
• /
• 2003

• The Journal of the Institute of Internet, Broadcasting and Communication
• /
• v.20 no.3
• /
• pp.43-51
• /
• 2020

In this paper, the design of 64 array antennas applied to RWP (Radar Wind Profiler) was described. The design point of the antenna is to ensure isolation between each element and to match the vertical / horizontal radiation pattern. To this end, a single element of the array antenna was proposed as a Bend dipole type, and through simulation, When sequentially sending 5 beams including vertical, the east/west/south/north direction was ±20°, and it was confirmed that no Grating Lobe occurred when steering the beam. The 64 array antenna proposed in this paper was designed with performance equal to or higher than that of overseas products, and was confirmed to be applicable to RWP.