• KSII Transactions on Internet and Information Systems (TIIS)
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• v.17 no.2
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• pp.663-677
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• 2023

As the paradigm of future vehicles changes, the interest in automotive semiconductor, which plays a key role in realizing this, is increasing. Automotive semiconductors are the technology with very high entry barriers that require a lot of effort and time because it must secure technology readiness level and also consider safety and reliability. In this technology field, it is very important to develop new businesses and create opportunities through technology trend analysis. However, systematic analysis and application of automotive semiconductor technology trends are currently lacking. In this paper, U.S. registered patent documents related to automotive semiconductor were collected and investigated based on the patent's IPC. The main technology of automotive semiconductor was analyzed through topic modeling, and the technology path such as emerging technology was investigated through cosine similarity. We identified that those emerging technologies such as driving control for vehicle and AI service appeared. We observed that as time passed, both convergence and independence of automotive semiconductor technology proceeded simultaneously.

• Journal of KIISE
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• v.41 no.9
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• pp.625-632
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• 2014

With the trend of increasing needs for high-technology from customer and tightening regulation on automotive fuel efficiency and safety, application of E/E system has been expanding consistently in automotive industry. Thus, demand for core elements of E/E system has been growing: micro controller, analog IC and ASIC. But, development process of automotive semiconductor hasn't been clearly established in domestic area. This research aims to present a guide and an example for construction of requirement and design development process on semiconductor based on ISO/TS 16949 that is requirement for quality management system, CMMI that has been proven in various area and ISO 26262 widely used methodology for functional safety. It is expected that the result of this research is used as guidance for construction of semiconductor development process.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.127-132
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• 2019

This paper presents an overview of automotive communication technologies, including related technology developments. We describe the latency of Audio Video Bridge (AVB) network as well as purpose the optimized design of the Ethernet network system for automotive. Our design plays a significant role in reducing the delay between components. The proposed approach on realistic test cases showed that there was a delay reduction, approximately 49.4%. It is expected that the optimization method for the actual automotive environment can greatly shorten the time period in the design and development process. The results obtained from the experiments on the delay time present in each function are reliable because average values are obtained through repeated actual tests for several months. It will greatly benefit the industry since analyzing the latency between each function in a short period of time is very important.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.71-77
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• 2017

As the automobile industry has shifted to software, the Automotive SPICE standard has been established to ensure efficient product development process and quality. In the assessment model, the HIS Scope is the minimum standard for small and medium automotive electric companies to meet OEM requirements. However, in order to achieve the HIS Scope, the output of each process stage that meets the verification criteria of Automotive SPICE must be created. In particular, the test phase takes a lot of resources, which is a big burden for small and medium-sized companies. In this paper, we propose a methodology for creating test cases of software integration test phase based on UML sequence diagram, which is a software design phase of Automotive SPICE HIS Scope, by applying behavior model based testing method. We also propose a tool chain for automating the creation process. This will reduce the resources required to create a test case.

• Journal of Korea Technology Innovation Society
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• v.21 no.3
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• pp.1155-1178
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• 2018

Future automobiles are evolving into movable living spaces capable of eco-friendly autonomous driving. The role of electrically processing, controlling, and commanding various information in the vehicle is essential. It is expected that the automotive semiconductor will play a key role in the future automobile such as self-driving and eco-friendly automobile. In order to foster the automotive semiconductor industry, it is necessary to grasp technology trends and to acquire technology and quality that reflects the requirements in advance, thereby achieving technological innovation with industrial competitiveness. However, there is a lack of systematic analysis of technology trends to date. In this study, we analyzed the technology trends of automotive semiconductors using patent analysis and topic model, and confirmed technologies such as electric cars, driving assistance, and digital manufacturing. The technology trends showed that element technology and technical characteristics change according to technology convergence, market needs, and government regulations. Through this research, it is expected that it will help to make R&D policy for automotive semiconductor industry and to make decision for industrial technology strategy establishment. In addition, it is expected that it will be used effectively in detail research direction and patent strategy establishment by providing detailed classification of technology and trend analysis result of technology.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.35-39
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• 2013

A four point bending apparatus has been developed to measure semiconductor sensor piezoresistance inside a four inch probe station. The apparatus has a footprint of $60{\times}83mm^2$ and can apply $10{\mu}m$ displacements using a vertical micrometer stage. We used finite element analysis to predict and improve the accuracy of the instrument. Finally strain gauge attached on a silicon test piece was used to experimentally verify the setup.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.05a
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• pp.783-785
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• 2015

Automotive Semiconductor revenue grew 3.9% in 2013 to $26.7 billion, driven by strength in LED lighting, ASSPs and analog ICs. Renesas Electronics held onto the No.1 spot despite a revenue decline, while Freescale Semiconductor, NXP, Texas Instruments and Robert Bosch made strong gains. Global Semiconductor manufacturers are paying attention to the Korean auto market, which reflects the reality of the local auto industry. The local industry has a long way go in the automotive semiconductor sector, even though it has grown to become the six-largest in the world. The reason for global semiconductors companies' interest in the local market lies in the fact that are the use of semiconductors in cars is on the rise, since smart and eco-friendly cars are becoming popular.

• Transactions on Electrical and Electronic Materials
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• v.11 no.4
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• pp.178-181
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• 2010

An automotive IC voltage regulator which consists of one-chip based on a metal-oxide semiconductor field effect transistor (MOSFET) is investigated experimentally with three types of packaging. The closed type is filled with thermal silicone gel and covered with a plastic lid on the MOSFET. The half-closed type is covered with a plastic case but without thermal silicone gel on the MOSFET. Opened type is no lid without thermal silicone gel. In order to simulate the high temperature condition in engine bay, the operating circuit of the MOSFET is constructed and the surrounding temperature is maintained at $100^{\circ}C$. In the overshoot the maximum was mainly found at the half-closed packaging and the magnitude is dependent on the packaging type and the surrounding temperature. Also the impressed current decreased exponentially during the MOSFET operation.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.33-38
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• 2012

The wafer positioning robot in the semiconductor industry is required to operate at high speed for the improvement of productivity. The residual vibration caused by the high speed of the wafer positioning robot, however, makes the life of the robot shorter and the cycle time longer. In this study, the input shaping and the path of the system are designed for the reduction of the residual vibration and the improvement of the cycle time. The followings are the process for the reduction and the improvement; 1) System modeling of the wafer positioning robot, 2) Verification of dynamic characteristics of the wafer positioning robot, 3) Input shaping plan using impulse response reiteration, 4) Simulation test using SIMULINK program, 5) Analysis of result.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3319-3325
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• 2012

This paper describes the development of the TrackSim, which is a discrete event simulation tool for photolithography equipment of semiconductor industry. The TrackSim is focused on the accurate simulation model of the photolithography equipment and easy-to-use user interfaces. TrackSim provides 3D simulation environment for evaluating, validating, and scheduling the photolithography process. One of the major characteristics of TrackSim is in that it is developed based on Applied Materials' AutoMod, a discrete event simulation software broadly used in semiconductor industry. Accordingly, the photolithography model of TrackSim can be used to perform simulation connected with other simulation models built with AutoMod.