• Proceedings of the KSME Conference
• /
• 2004.11a
• /
• pp.1134-1139
• /
• 2004

Recently, development of flame control scheme has been hot issues in the combustion engineering. It has been held that flame shape can be controllable by pressure inside combustor. The influence of combustor atmospheric pressure on flame shape was investigated in the present study. The flame shape, flammable limit, flame temperature and nitric oxide emission were measured as functions of combustor atmospheric pressure and equivalence ratio. The reaction region became longer and wider with decreasing combustor atmospheric pressure by direct photography, hence reduction of blow off limit. This tendency was also observed in the mean flame temperature distribution. Nitric oxide emission decreased with decreasing combustor atmospheric pressure. Low NOx combustion is ascribed to wide-spread reaction region in the low atmospheric pressure condition. These results demonstrate that flame shape and nitric oxide emission can be controllable with combustor atmospheric pressure.

• 유체기계공업학회:학술대회논문집
• /
• 2002.12a
• /
• pp.363-369
• /
• 2002

Orifice meter is the most widely used flowmeter in custody transfer between KOGAS and city gas companies. Absolute pressure value is needed to calculate the gas flow of orifice metering system, but the gauge pressure transmitters are mainly used in the field. In case that the gauge pressure transmitters are used, the fixed value as standard atmospheric pressure(101.325kPa) is applied for the absolute pressure value. The real, local atmospheric pressures of each metering station are different from the standard condition as the altitude and weather conditions. In this study the flow calculation errors were quantitatively analyzed through examining the atmospheric pressures of 50 stations of KOGAS. The data for analysis are such like the time data of supplied gas amount, the altitude of each metering station, the time data of atmospheric pressures and altitudes of each weather observatory. The results showed that the local atmospheric pressures were different from the standard value and the gas flow calculation errors were distributed between $-0.024\%{\~}0.025\%$ based on the supplied gas amount in the year 1999 and 2000.

• Current Applied Physics
• /
• v.18 no.11
• /
• pp.1375-1380
• /
• 2018

Atmospheric-pressure plasma has a great potential in many applications due to its simplicity rather than low pressure plasmas. In material processing, biomedical applications, and many other applications, the input power, gas flow rate, and the geometry of electrode have been mainly considered and studied as important external parameters of atmospheric-pressure plasma control. Besides, since the atmospheric-pressure plasmas are typically generated in an open air, the relative humidity is difficult to control and can change day by day. Therefore, the relative humidity cannot be ignored for plasmas. Thus, in this work, the atmospheric-pressure plasma jet was characterized by changing relative humidity, and it was found that the increase in electron density and OH radicals are due to Penning ionization between helium metastable and water vapors at higher humidity condition.

• Journal of The Korean Association For Science Education
• /
• v.17 no.3
• /
• pp.239-249
• /
• 1997

Primary students' conceptions on the atmospheric pressure and its related concepts were investigated. Samples consisted of 41 5th grade and 43 6th grade primary school students. Two types of research methods were used: 1) the open-ended written questionnare;2) paper-pencil test. Naive theories on the atmospheric pressure and its related concepts were numerous. For example, 80% students thought that as we go higher into the atmosphere, the atmospheric pressure becomes greater. Also, 50% students thought that the hot air had greater the atmospheric pressure than the cold air. This study was also discussed the teaching strategies to overcome these naive theories on the atmospheric pressure and its related concepts.

• The Journal of the Korean dental association
• /
• v.52 no.12
• /
• pp.783-794
• /
• 2014

Since the introduction of non-thermal atmospheric pressure plasma in the field of the dentistry, numerous applications have been investigated. Especially with its advantages over existing vacuum plasma in terms of portability, low cost, and non-thermal damage, it can be directly applied in the oral cavity, giving number of potentials for dental application. First, possible application of non-thermal atmospheric pressure plasma in the field of dentistry is relation to dental caries and periodontal diseases. Teeth and alveolar bones are one of the strongest bony structures in our body, but it cannot be regenerated when they are damaged by dental caries or periodontal disease. Hence many studies to prevent such diseases have been carried out, though no perfect solution has been found yet. With recent studies of modifying surfaces through non-thermal atmospheric pressure application that can prevent attachment of bacteria, or studies on bactericidal effects of non-thermal atmospheric pressure plasma can be applied here to prevent oral pathogen and 'biofilm' attachment to the surface of teeth or directly eliminate the dental caries/periodontal disease causing germs. Secondly, non-thermal atmospheric pressure application will be useful on the surface of dental implant. It is well known that the success of dental implant surgery depends on the process known as 'osseointegration' that result from osteoblast attachment, proliferation and differentiation. As the application of non-thermal atmospheric pressure plasma on the surface of dental implant just before its introduction by the chair-side of dental surgery. Despite its long history, the generation of non-thermal atmospheric pressure plasma has been greatly increased with its application in dentistry.

• Tribology and Lubricants
• /
• v.35 no.6
• /
• pp.389-395
• /
• 2019

In various industries, thin film coatings are used to improve friction and wear characteristics. Various types of tribotesters are used to evaluate the friction and wear characteristics of such thin film coatings. In this study, we fabricated a micro-tribotester and Tribo-scanning electron microscopy (SEM) to compare the friction and wear characteristics of copper (Cu) coatings under an atmospheric pressure and a vacuum condition, respectively. The reliability of the different types of tribotesters was evaluated by performing calibrations for the sensor to measure the friction forces and normal loads. Using the two different types of devices, the friction and wear tests are conducted at the same experimental conditions excluding environment conditions such as the atmospheric pressure and vacuum condition. The friction coefficient at the vacuum condition is lower than at the atmospheric pressure. This difference in friction characteristics is due to the fact that wear phenomena occur differently according to the atmospheric pressure and vacuum condition. At the atmospheric pressure, the abrasive wear is the main wear mechanism. At the vacuum condition, the adhesive wear is the main wear mechanism. The reason for the difference in the wear mechanism of the Cu coating at the atmospheric pressure and the vacuum condition is that the oxidation phenomenon, which does not appear at the vacuum condition, occurs at the atmospheric pressure; therefore, the characteristics of the Cu coating change accordingly.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.357-357
• /
• 2012

The doping process of the solar cell has been used by furnace or laser. But these equipment are so expensive as well as those need high maintenance costs and production costs. The atmospheric pressure plasma doping process can enable to the cost reduction. Moreover the atmospheric pressure plasma can do the selective doping, this means is that the atmospheric pressure plasma regulates the junction depth and doping concentration. In this study, we analysis the atmospheric pressure plasma doping compared to the conventional furnace doping. the single crystal silicon wafer doped with dopant forms a P-N junction by using the atmospheric pressure plasma. We use a P type wafer and it is doped by controlling the plasma process time and concentration of dopant and plasma intensity. We measure the wafer's doping concentration and depth by using Secondary Ion Mass Spectrometry (SIMS), and we use the Hall measurement because of investigating the carrier concentration and sheet resistance. We also analysis the composed element of the surface structure by using X-ray photoelectron spectroscopy (XPS), and we confirm the structure of the doped section by using Scanning electron microscope (SEM), we also generally grasp the carrier life time through using microwave detected photoconductive decay (u-PCD). As the result of experiment, we confirm that the electrical character of the atmospheric pressure plasma doping is similar with the electrical character of the conventional furnace doping.

• Journal of the Semiconductor & Display Technology
• /
• v.8 no.2
• /
• pp.15-21
• /
• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.53-59
• /
• 2009

Low pressure mercury lamp type UV equipments have been widely used for cleaning and modification of PCB surfaces. To enhance the productivity of the process, we newly developed remote DBD type atmospheric pressure plasma equipment. The productivity of both equipments could be compared by measuring surface contact angle for various transferring speed. By the result of the measurement, we could verify that the productivity of the atmospheric pressure plasma be superior to the productivity of the UV equipment. XPS experiments confirmed that the surface effect of the UV and atmospheric pressure plasma processing are similar for each other. Organic contamination level was reduced after the processing and some surface elements were oxidized for both cases. Finally, the atmospheric pressure plasma equipment was adapted to flip chip BGA's flux printing process and it was concluded that the printing uniformity be enhanced by the atmospheric pressure plasma surface treatment.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.08a
• /
• pp.151-151
• /
• 2011

Atmospheric-pressure plasmas are used in a variety of materials processes. The lifetime of most atmospheric-pressure plasma sources is limits by electrode erosion due to energetic ion bombardment. These drawbacks were solved recently by several microplasma sources based on microstrip structure, which are more efficient and less prone to perturbations than other microplasma sources. In this work, we propose microplasma sources based on strip line and microstrip line, developed for the generation of microplasmas even in atmospheric air and analyzes these systems with microwave field simulation via comparative study with two previous microwave sources (Microstrip Spit Ring Resonator (MSRR), Microstrip Structure Source (MSS)).