• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• Journal of Welding and Joining
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• v.13 no.2
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• pp.106-114
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• 1995

The characteristics of adhesive bonded joint of steels for automobile were investigated. Shear and tear strength were tested and analyzed for the joints of cold rolled steel sheets bonded with three kinds of epoxy and urethane based adhesive. The results showed that the tensile shear strength and the tear strength of adhesive joint were affected by the shape of adhesive joint such as the length and width of adhesive joint. The thickness of adhesive layer was very important factor affecting the bonding strength. The shear strength increased with decrease of the thickness of adhesive layer, while the tear strength decreased as the thickness of adhesive layer decreased. In comparison with the strength of spot welded joint, the shear strength of adhesive Joint was higher than that of spot welded joint, but the tear strength of adhesive Joint was lower than that of spot welded joint.

• Journal of Welding and Joining
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• v.24 no.5
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• pp.43-48
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• 2006

This paper is concerned with a fracture strength study of composite adhesive lap joints. The tests were carried out on specimen joints manufactured hybrid stacked composites such as the polyester and bamboo natural fiber layer. The main objective of the work was to test the fracture strength using hybrid stacked composites with a polyester and bamboo natural fiber layer. Tensile and peel strength of hybrid stacked composites are tested before appling adhesive bonding. From results, Natural fiber reinforced composites have lower tensile strength than the original polyester. and The load directional orientation and small amount and low thickness of bamboo natural fiber layer have a good effect on the tensile and peel strength of natural fiber reinforced composites. The failure strength of these materials applied adhesive bonding is also affected by fiber orientation and thickness of bamboo natural fiber layer. There for, Fiber orientation of bamboo natural fiber layer have a great effect on the tensile-shear strength of natural fiber reinforced composites including adhesive bonded joints.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.71-74
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• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• Journal of the Society of Disaster Information
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• v.15 no.2
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• pp.259-267
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• 2019

Purpose: In this paper adhesive-bonded cylindrical lap joints are analyzed by assuming that the adherends are elastic and the adhesive is linearly viscoelastic. Method: The distribution of the stresses in the adhensive is evaluated using the Finite Element Method. Nuverical examples for identical and different adherends bonded through a four parameter viscoelastic solid adhesive are illustrated. Results: The stress distribution in the adhesive layer with respect to time is shown. The stress distribution in the adhesive layer with respect to time is shown. The results are also shown that adherend thickness and elastic modulus give effect on the normalized stress. Conclusion: In this study, the stress distribution of the adhesive layer of the wrapped cylindrical body considering the viscoelasticity of the adhesive layer was numerically analyzed by using a four - element elastomer model.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Structural Engineering and Mechanics
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• v.88 no.6
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• pp.609-623
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• 2023

The objective of this study is to investigate the distribution of von Mises stress, peeling stress, and shear stress in the adhesive layer used to bond two composite panels, considering various parameters using a three-dimensional finite element method. The stiffness of the materials and the effect of the stacking order on the amount of load transferred to the adhesive layer were examined to determine which type of laminate generates less stress at the bond line. The study analyzed six different stacking sequences, all with a common first layer in contact with the adhesive and a 0° orientation. Additionally, the impact of using hybrid composites on reducing bond line stress was investigated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.10 s.181
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• pp.2520-2528
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• 2000

Mechanical and physical properties of composite materials make a great difference due to their cure process condition. In order to clarify the effect of cure process condition on the microscopic damage behavior and failure mechanism of Carbon/Epoxy composites, three point bend test has been performed. For this purpose, two kinds of specimens with single adhesive and multiple adhesive layers were prepared. For single adhesive layer, four different types of specimen were used, that is, non-sanding, sanding, cocured, laminated specimens. Three different types of specimen were also used for the multiple adhesive layer, non-sanding, sanding, cocured specimens. Acoustic emission technique has also been employed to monitor the damage progresses associated with each micro-failure mechanism. The characteristics of AE parameters associated with micro-failure mechanism of each specimen were discussed.

• 보존과학연구
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• s.29
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• pp.255-278
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• 2008

Considering the physical quality of the wall body in this study we tried to select a replenishing that is proper for filling the cracked part of the painting wall layer and apply the natural adhesives that have traditionally been used, investigating whether it is possible to substitute those for the chemical adhesive which is used at present time. The result of this study showed the red algae adhesive was, in a weathering environment, as safe as the synthetic resin originated from the polyvinyl acetate which is used generally on the present spot, and it was concluded that although the starch adhesive displayed its superiority in enhancing the strength of the earth mortar and its work disposition, it seemed proper for it to be used as a filling adhesive for the first or midterm layer because it showed a surface hardening phenomenon. And also the glue and fish glue were judged they were not qualified as a filling adhesive due to mold occurring in a environment of high moisture that is a biological problem, showing at same time a weak physical feature in a weathering environment. Therefore it would be possible to use the red algae adhesive or starch one substituting them for the original one sold on the present market, if among natural adhesives the weak points of the them were to be corrected.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.67-71
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• 2005

This paper is concerned with a study on fracture strength of composites in an adhesive single lap joint. The tests were carried out on joint specimens made with hybrid stacked composites consisting of the polyester and bamboo natural fiber layer. The main objective of this work was to evaluate the fracture properties adjacent to adhesive bonded joint of natural fiber reinforced composite specimens. From the results, natural fiber reinforced composites have lower tensile strength than the original polyester. But tensile-shear strength of natural fiber reinforced composites with bamboo layer far from adhesive bond is as high as that of the original polyester adhesive bonded joints. Spew filet at the end of the overlap reduced the stress concentration at the bonded area. Spew fillet and position of bamboo natural fiber layer have a peat effect on the tensile-shear strength of natural fiber reinforced composites including adhesive bonded joints.