• Title/Summary/Keyword: Adhesively bonded structures

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Evaluation Method of Bonded Strength in Adhesively Bonded Structures of the Aluminum Alloys (알루미늄 합금의 접착구조물에 대한 접착강도의 평가방법)

  • 정남용
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.8 no.1
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    • pp.35-44
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    • 1999
  • In a view point of earth environmental protection and social requirement, adhesively bonded structures of aluminum alloys have become to be employed for the purpose of decreasing fuel ratio by weight reduction and to improve performance in various engineering fields such as aircrafts, automobiles, rolling stocks and so on. In spite of such wide applications in adhesively bonded structures of aluminum alloys, the quantitative fracture criterion and evolution method of its bonded strength have not been established yet. The objective of this paper is to establish fracture criterion considering stress singularity at interface edges in adhesively bonded structures of aluminum alloys. Through the analyses of boundary element method and static fracture experiments with three different types of specimens in the adhesively bonded joints of aluminum alloys, its fracture criterion was proposed and discussed about strength evolution of adhesively bonded structures.

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ULTRASONIC DETECTION OF INTERFACE CRACK IN ADHESIVELY BONDED DCB JOINTS

  • Chung, N.-Y.;Park, S.-I.;Lee, M.-D.;Park, C.-H.
    • International Journal of Automotive Technology
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    • v.3 no.4
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    • pp.157-163
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    • 2002
  • It is well recognized that the ultrasonic method is one of the most common and reliable nondestructive testing (NDT) methods for the quantitative estimation of defects in welded structures. However, NDT techniques applying for adhesively bonded joints have not been clearly established yet. In this paper, the detection of interface crack by the ultrasonic method was applied for the measurement of interfacial crack length in the adhesively bonded joints of double-cantilever beam (DCB). An optimal condition of transmission coefficients and experimental accuracy by the ultrasonic method in the adhesively bonded joints have been investigated and discussed. The experimental values are in good agreement with the computed results by boundary element method (BEM) and Ripling's equation.

Detection of Interface Crack Using Ultrasonic Method in Adhesively Bonded Joints (초음파 탐상법을 이용한 접착이음에 대한 계면 균열의 검출)

  • Jeong, Nam-Yong;Park, Seong-Il;Lee, Myeong-Dae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.3
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    • pp.415-423
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    • 2001
  • In is well recognized that the ultrasonic method is one of the most common and reliable nondestructive testing(NDT) methods for the quantitative estimation of defects in welded structures. However, NDT techniques applying for adhesively bonded joints have not been clearly established yet. In this paper, the detection of interface crack by the ultrasonic method was applied for the measurement of interface crack length in the adhesively bonded joints of double-cantilever beam(DCB). The optimum condition of transmission coefficients and experimental accuracy by the ultrasonic method in the adhesively bonded joints have been investigated. The experimental values are in good agreement with the computed results by boundary element method(BEM) and Riplings equation.

Detection of Interface Crack Using Ultrasonic Method in Adhesively Bonded Joints (초음파 탐상법을 이용한 접착이음에 대한 계면균열의 검출)

  • Chung, Nam-Yong;Lee, Myung-Dae;Park, Sung-Il
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.97-102
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    • 2000
  • It is well recognized that the ultrasonic methods is one of the most common and reliable nondestructive testing(NDT) methods for the quantitative estimation of defects in welded structures. However, NDT techniques applying for adhesively bonded joints have not been clearly established yet. In this paper, the detection of interface crack by the ultrasonic method was applied for the measurement of interfacial crack length in the adhesively bonded joints of double-cantilever beam(DCB). The optimum condition of transmission coefficients in the adhesively bonded joints and it's experimental accuracy by the ultrasonic method have been investigated. The experimental values are in good agreement with the computed results by boundary element method(BEM) and Ripling's equation.

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Reliability Monitoring of Adhesive Joints by Piezoelectricity (압전특성을 이용한 접착 조인트의 안전성 모니터링)

  • Kwon, Jae-Wook;Chin, Woo-Seok;Lee, Dai-Gil
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.8
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    • pp.1388-1397
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    • 2003
  • Since the reliability of adhesively bonded joints for composite structures is dependent on many parameters such as the shape and dimensions of joints, type of applied load, and environment, so an accurate estimation of the fatigue life of adhesively bonded joints is seldom possible, which necessitates an in-situ reliability monitoring of the joints during the operation of structures. In this study, a self-sensor method for adhesively bonded joints was devised, in which the adhesive used works as a piezoelectric material to send changing signals depending on the integrity of the joint. From the investigation, it was found that the electric charge increased gradually as cracks initiated and propagated in the adhesive layer, and had its maximum value when the adhesively bonded joint failed. So it is feasible to monitor the integrity of the joint during its lifetime. Finally, a relationship between the piezoelectric property of the adhesive and crack propagation was obtained from the experimental results.

Design Study of Adhesively Bonded Structures

  • Chung, Jae-Ung
    • Korean Journal of Computational Design and Engineering
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    • v.14 no.2
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    • pp.122-128
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    • 2009
  • The failure responses of adhesively bonded, hat stiffened structures are studied through numerical analysis using the finite element method. The responses are evaluated numerically for the bonded hat section/substrate structures containing different combinations of materials. It is studied what kind of material combinations causes the easier crack initiation in the structure. This study is conducted under plane strain conditions and J-integral via a commercial code ABAQUS as a total critical energy release criterion was used for observation on crack initiation. Also, the influence of adhesive on the structure is studied.

A Fracture Mechanics Approach to Adhesively Bonded Joint Using Ultrasonic Signal Analysis (초음파 신호분석을 이용한 접착접합 이음의 파괴역학적 평가)

  • Han, Jun-Young;Oh, Seung-Kyu;Yun, Song-Nam;Lee, Won;Jang, Chul-Sup;Kim, Min-Gun;Kim, Hwan-Tae
    • Journal of Welding and Joining
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    • v.21 no.5
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    • pp.555-560
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    • 2003
  • In automobile industry, it is necessary to reduce the weight from the view point of energy and environmental problems in these days. One of the ways for weight reduction is using adhesive aluminum structures. In this study, ultrasonic signals reflected from the adhesively bonded joint layer are used to evaluate the adhesively bonded joints. FFT is performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint Al 6061 plates in comparison with the measured and theoretical ratios. And the parameters of ultrasonic wave and the J-integral are investigated to evaluate the adhesively bonded joint strength by DCB specimens.

Stress intensity factors in adhesive bonded orthotropic structures (두직교이방성 평판을 접착한 구조물의 응력화대변수)

  • ;;Hong, C. S.
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.5 no.3
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    • pp.217-222
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    • 1981
  • The stress analysis of two-orthotropic layer, adhesively bonded structures is considered. An orthotropic plate has a through-crack of finite length and is adhesively bounded by a sound orthotropic plate. The problem is resuced to a pair of Fredholm integral equations ofthe second kind. Using a numerical integration scheme to evaluate the intgrals, The integral equations are reduced to a system of algebraic equations. By solving these equations some numerical results for stress intensity factors are presented for various crack lengths.

Effect of stacking sequence on thermal stresses in laminated plates with a quasi-square cutout using the complex variable method

  • Chaleshtari, Mohammad H. Bayati;Khoramishad, Hadi
    • Structural Engineering and Mechanics
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    • v.77 no.2
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    • pp.245-259
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    • 2021
  • In this research, the influence of the laminate stacking sequence on thermal stress distribution in symmetric composite plates with a quasi-square cutout subjected to uniform heat flux is examined analytically using the complex variable technique. The analytical solution is obtained based on the thermo-elastic theory and the Lekhnitskii's method. Furthermore, by employing a suitable mapping function, the solution of symmetric laminates containing a circular cutout is extended to the quasi-square cutout. The effect of important parameters including the stacking sequence of laminates, the angular position, the bluntness, the aspect ratio of cutout, the flux angle and the composite material are examined on the thermal stress distribution. It is found out that the circular shape for cutout may not necessarily be the optimum geometry for all stacking sequences. The finite element analysis results are used to validate the analytical solution.

Lock-In Thermography Based NDT of Parts for the Automotive Industry

  • Bohm, Stefan;Hellmanns, Mark;Backes, Andreas;Dilger, Klaus
    • Journal of Adhesion and Interface
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    • v.7 no.4
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    • pp.10-12
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    • 2006
  • The successful use of adhesively bonded parts depends on the defect-free bond of the components. Therefore it is necessary to detect relevant faults and defects in an early state of the production. A 100% test should be pursued, but especially at complicated structures the detection of defects is not easy. Possible testing methods, which show a high potential for the NDT of adhesively bonded parts, are thermography based NDT methods. At present mainly two different procedures of active thermography are being used: Pulse and Lock-In Thermography. With pulse thermography the examined material is warmed up with a short energy pulse (light, eddy current or ultrasonic pulse) and the heat response is recorded after a certain time. The result is an infrared image which indicates material defects in different depths. This paper presents a variety of images showing the capability of Lock-In Thermography to image subsurface defects. Several examples of adhesives joints qualify the ultrasonic Lock-In-Thermography for the in-process quality control for adhesive bonded components.

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