• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.483-484
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• 2008

• 한국전자현미경학회:학술대회논문집
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• 2007.05a
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• pp.21-23
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• 2007

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1807-1812
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• 2014

A plastic has a various advantages in engineering elements that it can be formed a curve surface without restriction of shape and product the high volume with various color and lower price. Also, it is being used for many parts of automobile as the weight of cars is getting lighter. The Door A-Fuel Filler is a automobile plastic part by injection molding production. The injected products are involved a lot of factors for the inferior goods after painting. Therefore the painted products are required to have the process of the polishing in order to eliminate the faults. Now polishing process is being worked by hands. The workers tend to evade the process of polishing because the working needs a lot of powers momentarily. This paper presents the development of auto-polishing system that can check the inferior goods by the vision system and control the polishing process by the motion system. As a result, Shorten production time (30 seconds), and decreases by 1 person to work to increase the competitiveness of the production cost was to expect improvement.

• 발명특허
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• v.29 no.5 s.335
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• pp.32-37
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• 2004

• Journal of Digital Contents Society
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• v.3 no.1
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• pp.113-122
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• 2002

The flatness of a silicon wafer concerned with ULSI chip is one of the most critical parameters ensuring high yield of wafers. The polishing process that measures and controls the flatness of a silicon wafer is one of the important process in various processes for production silicon wafer, which are still being done today by manual. But engineers in polishing process are requested to have many experiences and to check silicon wafers one by one. In this paper, we propose an algorithm used interpolation that estimates wafer's shape and sorts wafers automatically, then we can control the flatness of wafers in polishing process by automatic system.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.11
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• pp.168-173
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• 2001

The chemical mechanical polishing (CMP) is generally consisted of pad, slurry including abrasives and so on. However, there are some problems in a general CMP: defects, a high Cost of Consumable (CoC), an environmental problem. The slurry including abrasives especially gives rise to not only increase a CoC, but also prohibition from achieving an eco-process. This paper introduces an abrasive capsulation pad to achieve an eco-process decreasing abrasives used is CMP. The binder wth a water a water swelling and a water soluble characteristic is used for an auto-conditioning, and the $CeO_2$abrasive is selected for an abrasive capsulation pad. Comparing with a conventional CMP, an abrasive capsulation pad appears good characteristics in ILD CMP and is able to achieve an eco-process decreasing wasted slurry.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.4
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• pp.719-741
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• 1997

This study was undertaken to compare by Atomic Force Microscope the effects of various finishing and polishing instruments on surface roughness of filling and veneering composite resins. Seven composite resins were studied : Silux Plus (3M Dental Products, U.S.A.), Charisma (Heraeus Kulzer, Germany), Prisma THP (L.D.Caulk, Dentsply, U.S.A.), Photoclearfil (Kuraray, Japan), Cesead (Kuraray, Japan), Thermoresin LC (GC, Japan), Artglass (Heraeus Kulzer, Germany). Samples were placed and polymerized in holes (2mm thick and 8.5mm in diameter) machined in Teflon mold under glass plate, ensuring excess of material and moulded to shape with polyester matrix strip. Except control group (Polyester matrix strip), all experimental groups were finished and polishied under manufacturer's instructions. The finishing and polishing procedure were : carbide bur (E.T carbide set 4159, Komet, Germany), diamond bur (composite resin polishing bur set, GC, Japan), aluminum-oxide disc (Sof-Lex Pop-On, 3M Dental Products, U.S.A.), diamond-particle disc (Dia-Finish, Renfert Germany), white stone bur & rubber point( composite finishing kit, EDENTA, Swiss), respectively. Each specimens were evaluated for the surface roughness with Atomic Force Microscope (AutoProbe CP, Park Scientific Instruments, U.S.A.) under contact mode and constant height mode. The results as follows : 1. Except Thermoresin LC, all experimental composite resin groups showed more rougher than control group after finishing and polishing(p<0.1). 2. A surface as smooth as control group was obtained by $Al_{2}O_{3}$ disc all filling composite resin groups except Charisma and all veneering composite resin groups except Thermoresin LC(p<0.05). 3. In case of Thermoresin LC, there were no statistically significant differences before and after finishing and polishing(p>0.1). 4. Carbide bur, diamond bur showed rough surfaces in all composite resin groups, so these were inappropriate for the final polishing instruments.

• The Journal of Korean Academy of Prosthodontics
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• v.41 no.1
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• pp.1-19
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• 2003

The surface of metals should be as smooth as possible for optimum comfort, oral hygiene, low plaque retention, and resistance to corrosion. In this study five specimens of each precious metal(type III gold alloy, ceramic gold alloy, and Ag-Pd alloy) were divided into five groups according to finishing and polishing procedures : group 1(sandblaster), group 2(group 1+stone), group 3(group 2+brown rubber), group 4(group 3+green rubber), and group 5(group 4+rouge). Six specimens of each non-precious metal(Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy) were divided into six groups: group 1(sandblaster), group 2(group 1+hard stone), group 3(group 2+electrolytic polisher), group 4(group 3+brown hard rubber point), group 5(group 4+green hard rubber point), and group 6(group 5+rouge). Considering factors affecting the rate of abrasion, the same dentist applied each finishing and polishing procedure. In addition, the surface roughness of enamel, resin, and porcelain was evaluated. The effect of finishing and polishing procedures on surface roughness of precious and non-precious metals, enamel, resin, and porcelain was evaluated by means of Atomic Force Microscope(AutoProbe CP. Park Scientific Instruments, U.S.A.) that can image the three dimensional surface profile and measure average surface roughness values of each sample at the same time. The obtained results were as follows : 1. According to finishing and polishing procedures, the surface roughness of type III gold alloy, ceramic gold alloy, and Ag-Pd alloy was decreased in the order of group 1, 2, 3, 4, and 5 (P<0.01). 2. According to finishing and polishing procedures. the surface roughness of Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy was decreased in the order of group 1, 2, 3, 4, 5, and 6 (p<0.01). 3. There was not statistically significant difference in the surface roughness among three metals of precious metals in group 1 but was significant difference in group 2, 3, 4, and 5 (P<0.05). 4. There was not statistically significant difference in the surface roughness among three metals of non-precious metals in all groups. 5. When the surface roughness of the smoothest surface of each metal, enamel. porcelain, and resin was compared, porcelain was the smoothest and the surface roughness was decreased in the order of Ni-Cr alloy. Co-Cr alloy. Co-Cr-Ti alloy, resin. Ag-Pd alloy, ceramic gold alloy type III gold alloy, and enamel (P<0.01). The results of this study indicate that the finishing and polishing procedures should be carried out in a logical, systematic sequence of steps and the harder non-precious metals may be less resistance to abrasion than are the softer precious metals.

• Journal of Power System Engineering
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• v.14 no.1
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• pp.22-26
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• 2010

Generally, it is a method to remove the fouling cleaning the plate heat exchanger with chemicals or polishing with a brush or cloth after stopping the equipment and disassembling heat exchanger. However, the equipment must be stopped and taken apart when using this method, which causes an unnecessary work to assemble again after cleaning it. In this study, it has developed and tested the equipment which can automatically clean the fouling on plate heat exchanger at regular intervals with air bubbles. It indicated that the overall heat transfer coefficient had decreased without significant differences similar to that calculated without air bubbles until after 72 hours when making air bubbles to remove fouling ingredient on the surface of heat transfer area every 10 minutes per 2 hours. However, it showed that there was a 10% higher of heat transfer effect compared to the case without air bubbles of after 192 hours.

• Journal of the Korean Society of Industry Convergence
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• v.7 no.3
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• pp.259-263
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• 2004

In the manufacture progress of LCD or semiconductor, there are used many kinds of gas like erosion gas, dilution gas, toxic gas as a progress which used these gas there are required high puritize to increase accumulation rate of semiconductor or LCD materials work progress of semiconductor or LCD it demand many things like the material which could minimize metallic dust that could be occured by reaction between gas and transfer pipe laying material, illumination of the surface, emition of the gas, metal liquation, welding etc also demand quality geting stricted. Material-Low-sulfur-contend (0.007-0010), vacuum-arc-remelt(VAR), seamless, high-purity tubing material is recommend for enhance welding lower surface defect density All wetted stainless steel surface must be 316LSS elecrto polishinged with ${\leq}0.254{\mu}m$($10.0{\mu}in$) Ra average surface finish, $Cr/Fe{\geq}1.1$ and $Cr_2O_3$ thickness ${\geq}25{\AA}$ From the AES analytical the oxide layer thickness (23.5~36 angstroms silicon dioxide equivalent) and chromum to iron ratios is similar to those generally found on electropolished stainless steel., molybdenum and silicon contaminants ; elements characteristic of stainless steel (iron, nickel and chromium); and oxygen were found on the surface Phosphorus and nitrogen are common contaminants from the electropolish and passivation steps.