• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.7
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• pp.555-558
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• 2009

This paper presents a step-down converter IC for automotive applications. This device was designed for a 40 V/1 A high-power output for voltage reference of automotive IC. It provides 250kHz PWM (pulse width modulation) and PFM(pulse frequency modulation) according to load conditions. This device was simulated spectre of IC-design-tools and fabricated Dong-bu Hitec 0.35um BD350BA process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.83-84
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• 2009

This paper presents a step-down converter IC for automotive applications. This device was designed for a 40V/1A high-power output for voltage reference of automotive IC. It provides 250kHz PWM(pulse width modulation) and PFM(pulse frequency modulation) according to load conditions. This device was simulated Spectre of IC Design Tool And fabricated Dong-bu Hitec 0.35um BD350BA process.

• Journal of Power Electronics
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• v.17 no.5
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• pp.1372-1381
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• 2017

This paper presents a high-side switch driver IC capable of improving the current sensing accuracy and providing reverse battery protection. Power semiconductor switches used to replace relay switches are encumbered by two disadvantages: they are prone to current sensing errors and they require additional external protection circuits for reverse battery protection. The proposed IC integrates a gate driver and current sensing blocks, thus compensating for these two disadvantages with a single IC. A p-sub-based 90-V $0.13-{\mu}m$ bipolar-CMOS-DMOS (BCD) process is used for the design and fabrication of the proposed IC. The current sensing accuracy (error ${\leq}{\pm}5%$ in the range of 0.1 A-6.5 A) and the reverse battery protection features of the proposed IC were experimentally tested and verified.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.7
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• pp.563-566
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• 2009

This paper presents a motor drive IC for automotive applications. The drive IC is dedicated to control and drive external MOSFETs which directly drive 3-phase motor with a high current. In case of driving high-side power switches, the bootstrap topology is widely used. however, it requires three bootstrap diode and three capacitor respectively. And it needs a minimum charging time to maintain high-side voltage. The motor drive IC uses a charge-pump circuit for all three high-side voltage with various protection schemes for automotive applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.41-42
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• 2009

This paper presents a motor drive IC for automotive applications. The drive IC is dedicated to control and drive external MOSFETs which directly drive 3-phase motor with a high current. In case of driving high-side power switches, the bootstrap topology is widely used. However, it requires three bootstrap diode and three capacitor respectively. And it needs a minimum charging time to maintain high-side voltage. The motor drive IC uses a charge-pump circuit for all three high-side voltage with various protection schemes for automotive applications.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• Proceedings of the KIEE Conference
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• 2001.04a
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• pp.247-249
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• 2001

In our research, we designed a small step motor with 2-phase structure and a micro step driving IC, which is used in an automotive instrument. The step motor for the automotive instrument has the better advantages than a cross coil type motor. These advantages are the characteristics with a good linearity, a fine accuracy, a low noise and so on.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.8
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• pp.38-48
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• 2014

In this paper, a design of Signal Processing Analog Front-End IC for Automotive Piezo-Resistive Type Pressure Sensor is presented. In modern society, as the car turns to go from mechanical to electronic technology, the accuracy and reliability of electronic parts required importantly. In order to improve these points, Programmable Gain Amplifier (PGA) amplifies the received signal in accordance with gain for increasing the accuracy after PRT Sensor is operated to change physical pressure signals to electrical signals. The signal amplified from PGA is processed by Digital blocks like ADC, CMC and DAC. After going through this process, it is possible to determine the electrical signal to physical pressure signal. As processing analog signal to digital signal, reliability and accuracy in Analog Front-End IC is increased. The current consumption of IC is 5.32mA. The die area of the fabricated IC is $1.94mm{\times}1.94mm$.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.5
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• pp.1-7
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• 2013

The present paper relates to a development of the Gear Detection Sensor for automotive manual transmission. To detect air gap from control finger to detecting zone of sensor based on non-contacted method, permanent magnet and linear type Hall IC are mounted in this sensor. Control finger is machined to 3 step heights to detect 3 gear stages such as In-Gear, Normal and Rear. After conducting actual experimentation based on exclusive Jig and FEM, it is described to consider possibility for automotive application of Gear Detection Sensor.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.609-610
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• 2006

A 77GHz MMIC transceiver module consisting of a power amplifier, a low noise amplifier, a drive amplifier, a frequency doubler and a down-mixer has been developed for automotive forward-looking radar sensor. The MMIC chip set was fabricated using $0.15{\mu}m$ gate-length InGaAs/InAlAs/GaAs mHEMT process based on 4-inch substrate. The power amplifier demonstrated a measured small signal gain of over 20dB from $76{\sim}77GHz$ with 15.5dBm output power. The chip size is $2mm{\times}2mm$. The low noise amplifier achieved a gain of 20dB in a band between $76{\sim}77\;GHz$ with an output power of 10dBm. The chip size is $2.2mm{\times}2mm$. The driver amplifier exhibited a gain of 23dB over a $76{\sim}77\;GHz$ band with an output power of 13dBm. The chip size is $2.1mm{\times}2mm$. The frequency doubler achieved an output power of -16dBm at 76.5GHz with a conversion gain of -16dB for an input power of 10dBm and a 38.25GHz input frequency. The chip size is $1.2mm{\times}1.2mm$. The down-mixer demonstrated a measured conversion gain of over -9dB. The chip size is $1.3mm{\times}1.9mm$. The transceiver module achieved an output power of 10dBm in a band between $76{\sim}77GHz$ with a receiver P1dB of -28dBm. The module size is $8{\times}9.5{\times}2.4mm^3$. This MMIC transceiver module is suitable for the 77GHz automotive radar systems and related applications in W-band.