• Title/Summary/Keyword: Anedie dissolution medel

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Effect of Sn Addition on the SCC Properties of Al-Cu-Mn Cast Alloy (Al-Cu-Mn 주조합금의 SCC 특성에 미치는 Sn 첨가의 영향)

  • Kim, Kwang-Nyeon;Kim, Kyung-Hyun;Kim, In-Bae
    • Korean Journal of Materials Research
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    • v.12 no.6
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    • pp.436-441
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    • 2002
  • Effect of Sn addition on the stress corrosion cracking(SCC) resistance of the Al-Cu-Mn cast alley was investigated by C-ring teat and electrical conductivity measurement, The electrical conductivity and SCC resistance increased by Sn addition. The alley containing 0,10%Sn showed maximum electrical conductivity and the best SCC resistance. At the same composition, the electrical conductivity and SCC resistance increased from peak aged condition to ever aged condition. The PFZ and coarse precipitates along the grain boundary were observed from TEM micrographs. The fracture mode of the alloy was confirmed as intergranular type and showed brittle fracture surface. The SCC mechanism of the alloy was concluded as the anodic dissolution model, The maximum hardness was increased from 130Hv in the Sn-free alloy to 156Hv in the 0.10%Sn added alloy.