• Title/Summary/Keyword: Al-N barriers

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Numerical Study of Enhanced Performance in InGaN Light-Emitting Diodes with Graded-composition AlGaInN Barriers

  • Kim, Su Jin;Kim, Tae Geun
    • Journal of the Optical Society of Korea
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    • v.17 no.1
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    • pp.16-21
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    • 2013
  • In this paper, we report the effect of GaN/graded-composition AlGaInN/GaN quantum barriers in active regions on the electrical and optical properties of GaN-based vertical light emitting diodes (VLEDs). By modifying the aluminum composition profile within the AlGaInN quantum barrier, we have achieved improvements in the output power and the internal quantum efficiency (IQE) as compared to VLEDs using conventional GaN barriers. The forward voltages at 350 mA were calculated to be 3.5 and 4.0 V for VLEDs with GaN/graded-composition AlGaInN/GaN barriers and GaN barriers, respectively. The light-output power and IQE of VLEDs with GaN/graded-composition AlGaInN/GaN barriers were also increased by 4.3% and 9.51%, respectively, as compared to those with GaN barriers.

Local Investigation and Magnetoresistance Properties of Co-Fe/Al-N/Co-Fe Tunnel Junctions Nitrided by Microwave-excited Plasma (질화법으로 제작한 강자성 터널링 접합의 국소전도 및 자기저항 특성)

  • Yoon Tae Sick;Tsunoda Masakiyo;Takahashi Migaku;Park Bum Chan;Lee Young-Woo;Li Ying;Kim Chong Oh
    • Korean Journal of Materials Research
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    • v.14 no.3
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    • pp.191-195
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    • 2004
  • Tunnel junctions with AI-N barriers fabricated by microwave-excited plasma were studied. When the Al thickness, nitridation time, and annealing temperature were 1 nm (0.8 nm), 50 s (35 s), and $280^{\circ}C$ ($300^{\circ}C$), TMR ratio and resistance-area product (RA) were 49% (34%) and $3 ${\times}$ 10^4$ $\Omega$$\mu\m^2$ ($1.5 ${\times}$ 10^4$ $\Omega$$\mu\m^2$), respectively. In order to clarify the annealing temperature dependence of TMR ratio, the local transport properties were measured for Ta 5 nm/Cu 20 nm/Ta 5 nm$29_{76}$ $Fe_{24}$ 2 nm/Cu 5 nm/M $n_{75}$$Ir_{25}$ 10 nm/ $Co_{71}$ $Co_{29}$ 4nm/Al-N junction with Al thickness of 0.8 nm and nitridation time of 35s at various temperatures. The increase of TMR ratio after annealing at $300^{\circ}C$, where the TMR ratio of the corresponding MTJ had the maximum value of 34%, can be well explained by the enhancement of the average barrier height ($\Phi_{ave}$) and the reduction of its fluctuation. After further annealing at $340^{\circ}C$, the leakage current was observed and the TMR ratio decreaseded

Characteristic analysis of GaN-based Light Emitting Diode(LED) (GaN 기반 발광 다이오드(LED)의 특성 분석)

  • Lee, Jae-Hyun;Yeom, Kee-Soo
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2012.05a
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    • pp.686-689
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    • 2012
  • In this paper, the GaN-based LED characteristics are analyzed using ISE-TCAD. The LED consists of GaN barriers, active region of InGaN quantum well, AlGaN EBL(Electron Blocking Layer) and AlGaN HBL(Hole Blocking Layer) on GaN buffer layer. The output power characteristics of LED considering Auger recombination rate, thickness of quantum well and number of quantum wells are analyzed and some criteria for the design of LED are proposed.

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Thermal Stability of TiN/Ti Barrier Metals with Al Overlayers and Si Substrates Modified under Different Annealing Histories (형성조건에 따른 TiN/Ti Barrier Metal의 Al 및 Si 과의 열적 안정성)

  • 신두식;오재응;유성룡;최진석;백수현;이상인;이정규;이종길
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.30A no.7
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    • pp.47-59
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    • 1993
  • The thermal stability of "stuffed" TiN/Ti barrier matals with different annealing history has been studied to improve the contact reliability of Al/Si contacts in 16M DRAM. The annealing conditions before the Al deposition such as film thickness, the annealing temperature and the annealing ambient have been varied. For TiN(900A)/Ti(300A) annealed at 450 in nitrogen ambient to form a "stuffed barrier" by inducing oxygen atoms into grain boundaries, there is no observation of Al penetrations into Si substrates after the post heat treatment of up to 700 even though there are massive amounts of Al found in TiN film after the post heat treatment of 600 indicating that TiN has a "sponge-like" function due to its ability to absorb several amounts of aluminum at elevated temperature. The TiN/Ti diffusion barrier annealed at 550 has, however, failed after the post heat treatment at 600. The thinner diffusion barriers with TiN(300A)/Ti(100A) failed after the post heat treatment at 600.he post heat treatment at 600.

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Sn2/E2 Branching in Protic Solvents: A Mechanistic Study

  • Oh, Young-Ho;Im, Suk;Park, Sung-Woo;Lee, Sung-Yul;Chi, Dae-Yoon
    • Bulletin of the Korean Chemical Society
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    • v.30 no.7
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    • pp.1535-1538
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    • 2009
  • We present calculations for $S_N$2/E2 reactions in protic solvents (t-butyl alcohol, ethylene glycol). We focus on the role of the hydroxyl (-OH) groups in determining the $S_N$2/E2 rate constants. We predict that the ion pair E2 mechanism is more favorable than the naked ion E2 reaction in ethylene glycol. E2 barriers are calculated to be much larger (~ 9 kcal/mol) than $S_N$2 reaction barriers in protic solvents, in agreement with the experimental observation [Kim, D. W. et al. J. Am. Chem. Soc. 2006, 128, 16394] of no E2 products in the reaction of CsF in t-butyl alcohol.

Magnetic Tunnel Junctions with AlN and AlO Barriers

  • Yoon, Tae-Sick;Yoshimura, Satoru;Tsunoda, Masakiyo;Takahashi, Migaku;Park, Bum-Chan;Lee, Young-Woo;Li, Ying;Kim, Chong-Oh
    • Journal of Magnetics
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    • v.9 no.1
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    • pp.17-22
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    • 2004
  • We studied the magnetotransport properties of tunnel junctions with AlO and AlN barriers fabricated using microwave-excited plasma. The plasma nitridation process provided wider controllability than the plasma oxidization for the formation of MTJs with ultra-thin insulating layer, because of the slow nitriding rate of metal Al layers, comparing with the oxidizing rate of them. High tunnel magnetoresistance (TMR) ratios of 49 and 44% with respective resistance-area product $(R{\times}A) of 3 {\times} 10^4 and 6 {\times} 10^3 {\Omega}{\mu}m^2$ were obtained in the Co-Fe/Al-N/Co-Fe MTJs. We conclude that AlN is a hopeful barrier material to realize MTJs with high TMR ratio and low $R{\times}A$ for high performance MRAM cells. In addition, in order to clarify the annealing temperature dependence of TMR, the local transport properties were measured for Ta $50{\AA} /Cu 200 {\AA}/Ta 50 {\AA}/Ni_{76}Fe_{24} 20 {\AA}/Cu 50 {\AA}/Mn_{75}Ir_{25} 100 {\AA}/Co_{71}Fe_{29} 40 {\AA}/Al-O$ junction with $d_{Al}= 8 {\AA} and P_{O2}{\times}t_{0X}/ = 8.4 {\times} 10^4$ at various temperatures. The current histogram statistically calculated from the electrical current image was well in accord with the fitting result considering the Gaussian distribution and Fowler-Nordheim equation. After annealing at $340^{\circ}C$, where the TMR ratio of the corresponding MTJ had the maximum value of 44%, the average barrier height increased to 1.12 eV and its standard deviation decreased to 0.1 eV. The increase of TMR ratio after annealing could be well explained by the enhancement of the average barrier height and the reduction of its fluctuation.

Fabrication of interface-controlled Josephson junctions using Sr$_2$AlTaO$_6$ insulating layers

  • Kim, Jun-Ho;Choi, Chi-Hong;Sung, Gun-Yong
    • 한국초전도학회:학술대회논문집
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    • v.10
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    • pp.165-168
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    • 2000
  • We fabricated ramp-edge Josephson junctions with barriers formed by interface treatments instead of epitaxially grown barrier layers. A low-dielectric Sr$_2$AlTaO$_6$(SAT) layer was used as an ion-milling mask as well as an insulating layer for the ramp-edge junctions. An ion-milled YBa$_2$Cu$_3$O$_{7-x}$ (YBCO)-edge surface was not exposed to solvent through all fabrication procedures. The barriers were produced by structural modification at the edge of the YBCO base electrode using high energy ion-beam treatment prior to deposition of the YBCO counter electrode. We investigated the effects of high energy ion-beam treatment, annealing, and counter electrode deposition temperature on the characteristics of the interface-controlled Josephson junctions. The junction parameters such as T$_c$, I$_c$c, R$_n$ were measured and discussed in relation to the barrier layer depending on the process parameters.

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Ridge Formation by Dry-Etching of Pd and AlGaN/GaN Superlattice for the Fabrication of GaN Blue Laser Diodes

  • Kim, Jae-Gwan;Lee, Dong-Min;Park, Min-Ju;Hwang, Seong-Ju;Lee, Seong-Nam;Gwak, Jun-Seop;Lee, Ji-Myeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.391-392
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    • 2012
  • In these days, the desire for the precise and tiny displays in mobile application has been increased strongly. Currently, laser displays ranging from large-size laser TV to mobile projectors, are commercially available or due to appear on the market [1]. In order to achieve a mobile projectors, the semiconductor laser diodes should be used as a laser source due to their size and weight. In this presentation, the continuous etch characteristics of Pd and AlGaN/GaN superlattice for the fabrication of blue laser diodes were investigated by using inductively coupled $CHF_3$ and $Cl_2$ -based plasma. The GaN laser diode samples were grown on the sapphire (0001) substrate using a metal organic chemical vapor deposition system. A Si-doped GaN layer was grown on the substrate, followed by growth of LD structures, including the active layers of InGaN/GaN quantum well and barriers layer, as shown in other literature [2], and the palladium was used as a p-type ohmic contact metal. The etch rate of AlGaN/GaN superlattice (2.5/2.5 nm for 100 periods) and n-GaN by using $Cl_2$ (90%)/Ar (10%) and $Cl_2$ (50%)/$CHF_3$ (50%) plasma chemistry, respectively. While when the $Cl_2$/Ar plasma were used, the etch rate of AlGaN/GaN superlattice shows a similar etch rate as that of n-GaN, the $Cl_2/CHF_3$ plasma shows decreased etch rate, compared with that of $Cl_2$/Ar plasma, especially for AlGaN/GaN superlattice. Furthermore, it was also found that the Pd which is deposited on top of the superlattice couldn't be etched with $Cl_2$/Ar plasma. It was indicating that the etching step should be separated into 2 steps for the Pd etching and the superlattice etching, respectively. The etched surface of stacked Pd/superlattice as a result of 2-step etching process including Pd etching ($Cl_2/CHF_3$) and SLs ($Cl_2$/Ar) etching, respectively. EDX results shows that the etched surface is a GaN waveguide free from the Al, indicating the SLs were fully removed by etching. Furthermore, the optical and electrical properties will be also investigated in this presentation. In summary, Pd/AlGaN/GaN SLs were successfully etched exploiting noble 2-step etching processes.

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Attitudes Towards Colorectal Cancer (CRC) and CRC Screening Tests among Elderly Malay Patients

  • Al-Naggar, Redhwan A.;Al-Kubaisy, Waqar;Yap, Bee W.;Bobryshev, Yuri V.;Osman, Muhamed T.
    • Asian Pacific Journal of Cancer Prevention
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    • v.16 no.2
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    • pp.667-674
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    • 2015
  • Background: Colorectal cancer (CRC) is the third most common malignancy in Malaysia, where data are limited regarding knowledge and barriers in regard to CRC and screening tests. The aim of the study was to assess these parameters among Malaysians. Materials and Methods: The questionnaires were distributed in the Umra Private Hospital in Selangor. The questionnaire had four parts and covered social-demographic questions, respondent knowledge about CRC and colorectal tests, attitude towards CRC and respondentaction regarding CRC. More than half of Malay participants (total n=187) were female (57.2%) and 36.9% of them were working as professionals. Results: The majority of the participants (93.6%) never had a CRC screening test. The study found that only 10.2% of the study participants did not consider that their chances of getting CRC were high. A high percentage of the participants (43.3%) believed that they would have good chance of survival if the cancer would be found early. About one third of the respondents did not want to do screening because of fear of cancer, and concerns of embarrassment during the procedure adversely affected attitude to CRC screening as well. Age, gender, income, family history of CRC, vegetable intake and physical activity were found to be significant determinants of knowledge on CRC. Conclusions: The major barriers identified towards CRC screening identified in our study were fear of pain and embarrassment. The findings have implications for understanding of similarities and differences in attitude to CRC amongst elderly patients in other cultural/geographic regions.